최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
DataON 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Edison 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | US-0085447 (2011-04-12) |
등록번호 | US-8471391 (2013-06-25) |
발명자 / 주소 |
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출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 | 피인용 횟수 : 3 인용 특허 : 312 |
A rectangular interlevel connector array (RICA) is defined in a semiconductor chip. To define the RICA, a virtual grid for interlevel connector placement is defined to include a first set of parallel virtual lines that extend across the layout in a first direction, and a second set of parallel virtu
A rectangular interlevel connector array (RICA) is defined in a semiconductor chip. To define the RICA, a virtual grid for interlevel connector placement is defined to include a first set of parallel virtual lines that extend across the layout in a first direction, and a second set of parallel virtual lines that extend across the layout in a second direction perpendicular to the first direction. A first plurality of interlevel connector structures are placed at respective gridpoints in the virtual grid to form a first RICA. The first plurality of interlevel connector structures of the first RICA are placed to collaboratively connect a first conductor channel in a first chip level with a second conductor channel in a second chip level. A second RICA can be interleaved with the first RICA to collaboratively connect third and fourth conductor channels that are respectively interleaved with the first and second conductor channels.
1. A semiconductor chip, comprising: a first conductor channel defined in a first chip level, wherein the first conductor channel includes a first plurality of parallel wires having a common electrical connectivity and oriented in a first direction;a second conductor channel defined in a second chip
1. A semiconductor chip, comprising: a first conductor channel defined in a first chip level, wherein the first conductor channel includes a first plurality of parallel wires having a common electrical connectivity and oriented in a first direction;a second conductor channel defined in a second chip level, wherein the second conductor channel includes a second plurality of parallel wires having a common electrical connectivity and oriented in a second direction that is perpendicular to the first direction, wherein the first and second conductor channels extend across each other within the chip at a crossing location; anda first rectangular interlevel connector array (RICA) defined at the crossing location to connect the first conductor channel to the second conductor channel, wherein the first RICA includes a first plurality of interlevel connectors placed to collaboratively connect the wires of the first conductor channel to the wires of the second conductor channel. 2. The semiconductor chip of claim 1, wherein the first plurality of interlevel connectors of the first RICA are placed at respective gridpoints in a virtual grid for interlevel connector placement, wherein the virtual grid is defined by a first set of parallel virtual lines that extend across the chip in the first direction and by a second set of parallel virtual lines that extend across the chip in the second direction,wherein each intersection point between the first and second sets of parallel virtual lines is a gridpoint in the virtual grid for interlevel connector placement, andwherein neighboring interlevel connectors of the first RICA are spaced apart from each other by a first number of gridpoints in the first direction and by a second number of gridpoints in the second direction. 3. The semiconductor chip of claim 2, wherein the first number of gridpoints in the first direction is equal to one, and wherein the second number of gridpoints in the second direction is equal to one. 4. The semiconductor chip of claim 2, wherein the first number of gridpoints in the first direction is equal to one, and wherein the second number of gridpoints in the second direction is equal to at least two. 5. The semiconductor chip of claim 2, herein the first number of gridpoints in the first direction is equal to at least two, and wherein the second number of gridpoints in the second direction is equal to at least two. 6. The semiconductor chip of claim 5, wherein a non-RICA interlevel connector is placed at a gridpoint within the first RICA so as to connect a first single wire with a second single wire, wherein the first and second single wires are respectively defined in any different two levels of the chip, and wherein each of the first and second single wires is not part of either the first or second conductor channels. 7. The semiconductor chip of claim 5, further comprising: a third conductor channel;a fourth conductor channel, wherein the third and fourth conductor channels are respectively defined in any different two levels of the chip; anda second plurality of interlevel connectors placed at respective gridpoints in the virtual grid to form a second RICA that is interleaved with the first RICA, wherein the interlevel connectors of the second RICA are placed to collaboratively connect the third conductor channel with the fourth conductor channel. 8. The semiconductor chip of claim 7, wherein some of the second plurality of interlevel connectors of the second RICA are placed at respective gridpoints between some of the first plurality of interlevel connectors of the first RICA. 9. The semiconductor chip of claim 5, further comprising: a third conductor channel;a fourth conductor channel, wherein the third and fourth conductor channels are respectively defined in any different two levels of the chip; anda second plurality of interlevel connectors placed at respective gridpoints in the virtual grid to form a second RICA that is embedded within the first RICA, whereby the interlevel connectors of the second RICA are placed to collaboratively connect the third conductor channel with the fourth conductor channel. 10. The semiconductor chip of claim 9, wherein the first plurality of interlevel connectors of the first RICA are placed to bracket the second plurality of interlevel connectors of the second RICA in both the first and second directions. 11. The semiconductor chip of claim 1, wherein each interlevel connector is either a via structure or a contact structure. 12. The semiconductor chip of claim. her comprising: a first number of strap wires defined to electrically connect some of the first plurality of wires of the first conductor channel together at a location outside the first RICA, wherein each of the first number of strap wires is defined in any level of the chip other than the first level, and wherein each of the first number of strap wires is oriented perpendicular to the first plurality of wires of the first conductor channel, and wherein each connection between the first number of strap wires and the first plurality of wires of the first conductor channel is formed by an interlevel connector. 