IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
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| 국제특허분류(IPC7판) |
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| 출원번호 |
US-0071203
(2011-03-24)
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| 등록번호 |
US-8456013
(2013-06-04)
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발명자
/ 주소 |
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| 출원인 / 주소 |
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| 대리인 / 주소 |
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| 인용정보 |
피인용 횟수 :
0 인용 특허 :
105 |
초록
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A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on the surface of a substrate. A layer of passivation is deposited over the layer of dielectric, a thick
A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on the surface of a substrate. A layer of passivation is deposited over the layer of dielectric, a thick second layer of dielectric is created over the surface of the layer of passivation. Thick and wide interconnect lines are created in the thick second layer of dielectric. The first layer of dielectric may also be eliminated, creating the wide thick interconnect network on the surface of the layer of passivation that has been deposited over the surface of a substrate.
대표청구항
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1. A chip comprising: a silicon substrate;a first dielectric layer over said silicon substrate;a first interconnecting structure over said silicon substrate and in said first dielectric layer;a second interconnecting structure over said silicon substrate and in said first dielectric layer;an insulat
1. A chip comprising: a silicon substrate;a first dielectric layer over said silicon substrate;a first interconnecting structure over said silicon substrate and in said first dielectric layer;a second interconnecting structure over said silicon substrate and in said first dielectric layer;an insulating layer over said dielectric layer;a third interconnecting structure over said insulating layer, wherein said first interconnecting structure is connected to said second interconnecting structure through said third interconnecting structure, wherein a top surface of said third interconnecting structure has no access for external connection, wherein a power is adapted to be provided to said third interconnecting structure, wherein said third interconnecting structure is provided by a topmost metal layer of interconnecting lines of said chip. 2. The chip of claim 1, wherein said power is output from a voltage regulator. 3. The chip of claim 1, wherein said insulating layer comprises a nitride. 4. The chip of claim 1, wherein said insulating layer comprises silicon nitride. 5. The chip of claim 1, wherein said insulating layer comprises an oxide. 6. The chip of claim 1, wherein said insulating layer comprises silicon oxide. 7. The chip of claim 1, wherein said first interconnecting structure comprises an electroplated metal. 8. The chip of claim 1, wherein said first interconnecting structure comprises a damascene metal. 9. The chip of claim 1, wherein said third interconnecting structure comprises copper. 10. The chip of claim 1, wherein said third interconnecting structure comprises gold. 11. The chip of claim 1 further comprising a third dielectric layer over said insulating layer, wherein said third dielectric layer comprises a portion on said top surface of said third interconnecting structure. 12. The chip of claim 11, wherein said third dielectric layer comprises a polymer. 13. The chip of claim 1 further comprising a third dielectric layer over said insulating layer, wherein said third dielectric layer comprises a portion between said third interconnecting structure and said insulating layer, wherein said third dielectric layer comprises a polymer. 14. A chip comprising: a silicon substrate;a first dielectric layer over said silicon substrate;a first interconnecting structure over said silicon substrate and in said first dielectric layer;a second interconnecting structure over said silicon substrate and in said first dielectric layer;an insulating layer over said dielectric layer; anda third interconnecting structure over said insulating layer, wherein said first interconnecting structure is connected to said second interconnecting structure through said third interconnecting structure, wherein a top surface of said third interconnecting structure has no access for external connection, wherein a ground is adapted to be provided to said third interconnecting structure, wherein said third interconnecting structure is provided by a topmost metal layer of interconnecting lines of said chip. 15. The chip of claim 14, wherein said insulating layer comprises a nitride. 16. The chip of claim 14, wherein said insulating layer comprises silicon nitride. 17. The chip of claim 14, wherein said insulating layer comprises an oxide. 18. The chip of claim 14, wherein said insulating layer comprises silicon oxide. 