초록 ▼

Solid state lighting devices and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state light device includes a light emitting diode with an N-type gallium nitride (GaN) material, a P-type GaN material spaced apart from the N-type GaN material, and an indium galli

Solid state lighting devices and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state light device includes a light emitting diode with an N-type gallium nitride (GaN) material, a P-type GaN material spaced apart from the N-type GaN material, and an indium gallium nitride (InGaN) material directly between the N-type GaN material and the P-type GaN material. At least one of the N-type GaN, InGaN, and P-type GaN materials has a non-planar surface.

대표청구항 ▼

1. A solid-state lighting (SSL) device, comprising: an N-type gallium nitride (GaN) material;a P-type GaN material spaced apart from the N-type GaN material; andan indium gallium nitride (InGaN) material directly between the N-type GaN material and the P-type GaN material;wherein at least one of the

1. A solid-state lighting (SSL) device, comprising: an N-type gallium nitride (GaN) material;a P-type GaN material spaced apart from the N-type GaN material; andan indium gallium nitride (InGaN) material directly between the N-type GaN material and the P-type GaN material;wherein at least one of the N-type GaN, InGaN, and P-type GaN materials has a non-planar surface with a plurality of symmetric protrusions, wherein the symmetric protrusions are formed with tips, and wherein the symmetric protrusions at least partially reduce a total tensile stress among the N-type GaN, InGaN, and P-type GaN materials by at least partially canceling opposite tensile stresses at the tips along the non-planar surface. 2. The SSL device of claim 1 wherein the indentations form a zigzag pattern. 3. The SSL device of claim 1 wherein of the individual indentations are defined by a first plane and a second plane joined together at a junction. 4. The SSL device of claim 1 wherein the indentations are defined by a first plane and a second plane joined together at a junction, the first and second planes forming an angle of about 72°. 5. The SSL device of claim 1 wherein the indentations are defined by a first plane, a second plane, and a third plane extending between the first and second planes, the first and second planes forming an angle of about 54° and 126° with the third plane, respectively. 6. The SSL device of claim 1 wherein the N-type GaN, InGaN, and P-type GaN materials individually have a surface with a zigzag pattern. 7. The SSL device of claim 1 wherein at least one of the N-type GaN, InGaN, and P-type GaN materials have a first surface and a second surface opposite the first surface, the first surface being non-planar and the second surface being generally planar. 8. The SSL device of claim 1 wherein at least one of the N-type GaN, InGaN, and P-type GaN materials have a first surface and a second surface opposite the first surface, the first surface having a zigzag pattern and the second surface being generally planar. 9. A microelectronic assembly, comprising: a silicon substrate having a surface with a plurality of indentations, the silicon substrate having an Si(1,0,0) lattice orientation at the surface, wherein the indentations are defined by at least one plane with an Si(1,1,1) lattice orientation; anda solid-state lighting (SSL) structure carried by the silicon substrate, the SSL structure having an N-type gallium nitride (GaN) material, a P-type GaN material spaced apart from the N-type GaN material, and an indium gallium nitride (InGaN) material between the N-type GaN material and the P-type GaN material, wherein at least one of the N-type GaN, InGaN, and P-type GaN materials has a non-planar surface with a plurality of symmetric protrusions, wherein the symmetric protrusions are formed with tips, and wherein the symmetric protrusions at least partially reduce a total tensile stress among the N-type GaN, InGaN, and P-type GaN materials by at least partially canceling opposite tensile stresses at the tips along the non-planar surface. 10. The microelectronic assembly of claim 9 wherein the individual indentations include two adjacent Si(1,1,1) planes intersecting one another at a junction, the junction having an angle of about 72°. 11. The microelectronic assembly of claim 9 wherein the individual indentations include first and second planes having Si(1,1,1) lattice orientations and a third plane having an Si(1,0,0) lattice orientation, wherein the first and second planes form an angle of about 54° and 126° with the third plane, respectively. 12. The microelectronic assembly of claim 9 wherein the N-type GaN, InGaN, and P-type GaN materials individually include a plurality of indentations at least generally conforming to the indentations of the silicon substrate. 13. The microelectronic assembly of claim 9 wherein at least one of the N-type GaN, InGaN, and P-type GaN materials includes a planar surface. 14. The microelectronic assembly of claim 9 wherein the N-type GaN, InGaN, and P-type GaN materials each have a generally constant thickness. 15. The microelectronic assembly of claim 9 wherein at least one of the N-type GaN, InGaN, and P-type GaN materials has a non-uniform thickness.