High efficiency thermoelectric cooling system and method of operation
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F25B-021/02
F25B-021/00
F25D-017/06
F17C-013/00
H02J-001/02
H02M-001/12
H02M-001/14
출원번호
US-0644319
(2009-12-22)
등록번호
US-8468837
(2013-06-25)
우선권정보
CA-2682442 (2009-10-14)
발명자
/ 주소
Pinet, Claude
출원인 / 주소
Pinet, Claude
대리인 / 주소
Norton Rose Canada LLP
인용정보
피인용 횟수 :
2인용 특허 :
14
초록▼
A high efficiency thermoelectric cooling system and method is described. The cooling system has a thermoelectric module having a semi-conductor body sandwiched in contact between a pair of thermally conductive plates. A smooth continuous variable output direct current source supplies the semi-conduc
A high efficiency thermoelectric cooling system and method is described. The cooling system has a thermoelectric module having a semi-conductor body sandwiched in contact between a pair of thermally conductive plates. A smooth continuous variable output direct current source supplies the semi-conductor body to attenuate thermal stress in the conductive plates due to temperature differential fluctuation across the plates. Current flow in the semi-conductor body transfers heat from one plate to the other plate. A cold heat sink absorbs heat from the cold plate. A heat convection assembly, including a hot heat sink, evacuates heat from the hot plate. The thermoelectric cooling device is secured to a wall of an insulated enclosure. An air convection housing may b provided to evacuate heat from the hot heat sink using an outside air supply or ambient air supply.
대표청구항▼
1. A high efficiency thermoelectric cooling system adapted for refrigerating an insulated enclosure, said cooling system comprising a thermoelectric module having a semi-conductor body sandwiched in contact between a pair of thermally conductive plates, a power supply having converter circuit provid
1. A high efficiency thermoelectric cooling system adapted for refrigerating an insulated enclosure, said cooling system comprising a thermoelectric module having a semi-conductor body sandwiched in contact between a pair of thermally conductive plates, a power supply having converter circuit provides a smooth continuous variable output direct current supply to said semi-conductor body to attenuate thermal stress in said conductive plates due to temperature differential fluctuation across said plates, one of said plates being a cold plate and the other a hot plate caused by current flow in said semi-conductor body transferring heat from said cold plate to said hot plate, a cold heat sink element secured to said cold plate to absorb heat from the insulted enclosure to cool the enclosure, a heat convection assembly to evacuate heat from said hot plate to effectively manage the temperature differential across said plates, said heat convection assembly having two or more heat pipes having a connection portion for absorbing heat from said hot plate and a heat dissipating portion secured to a hot heat sink element spaced from said thermally conductive block to define a space gap between said hot plate and said heat sink element, a fan secured directly to said hot heat sink element which is secured to said heat dissipating portions to evacuate heat outside said insulated enclosure, said fan producing a heat dissipating force convection flow parallel to a stack of a plurality of heat conductive fins of said hot heat sink element, said thermoelectric cooling device being mounted in a securement cavity formed in a wall of the insulated enclosure with said heat convection means disposed exteriorly of said insulated enclosure, a heat channeling air convection housing secured to said wall of the insulted enclosure and about said hot heat sink element and said fan, said air convection housing having an interior air intake and exhaust port and an exterior intake and exhaust port, hinge gates communicating said hot heat sink element between a selected one of said interior and exterior air intake ports to a selected one of said interior and exterior air exhaust ports. 2. A high efficiency thermoelectric cooling system as claimed in claim 1 wherein said cold heat sink element has a planar surface secured in flush contact with said cold plate, said cold heat sink element having a plurality of spaced-apart fins, and a fan secured to said cold heat sink element to direct air from said insulated enclosure against said fins. 3. A high efficiency thermoelectric cooling system as claimed in claim 2 wherein there is further provided a peripheral seal in peripheral contact and about said thermoelectric module to insulate said cold plate from said hot plate. 4. A high efficiency thermoelectric cooling system as claimed in claim 3 were said peripheral seal is a neoprene seal. 5. A high efficiency thermoelectric cooling system as claimed in claim 1 wherein a spacer member is retained adjacent and about said thermally conductive block by a compression bracket to form a space gap extending between said cold heat sink element secured to said cold plate and said hot heat sink element which is secured to said heat dissipating portion of said one or more heat pipes. 