[특허]Energy collection and power reduction in laser coupling process

Panasonic Corporation

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특허 상세정보

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Energy collection and power reduction in laser coupling process

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B23K-026/20
미국특허분류(USC)	219/121.65;
출원번호	US-0129778 (2005-05-16)
등록번호	US-8455789 (2013-06-04)
발명자 / 주소	Ohara, Tetsuo
출원인 / 주소	Panasonic Corporation
대리인 / 주소	RatnerPrestia
인용정보	피인용 횟수 : 0 인용 특허 : 24

초록
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An energy collector is used to assist a laser coupling process by reducing the amount of output power of a laser that is used to modify a device attaching element. The energy collector includes an energy collector tip configured to be placed proximate to a device attaching element during the laser coupling process. The energy collector tip is configured to receive laser energy reflected from the device attaching element during the laser coupling process and is formed from a material that converts this reflected energy to heat. Sufficient thermal coupling...

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1. An energy collector used to assist a laser coupling process, the energy collector comprising: an energy collector tip configured to be placed proximate to a device attaching element during the laser coupling process, wherein:the energy collector tip is configured to receive laser energy reflected from the device attaching element during the laser coupling process;the energy collector tip is formed from a material that converts the laser energy reflected from the device attaching element to heat, andthe energy collector tip includes a surface configured to transfer the converted heat to the device attaching element. 2. An energy collector according to claim 1, further including a mechanism for applying force to the energy collector tip to create thermal contact between the energy collector tip and a surface and to provide a thermally conductive pathway for the collected energy between the energy collector tip and the device attaching element. 3. An energy collector according to claim 1, further comprising an energy collector tip holder coupled to the energy collector, wherein the material that forms the energy collector tip holder has at least the same thermal conductivity of the energy collector tip to assist in cooling an area proximate to the device attaching element when the laser energy is no longer applied. 4. An energy collector according to claim 1, further comprising an energy collector tip holder coupled to the energy collector, wherein the material that forms the energy collector tip holder has a thermal conductivity less than energy collector tip to assist in heating an area proximate to the device attaching element when the laser energy is applied. 5. An energy collector according to claim 1, wherein the energy collector includes a channel which provides a pathway for a gas to flow from the energy collector tip to an area proximate to the device attaching element. 6. An energy collector according to claim 1, wherein the material that forms the energy collector tip has a thermal conductivity sufficient to heat an area proximate to the device attaching element to a predetermined temperature less than 100 ms after the laser beam begins to irradiate the device attaching element and sufficient to cool the area proximate to the device attaching element to a predetermined temperature less than 100 ms after the laser beam stops irradiating the device attaching element. 7. An energy collector according to claim 1, wherein the material that forms the energy collector tip includes at least one of iron, steel or ceramic. 8. An energy collector according to claim 1, wherein the energy collector tip at least partially surrounds the device attaching element and the collector tip includes an opening such that the laser beam may pass through the opening and irradiate the device attaching element. 9. A system used in a laser coupling process, the system comprising: a laser;an energy collector coupled to the laser, the energy collector including: an energy collector tip configured to be placed proximate to a device attaching element during the laser coupling process, wherein:the energy collector tip is configured to receive laser energy reflected from the device attaching element during the laser coupling process; andthe energy collector tip is formed from a material that converts the laser energy reflected from the device attaching element to heat and transfers at least a portion of the heat to the device attaching element; anda controller which moves at least one of the energy collector, the device attaching element or the laser to one of a plurality of available positions with respect to each other, each of the plurality of available positions causing a respectively different amount of heat, converted by the energy collector, to be transferred to the device attaching element. 10. A system according to claim 9, the system further including a mechanism for applying force to the energy collector tip to create sufficient thermal contact between the energy collector tip and a surface to provide a conductive pathway for the collected energy between the energy collector tip and the device attaching element. 11. A system according to claim 10, wherein the mechanism for applying force to the energy collector tip includes a spring which biases the energy collector tip toward the surface. 12. A system according to claim 9, wherein the laser is rigidly coupled to the energy collector. 13. A system according to claim 9, wherein the laser is coupled to the energy collector so that the laser and energy collector move independently of each other. 14. A system according to claim 9, wherein at least one of the energy collector or the device attaching element is moved to align the energy collector with the device attaching element. 15. A system according to claim 9, wherein the device attaching element is formed of at least one of glass solder, lead tin solder, gold-based solder, indium-based solder, gallium-based solder, bismuth-based solder, cadmium-based solder, lead-free solder, thermally cured epoxy, air-cured epoxy or ultraviolet cured epoxy. 16. A system according to claim 9, wherein the device attaching element is formed of a solder preform including a plurality of sub-micron solder chips. 17. A system according to claim 9, wherein the laser beam has a wavelength in the range of about 800 nm to about 1000 nm. 18. A system according to claim 9, wherein the laser beam has a power in the range of about 20 W to 40 W. 19. A system according to claim 9, wherein the laser beam has a pulse length in the range of about 100 ms to about 1 s. 20. A system according to claim 9, wherein the surface at which sufficient thermal contact is created is a top surface of an attachment pad and the device attaching element is located on the top surface of the attachment pad. 21. A system according to claim 9, wherein the energy collector tip and the device attaching element are disposed at different portions of a surface and the surface includes a thermally conductive coating. 22. A system according to claim 9, wherein the energy collector includes a channel that provides a pathway for a gas to flow from the energy collector tip to an area proximate to the device attaching element. 23. A system according to claim 22, the system further including a source of gas coupled to the channel. 24. A system according to claim 22, wherein the gas is selected from a group consisting of nitrogen, argon, or carbon-dioxide. 25. An energy collector according to claim 1, wherein the energy collector tip and the device attaching element are disposed at different portions of a surface; and an area of the collector tip that is in thermal contact with the surface is sufficient for transferring the converted heat from the collector tip to the device attaching element through the surface.

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Energy collection and power reduction in laser coupling process

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Energy collection and power reduction in laser coupling process

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