Industrial computer capable of dust prevention and resistant to vibration
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G06F-001/20
H05K-007/20
F16M-013/02
출원번호
US-0129517
(2009-10-28)
등록번호
US-8472184
(2013-06-25)
우선권정보
KR-10-2008-0134743 (2008-12-26)
국제출원번호
PCT/KR2009/006250
(2009-10-28)
§371/§102 date
20110516
(20110516)
국제공개번호
WO2010/074398
(2010-07-01)
발명자
/ 주소
Chang, Young Sool
출원인 / 주소
Acetronix Co., Ltd.
대리인 / 주소
Rabin & Berdo, P.C.
인용정보
피인용 횟수 :
1인용 특허 :
20
초록▼
A dust-free and anti-vibration industrial computer. The industrial computer has a case sealed from the outside, a heat diffusion fin assembly mounted on the outer surface of the case, and a circulation pipe for allowing a heat generating component and at least a heat diffusion fin to be communicated
A dust-free and anti-vibration industrial computer. The industrial computer has a case sealed from the outside, a heat diffusion fin assembly mounted on the outer surface of the case, and a circulation pipe for allowing a heat generating component and at least a heat diffusion fin to be communicated with each other, or a heat pipe for transferring heat between the heat generating component and the heat diffusion fin. The heat generating component can be cooled in a state in which dust is prevented from being produced within the case.
대표청구항▼
1. An industrial computer comprising: a printed circuit board, on which at least one heat generating component is mounted, the printed circuit board including a heat sink anchored to the top of the heat generating component to be in close contact with the top of the heat generating component, and a
1. An industrial computer comprising: a printed circuit board, on which at least one heat generating component is mounted, the printed circuit board including a heat sink anchored to the top of the heat generating component to be in close contact with the top of the heat generating component, and a cooling fan anchored to the top of the heat sink; a case, within which the printed circuit board is provided, the case having a side wall, which is formed with at least one through-hole at the upper part thereof, and is formed with a plurality of opened windows at the lower part of the case to be adjacent to each other;a heat diffusion fin assembly having a substantially rectangular heat diffusion wall, the inner side of the heat diffusion wall being provided with a plurality of inner heat diffusion fins, each of which extends crosswise and which are arranged in a zigzag format in the vertical direction, and the outer side of the heat diffusion wall being provided with a plurality of outer heat diffusion fins, each of which extends longitudinally and which are spaced from each other, and side walls enclosing the heat diffusion wall, the side walls having a plurality of anchoring protrusions extending from the edges of the side walls, wherein the anchoring protrusions are fitted in anchoring holes, which are positioned around the area where the through-hole and the opened windows are formed, so that a closed space SA is provided between the case and the heat diffusion fin assembly; anda circulation pipe, one end of which is detachably joined to a peripheral frame of the cooling fan, and the other end of which is mounted on the peripheral edge of the through-hole of the case so as to allow the cooling fan and the closed space SA to be communicated with each other. 2. The industrial computer as claimed in claim 1 further comprising: a first heat transfer member provided between the heat sink and the cooling fan, a second heat transfer member provided on the upper part of the heat diffusion wall, and a heat pipe formed by a conductive pipe for thermally interconnecting the first heat transfer member and the second heat transfer member. 3. The industrial computer as claimed in claim 2, further comprising a flat heat plate interposed between the second heat transfer member and the heat diffusion wall. 4. The industrial computer as claimed in claim 1, further comprising: a safety cover detachably joined to the heat diffusion fin assembly in such a manner that the safety cover covers the outer heat diffusion fins on the heat diffusion wall, wherein the safety cover comprises a front side opposite to the heat diffusion wall, and wings bent at the opposite lateral edges of the front side and anchored to the left and right side walls of the heat diffusion fin assembly, respectively.
Schultz, Ronald E.; Hall, Kenwood H.; Herbert, Patrick C.; Bodmann, Douglas R.; Killian, Daniel E., Thermal cooling of industrial electronic module by conductive structure.
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