6. A high efficiency thermoelectric cooling system as claimed in claim 1 wherein said heat pipes contain a heat transfer fluid retained captive therein and adapted to cycle within said pipes to transfer heat from said hot plate to said heat sink. 7. A high efficiency thermoelectric cooling system as claimed in claim 5 wherein said heat pipes are shaped to accommodate said space gap, said heat dissipation portion extending transversely of said thermally conductive block from opposed sides thereof and transversely to a stack of a plurality of parallel closely spaced thin heat conductive fins of said hot heat sink, said fan being oriented to direct an air flow between said fins of said stack of fins. 8. A high efficiency thermoelectric cooling system as claimed in claim 5 wherein said compression bracket is provided with thermally insulating fasteners to secure said thermally conductive block captive over said hot plate. 9. A high efficiency thermoelectric cooling system as claimed in claim 8 wherein said thermally insulating fasteners are nylon bolt fasteners. 10. A high efficiency thermoelectric cooling system as claimed in claim 8 wherein said fasteners are bolt fasteners having a shaft portion provided with a threaded free end and an engageable head portion, a spacer about said shaft portion and positioned about a fastener receiving bore outwardly of said compression bracket to space said head portion outwardly of said separation gap, and a spring washer between said spacer and said bolt head portion. 11. A high efficiency thermoelectric cooling system as claimed in claim 10 wherein said threaded free end of said bolt fasteners is secured to said planar surface of said heat sink element secured to said cold plate. 12. A high efficiency thermoelectric cooling system as claimed in claim 7 wherein said space gap is disposed in said securement cavity, and an insulating foam injected into said securement cavity, or part thereof, to seal said space gap, or part thereof, and form a connection with said wall of said insulated enclosure with said heat sink element secured to said heat dissipation portion of said two or more heat pipes spaced outwardly of said wall of said insulated enclosure. 13. A high efficiency thermoelectric cooling system as claimed in claim 1 wherein said exterior air intake and exhaust ports are provided with fans for drawing exterior air from outside a building containing said cooling device and into said air convection housing and exhausting heated air passing through said hot heat sink to the exterior of the building. 14. A high efficiency thermoelectric cooling system as claimed in claim 1 wherein said air convection housing is divided into two compartments separated by a division wall structure, said compartments communicating with one another through said fan positioned adjacent said hot heat sink and mounted in said division wall structure of said convection housing, said interior and exterior air intake ports communicating with one of said compartments and said interior and exterior exhaust ports communicating with the other of said two compartments, and control means to control the position of said hinge gates. 15. A high efficiency thermoelectric cooling system as claimed in claim 14 wherein said control means is a programmable computer controller having a memory for storing statements and instructions for use in the execution of programmed functions by a CPU, and temperature sensors for monitoring interior temperatures of said insulated housing and exterior temperatures thereof for feeding temperature signals to said CPU for the positioning of said hinge gates. 16. A high efficiency thermoelectric cooling system as claimed in claim 15 wherein said CPU may be incorporated in said division wall structure or remotely thereof, said CPU having a connecting port positioned exteriorly of said convection housing for connection to a computer for programming said CPU. 17. A high efficiency thermoelectric cooling system as claimed in claim 15 wherein said hinge gates are motor-operated hinge gates controlled by said CPU, said hinge gates each being displaceable from a first to a second position depending on said temperature signals to communicate said exterior intake port to said exterior exhaust port through said fan and hot heat sink in said division wall structure or to communicate said interior intake port to said interior exhaust port through said fan and heat sink in said division wall structure. 18. A high efficiency thermoelectric cooling system as claimed in claim 17 wherein said hinge gates are also displaceable by said CPU to communicate said interior intake port with said exterior exhaust port through said fan and hot heat sink in said division wall structure. 