13. The semiconductor chip of claim 12, further comprising: a second number of strap wires defined to electrically connect some of the second plurality of wires of the second conductor channel together at a location outside the first RICA, wherein each of the second number of strap wires is defined in any level of the chip other than the second level, and wherein each of the second number of strap wires is oriented perpendicular to the second plurality of wires of the second conductor channel, and wherein each connection between the second number of strap wires and the second plurality of wires of the second conductor channel is formed by an interlevel connector. 14. A layout of a semiconductor chip, comprising: a first conductor channel defined in a first chip level, wherein the first conductor channel includes a first plurality of parallel wire layout shapes having a common electrical connectivity and oriented in a first direction;a second conductor channel defined in a second chip level, wherein the second conductor channel includes a second plurality of parallel wire layout shapes having a common electrical connectivity and oriented in a second direction that is perpendicular to the first direction, wherein the first and second conductor channels extend across each other within the chip at a crossing location; anda first rectangular interlevel connector array (RICA) defined at the crossing location to connect the first conductor channel to the second conductor channel, wherein the first RICA includes a first plurality of interlevel connector layout shapes placed to collaboratively connect the wire layout shapes of the first conductor channel to the wire layout shapes of the second conductor channel. 15. The layout of the semiconductor chip of claim 14, wherein the first plurality of interlevel connector layout shapes of the first RICA are placed at respective gridpoints in a virtual grid for interlevel connector placement, wherein the virtual grid is defined by a first set of parallel virtual lines that extend across the chip in the first direction and by a second set of parallel virtual lines that extend across the chip in the second direction,wherein each intersection point between the first and second sets of parallel virtual lines is a gridpoint in the virtual grid for interlevel connector placement, andwherein neighboring interlevel connector layout shapes of the first RICA are spaced apart from each other by a first number of gridpoints in the first direction and by a second number of gridpoints in the second direction. 16. The layout of the semiconductor chip of claim 15, wherein the first number of gridpoints in the first direction is equal to one, and wherein the second number of gridpoints in the second direction is equal to one. 17. The layout of the semiconductor chip of claim 15, wherein the first number of gridpoints in the first direction is equal to one, and wherein the second number of gridpoints in the second direction is equal to at least two. 18. The layout of the semiconductor chip of claim 15, wherein the first number of gridpoints in the first direction is equal to at least two, and wherein the second number of gridpoints in the second direction is equal to at least two. 19. The layout of the semiconductor chip of claim 18, wherein a non-RICA interlevel connector layout shape is placed at a gridpoint within the first RICA so as to connect a first single wire layout shape with a second single wire layout shape, wherein the first and second single wire layout shapes are respectively defined in any different two levels of the chip, and wherein each of the first and second single wire layout shapes is not part of either the first or second conductor channels. 20. The layout of the semiconductor chip of claim 18, further comprising: a third conductor channel;a fourth conductor channel, wherein the third and fourth conductor channels are respectively defined in any different two levels of the chip; anda second plurality of interlevel connector layout shapes placed at respective gridpoints in the virtual grid to form a second RICA that is interleaved with the first RICA, wherein the interlevel connector layout shapes of the second RICA are placed to collaboratively connect the third conductor channel with the fourth conductor channel. 21. The layout of the semiconductor chip of claim 20, wherein some of the second plurality of interlevel connector layout shapes of the second RICA are placed at respective gridpoints between some of the first plurality of interlevel connector layout shapes of the first RICA. 22. The layout of the semiconductor chip of claim 18, further comprising: a third conductor channel;a fourth conductor channel, wherein the third and fourth conductor channels are respectively defined in any different two levels of the chip; anda second plurality of interlevel connector layout shapes placed at respective gridpoints in the virtual grid to form a second RICA that is embedded within the first RICA, whereby the interlevel connector layout shapes of the second RICA are placed to collaboratively connect the third conductor channel with the fourth conductor channel. 23. The layout of the semiconductor chip of claim 22, wherein the first plurality of interlevel connector layout shapes of the first RICA are placed to bracket the second plurality of interlevel connector layout shapes of the second RICA in both the first and second directions. 24. The layout of the semiconductor chip of claim 14, wherein each interlevel connector is either a via structure layout shape or a contact structure layout shape. 25. The layout of the semiconductor chip of claim 14, further comprising: a first number of strap wire layout shapes defined to electrically connect some of the first plurality of wire layout shapes of the first conductor channel together at a location outside the first RICA, wherein each of the first number of strap wire layout shapes is defined in any level of the chip other than the first level, and wherein each of the first number of strap wire layout shapes is oriented perpendicular to the first plurality of wire layout shapes of the first conductor channel, and wherein each connection between the first number of strap wire layout shapes and the first plurality of wire layout shapes of the first conductor channel is formed by an interlevel connector layout shape. 26. The layout of the semiconductor chip of claim 25, further comprising: a second number of strap wire layout shapes defined to electrically connect some of the second plurality of wire layout shapes of the second conductor channel together at a location outside the first RICA, wherein each of the second number of strap wire layout shapes is defined in any level of the chip other than the second level, and wherein each of the second number of strap wire layout shapes is oriented perpendicular to the second plurality of wire layout shapes of the second conductor charnel, and wherein each connection between the second number of strap wire layout shapes and the second plurality of wire layout shapes of the second conductor channel is formed by an interlevel connector layout shape.
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