19. The chip of claim 14, wherein said first interconnecting structure comprises an electroplated metal. 20. The chip of claim 14, wherein said first interconnecting structure comprises a damascene metal. 21. The chip of claim 14, wherein said third interconnecting structure comprises copper. 22. The chip of claim 14, wherein said third interconnecting structure comprises gold. 23. The chip of claim 15 further comprising a third dielectric layer over said insulating layer, wherein said third dielectric layer comprises a portion on said top surface of said third interconnecting structure. 24. The chip of claim 23, wherein said third dielectric layer comprises a polymer. 25. The chip of claim 14 further comprising a third dielectric layer over said insulating layer, wherein said third dielectric layer comprises a portion between said third interconnecting structure and said insulating layer, wherein said third dielectric layer comprises a polymer. 26. A chip comprising: a silicon substrate;a first dielectric layer over said silicon substrate;a first interconnecting structure over said silicon substrate and in said first dielectric layer;a second interconnecting structure over said silicon substrate and in said first dielectric layer;a passivation layer over said first dielectric layer; anda third interconnecting structure over said passivation layer, wherein said first interconnecting structure is connected to said second interconnecting structure through said third interconnecting structure, wherein a top surface of said third interconnecting structure has no access for external connection, wherein a power is adapted to be provided to said third interconnecting structure. 27. The chip of claim 26, wherein said power is output from a voltage regulator. 28. The chip of claim 26, wherein said passivation layer comprises a nitride. 29. The chip of claim 26, wherein said passivation layer comprises silicon nitride. 30. The chip of claim 26, wherein said passivation layer comprises an oxide. 31. The chip of claim 26, wherein said passivation layer comprises silicon oxide. 32. The chip of claim 26, wherein said first interconnecting structure comprises an electroplated metal. 33. The chip of claim 26, wherein said first interconnecting structure comprises a damascene metal. 34. The chip of claim 26, wherein said third interconnecting structure comprises copper. 35. The chip of claim 26, wherein said third interconnecting structure comprises gold. 36. The chip of claim 26 further comprising a third dielectric layer over said passivation layer, wherein said third dielectric layer comprises a portion on said top surface of said third interconnecting structure. 37. The chip of claim 36, wherein said third dielectric layer comprises a polymer. 38. The chip of claim 26 further comprising a third dielectric layer over said passivation layer, wherein said third dielectric layer comprises a portion between said third interconnecting structure and said passivation layer, wherein said third dielectric layer comprises a polymer. 39. A chip comprising: a silicon substrate;a first dielectric layer over said silicon substrate;a first interconnecting structure over said silicon substrate and in said first dielectric layer;a second interconnecting structure over said silicon substrate and in said first dielectric layer;a passivation layer over said first dielectric layer; anda third interconnecting structure over said passivation layer, wherein said first interconnecting structure is connected to said second interconnecting structure through said third interconnecting structure, wherein a top surface of said third interconnecting structure has no access for external connection, wherein a ground is adapted to be provided to said third interconnecting structure. 40. The chip of claim 39, wherein said passivation layer comprises a nitride. 41. The chip of claim 39, wherein said passivation layer comprises silicon nitride. 42. The chip of claim 39, wherein said passivation layer comprises an oxide. 43. The chip of claim 39, wherein said passivation layer comprises silicon oxide. 44. The chip of claim 39, wherein said first interconnecting structure comprises an electroplated metal. 45. The chip of claim 39, wherein said first interconnecting structure comprises a damascene metal. 46. The chip of claim 39, wherein said third interconnecting structure comprises copper. 47. The chip of claim 39, wherein said third interconnecting structure comprises gold. 48. The chip of claim 39 further comprising a third dielectric layer over said passivation layer, wherein said third dielectric layer comprises a portion on said top surface of said third interconnecting structure. 49. The chip of claim 48, wherein said third dielectric layer comprises a polymer. 50. The chip of claim 39 further comprising a third dielectric layer over said passivation layer, wherein said third dielectric layer comprises a portion between said third interconnecting structure and said passivation layer, wherein said third dielectric layer comprises a polymer.
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