19. A high efficiency thermoelectric cooling system as claimed in claim 17 wherein said CPU modulates said fans of said exterior intake and exhaust ports according to cold air requirements as determined by desired temperature parameters stored in said memory of said CPU. 20. A high efficiency thermoelectric cooling system as claimed in claim 15 wherein there is further provided a temperature sensor associated with said hot heat sink for generating temperature signals to said CPU for the control of the speed of operation of said fans of said exterior air intake and exhaust ports. 21. A high efficiency thermoelectric cooling system as claimed in claim 1 wherein said converter circuit is connected at an output of a pulse width modulated direct current of a supply circuit and comprises a bridge circuit including a schottki diode connected across said supply circuit, an electrolytic capacitor connected in parallel with said diode and a discharge coil connected intermediate a leg connection of said diode and said capacitor, said bridge circuit converting said pulse width modulated current into a ramp-up/ramp-down current supply constituting said smooth continuous variable output direct current supply to maintain uninterrupted current flow in said semi-conductor body and heat transfer between said cold plate and hot plate during operation of said thermoelectric module. 22. A high efficiency thermoelectric cooling system as claimed in claim 21 wherein a CPU controls a power transistor circuit feeding said pulse width modulate direct current supply to said converter circuit means depending on a set point temperature required for said insulated enclosure and stored in the memory of said CPU, and temperature sensing means in said insulated enclosure for feeding actual temperature signals to said CPU. 23. A method of increasing the efficiency and life span of a thermoelectric module formed of a semi-conductor body sandwiched in contact between a pair of thermally conductive plates, said method comprising the steps of: i) converting a pulse width modulated direct current supply to a smooth continuous variable output direct current supply,ii) feeding said smooth continuous variable output direct current supply across said semi-conductor body to obtain a continuous current flow in said semi-conductor body to continuously transfer heat from one of said pair of thermally conductive plates to the other in an uninterrupted manner,iii) forming a space gap between a hot thermally conductive plate of said pair of thermally conductive plates and a hot heat sink element to permit the injection of insulating foam material therein to provide the securement of said thermoelectric module in a wall opening of an insulated enclosure to be refrigerated with a hot heat sink supported exteriorly of said enclosure,iv) isolating said hot heat sink element in an air convection housing;v) operating hinge gates to establish a cooling air convection path across said hot heat sink element;vi) monitoring temperatures in said insulated enclosure, outside said insulated enclosure and outside a building structure containing said insulated enclosure; andvii) automatically selecting a desired cooling air convection path to extract heat from said hot heat sink element. 24. A method as claimed in claim 23 wherein said step of converting comprises feeding said pulse width modulated direct current supply across a schottki diode connected in parallel with an electrolytic capacitor and a discharge coil connected in a leg connection of said schottki diode and said electrolytic capacitor. 25. A method as claimed in claim 23 wherein said step vii) is selected from one of: (1) an ambient air convection path outside said insulated enclosure, (2) an exterior air convection path using outside air from outside said building structure for an inlet of said convection path and an outlet thereof, and (3) an exterior air convection path using outside air for an inlet of said convection with an outlet thereof returning to ambient air outside said insulted enclosure, whereby to extract the maximum amount of heat from said hot heat sink element to thereby control the temperature differential across aid thermally conductive plates of said thermoelectric device and reducing power consumption. 26. A method as claimed in claim 25 wherein said hot heat sink element has a fan secured in relation therewith to create a forced airflow across said hot heat sink element, and further fans secured to said inlet and to said outlet of said exterior air convection path, said method further comprising the step of automatically controlling the operation of said fans based on temperature signals fed to a controller computer. 