초록 ▼

A high-velocity low-pressure cooling system (100), especially suited for data center applications, includes an air coolant loop (102), a non-air coolant loop (104) and a cooler unit (126) for heat transfer between the loops (102 and 104). The air loop (102) is used to chill ambient air that is blown

A high-velocity low-pressure cooling system (100), especially suited for data center applications, includes an air coolant loop (102), a non-air coolant loop (104) and a cooler unit (126) for heat transfer between the loops (102 and 104). The air loop (102) is used to chill ambient air that is blown across heat transfer surfaces of equipment mounted in data center racks (110). In this manner, effective cooling is provided using a coolant that is benign in data center environments.

대표청구항 ▼

1. A method for use in cooling electronic equipment in a rack, comprising: providing a first closed-loop coolant circuit that extends external to said rack;flowing air through the first closed-loop coolant circuit such that the air functions as a coolant fluid;exchanging heat between said first clos

1. A method for use in cooling electronic equipment in a rack, comprising: providing a first closed-loop coolant circuit that extends external to said rack;flowing air through the first closed-loop coolant circuit such that the air functions as a coolant fluid;exchanging heat between said first closed-loop coolant circuit and ambient air external to said first closed-loop coolant circuit so as to cool the ambient air; andflowing the cooled ambient air across a first heat transfer surface of electronic equipment in said rack. 2. A method as set forth in claim 1, further comprising the steps of providing a second closed-loop coolant circuit having a coolant fluid different than that of the first circuit and exchanging heat as between the first and second circuits. 3. A method as set forth in claim 1, wherein said step of exchanging heat comprises using the first circuit to cool second heat transfer surfaces and operating at least one fan to move said ambient air across said second heat transfer surfaces. 4. The method as set forth in claim 1, wherein said step of flowing air comprises driving said air in said first circuit at a speed of at least 50 mph. 5. The method as set forth in claim 1, further comprising the step of pressurizing said air in said first circuit to a pressure greater than 1 atm. 6. The method as set forth in claim 3, wherein said step of flowing comprises disposing said second heat transfer surfaces and said fan in a door unit of a rack containing said equipment. 7. An apparatus for use in cooling electronic equipment in a rack, comprising: a first closed-loop coolant circuit having a heat exchange surface for exchanging heat with ambient air external to said first closed-loop coolant circuit, wherein said ambient air cools said electronic equipment, said first closed-loop coolant circuit extending external to said rack; andan air circulator for circulating air through said first closed-loop coolant circuit. 8. The apparatus as set forth in claim 7, further comprising a second closed-loop coolant circuit having a second coolant fluid different than that of said first circuit. 9. The apparatus as set forth in claim 7, wherein said air circulator is operative for circulating said air in said first circuit at a speed greater than 50 mph. 10. The apparatus as set forth in claim 7, further comprising an air pressurizer for pressurizing said air in said first circuit to a pressure greater than 1 atm. 11. The apparatus as set forth in claim 7, further comprising at least one fan for moving ambient air across said heat exchange surfaces. 12. The apparatus as set forth in claim 8, wherein said apparatus includes a number of fans that are individually controllable to provide differential cooling. 13. The apparatus as set forth in claim 12, wherein said fans are controlled responsive to feedback from temperature sensors. 14. A method for use in cooling electronic equipment in a rack, comprising: providing a closed-loop coolant circuit that extends outside said rack for use in cooling ambient air, external to said closed-loop coolant circuit, that in turn cools said electronic equipment in said rack;using a gas phase coolant in said closed-loop coolant circuit; andoperating said closed-loop coolant circuit at a pressure of no more than about 100 psi and using said gas phase coolant at a temperature below freezing. 15. The method as set forth in claim 14, wherein said closed-loop coolant circuit is operated at a pressure of no more than about 48 psi. 16. The method as set forth in claim 14, wherein said gas phase coolant is moved at a speed of at least about 50 mph in said circuit. 17. A method for use in cooling electronic equipment in a rack, comprising: providing a closed-loop coolant circuit that extends external to said rack;using a gas phase coolant in said closed-loop coolant circuit; andoperating said closed-loop coolant circuit at a coolant circulation speed of at least about 50 mph. 18. The method as set forth in claim 17, wherein said closed-loop coolant circuit is operated at a coolant circulation speed of between about 75-90 mph. 19. An apparatus for use in cooling electronic equipment in standard equipment racks, each one of said racks adapted for holding multiple pieces of said electronic equipment in a vertically stacked configuration, comprising a plurality of cooling modules wherein each module includes a cooling unit with cooling capacity sufficient for cooling more than 1 but less than about 10 racks, and a modular frame, wherein the modular frame of each module is adapted to securely interconnect with another of said modular frames in a plurality of possible configurations. 20. The apparatus as set forth in claim 19, wherein said frames can be interconnected in vertically stacked and horizontally interconnected configurations.