System and method for a modular fluid handling system with modes in a modular data center
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G06F-001/20
F28F-013/00
H05K-007/20
출원번호
US-0033451
(2011-02-23)
등록번호
US-8462496
(2013-06-11)
발명자
/ 주소
Schmitt, Ty
Bailey, Mark M.
Duncan, Tyler
출원인 / 주소
Dell Products L.P.
대리인 / 주소
Baker Botts L.L.P.
인용정보
피인용 횟수 :
11인용 특허 :
12
초록▼
In accordance with the present disclosure, a system and method for a modular fluid handling system with modes in a modular data center is presented. According to the present application, a modular data center may include a modular primary structure. The modular primary structure may include a plural
In accordance with the present disclosure, a system and method for a modular fluid handling system with modes in a modular data center is presented. According to the present application, a modular data center may include a modular primary structure. The modular primary structure may include a plurality of information handling systems arranged in racks within it. The modular data center may also include a modular fluid handling system that circulates fluid through the modular primary structure according, at least in part, to a plurality of modes. The modular fluid handling system may be designed to accommodate environmental conditions in which the modular data center will operate as well as the usage requirements of the modular primary structure.
대표청구항▼
1. A modular data center comprising: a first structure;a plurality of information handling systems arranged in a rack within the first structure; anda modular fluid handling system coupled to the first structure, wherein the modular fluid handling system comprises: at least one structural enclosure
1. A modular data center comprising: a first structure;a plurality of information handling systems arranged in a rack within the first structure; anda modular fluid handling system coupled to the first structure, wherein the modular fluid handling system comprises: at least one structural enclosure in fluid communication with the first structure, wherein the at least one structural enclosure is an air handling unit,a second structural enclosure including at least one cooling element and at least one damper, wherein the at least one damper, when opened, allows fluid communication between the second structural enclosure and the outside environment, anda third structural enclosure in fluid communication with the at least one structural enclosure and the second structural enclosure, the third structural enclosure including at least one damper. 2. The modular data center of claim 1, wherein the air-handling unit is sized to handle air for a set of the plurality of information handling systems that do not include individual air-handling units. 3. The modular data center of claim 1, where the air-handling unit includes at least one damper. 4. The modular data center of claim 3, wherein the dampers are modulated in response to environmental conditions external to the modular data center. 5. The modular data center of claim 1, wherein the second structural enclosure is in fluid communication with the first structure. 6. The modular data center of claim 1, wherein the air-handling unit conditions air passing through the plurality of information handling systems. 7. The modular data center of claim 5, wherein the second structural enclosure conditions air passing through the plurality of information handling systems. 8. A modular fluid handling system for a modular data center, comprising: a fan;a cooling mechanism; andat least one damper;wherein the fan is operable to circulate air through the modular data center in one of a plurality of air flow patterns caused, at least in part, by the at least one damper;wherein the multiple air flow patterns comprise: a first airflow pattern wherein only air internal to the modular data center is circulated through the data center;a second airflow pattern wherein only air external to the modular data center is circulated through the data center without being cooled by the cooling mechanism;a third airflow pattern wherein only air external to the modular data center is circulated through the data center after being cooled by the cooling mechanism; anda fourth airflow pattern wherein air external to the modular data center is circulated through the data center after being mixed with exhaust air from the modular data center;wherein the modular data center includes a primary structure and the array of air-handling units are mounted to the top of the primary structure. 9. The modular fluid handling system of claim 8, wherein the modular fluid handling system includes an array of air-handling modules in fluid communication with the modular data center. 10. The modular fluid handling system of claim 9, wherein each of the array of air-handling modules includes a fan, a cooling mechanism, and at least one damper. 11. The modular fluid handling system of claim 8, wherein the array of air-handling units are sized to handle air for a set of servers within the primary structure that do not have individual air-handling units. 12. The modular fluid handling system of claim 8, wherein the at least one damper is operable to be automatically modulated. 13. A method for selectably cooling a modular data center, comprising: providing a modular data center that includes a modular fluid handling system, wherein the modular fluid handling system includes a plurality of air flow patterns for air moving through the modular data center;providing a plurality of electronic sensors to measure air temperature inside and outside of the modular data center; andproviding at least one information handling system, wherein the information handling system is operable to receive signals from the electronic sensors and select and operate one of the plurality of air flow patterns based, at least in part, on the signals from the electronic sensors;wherein the plurality of air flow patterns comprise: a first airflow pattern wherein only air internal to the modular data center is circulated through the data center;a second airflow pattern wherein only air external to the modular data center is circulated through the data center without being cooled by the cooling mechanism;a third airflow pattern wherein only air external to the modular data center is circulated through the data center after being cooled by the cooling mechanism; anda fourth airflow pattern wherein air external to the modular data center is circulated through the data center after being mixed with exhaust air from the modular data center;wherein the modular data center includes a primary structure and the array of air-handling units are mounted to the top of the primary structure. 14. The method of claim 13, wherein the modular fluid handling system includes at least one damper. 15. The method of claim 13, wherein the modular fluid handling system includes a fan, an artificial cooling mechanism, and at least one damper.
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이 특허에 인용된 특허 (12)
Master, Pedro; van Dijk, Marcel; Lodder, Robbert Mees; Schaap, Wolter, Apparatus and method for cooling a space in a data center by means of recirculation air.
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