27. A high efficiency thermoelectric cooling system adapted for refrigerating an insulated enclosure, said cooling system comprising a thermoelectric module having a semi-conductor body sandwiched in contact between a pair of thermally conductive plates, a power supply having converter circuit provides a smooth continuous variable output direct current supply to said semi-conductor body to attenuate thermal stress in said conductive plates due to temperature differential fluctuation across said plates, one of said plates being a cold plate and the other a hot plate caused by current flow in said semi-conductor body transferring heat from said cold plate to said hot plate, a cold heat sink element secured directly to said cold plate to absorb heat from the insulted enclosure to cool the enclosure, a heat convection assembly to evacuate heat from said hot plate to effectively manage the temperature differential across said plates, said heat convection assembly having two or more heat pipes having a connection portion for absorbing heat from said hot plate and a heat dissipating portion secured to a hot heat sink element spaced from said thermally conductive block to define a space gap between said hot plate and said heat sink element, a fan secured directly to said hot heat sink element which is secured to said heat dissipating portions to evacuate heat outside said insulated enclosure, said fan producing a heat dissipating force convention flow parallel to a stack of a plurality of heat conductive fins of said hot heat sink element, said thermoelectric cooling device being mounted in a securement cavity formed in a wall of the insulated enclosure with said fan disposed exteriorly of said insulated enclosure, a peripheral neoprene seal secured in peripheral contact about said thermoelectric module to insulate said cold plate from said hot plate, said heat pipes extending transverse to a heat dissipating planar surface of said hot plate and through said space gap, said heat conductive fins extending parallel to said heat dissipating planar surface of said hot plate, said fan being oriented to direct an air flow between said fins of said stack of fins transversely of said heat dissipating planar surface of said hot plate, and a compression bracket having thermally insulating fasteners to secure said thermally conductive block captive over and about said hot plate. 28. A high efficiency thermoelectric cooling system as claimed in claim 27 wherein said cold heat sink element having a planar surface secured in flush contact with said cold plate, said cold heat sink element having a plurality of spaced-apart fins, and a fan secured to said cold heat sink element to direct air from said insulated enclosure against said fins. 29. A high efficiency thermoelectric cooling system as claimed in claim 27 wherein a spacer member is retained adjacent and about said thermally conductive block by a compression bracket to form a space gap extending between said cold heat sink element secured to said cold plate and said hot heat sink element which is secured to said heat dissipating portion of said one or more heat pipes. 30. A high efficiency thermoelectric cooling system as claimed in claim 27 wherein said heat pipes contain a heat transfer fluid retained captive therein and adapted to cycle within said pipes to transfer heat from said hot plate to said heat sink. 31. A high efficiency thermoelectric cooling system as claimed in claim 27 wherein said fasteners are thermally insulating bolt fasteners having a shaft portion provided with a threaded free end and an engageable head portion, a spacer about said shaft portion and positioned about a fastener receiving bore outwardly of said compression bracket to space said head portion outwardly of said separation gap, and a spring washer between said spacer and said bolt head portion. 32. A high efficiency thermoelectric cooling system as claimed in claim 27 wherein said space gap is disposed in said securement cavity, and an insulating foam injected into said securement cavity, or part thereof, to seal said space gap, or part thereof, and form a connection with said wall of said insulated enclosure with said heat sink element secured to said heat dissipation portion of said two or more heat pipes spaced outwardly of said wall of said insulated enclosure.
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이 특허에 인용된 특허 (14)
Wilkerson Alan W. (W61 N14280 Taunton Ave. ; P.O. Box 191 Cedarburg WI 53012), AC line current controller utilizing line connected inductance and DC voltage component.
Nelson John L. (Garland TX) Criscuolo Lance (Dallas TX) Gilley Michael D. (Rowlett TX) Park Brian V. (Austin TX), Control system for thermoelectric refrigerator.
Park Brian V. (Austin TX) Smith ; Jr. Malcolm C. (La Porte TX) McGrath Ralph D. (Granville OH) Gilley Michael D. (Rowlett TX) Criscuolo Lance (Dallas TX) Nelson John L. (Garland TX), Thermoelectric refrigerator.
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