초록 ▼

An instrumented orthopaedic implant, such as an intramedullary (IM) nail, is disclosed. The implant has the capacity to provide an accurate measurement of the applied mechanical load across the implant. The implant includes sensors and associated electronic components located in recesses on the oute

An instrumented orthopaedic implant, such as an intramedullary (IM) nail, is disclosed. The implant has the capacity to provide an accurate measurement of the applied mechanical load across the implant. The implant includes sensors and associated electronic components located in recesses on the outer surface of the implant. The implant houses the sensing apparatus, the interface circuitry, the data transmitter, and the power receiver. The hermetically sealed housing is adapted for implantation in the body of a patient. The implant is used with a controller which communicates with it by telemetry, and there is an acting unit connected to the electronic components which is adapted to carry out a function based upon a condition detected by the sensors.

대표청구항 ▼

1. A telemetric orthopaedic implant system, the system comprising: a. an orthopaedic implant, the orthopaedic implant comprising: i. at least one sensor;ii. a first recess adapted to receive said at least one sensor;iii. an electronic component electrically connected to said at least one sensor, the

1. A telemetric orthopaedic implant system, the system comprising: a. an orthopaedic implant, the orthopaedic implant comprising: i. at least one sensor;ii. a first recess adapted to receive said at least one sensor;iii. an electronic component electrically connected to said at least one sensor, the electronic component including at least a power supply, a first transmitter, a first receiver, and a first microprocessor;iv. a second recess adapted to receive the electronic component;v. potting material to seal said first recess and said second recess;vi. a power source electrically connected to said electronic component; andvii. an acting unit electrically connected to said electronic component, said acting unit adapted to carry out a function based upon a condition; andb. a control unit, the control unit comprising: i. a second microprocessor;ii. a second transmitter electrically connected to said second microprocessor, the second transmitter adapted to send a signal to said first receiver of said electronic component; andiii. a second receiver electrically connected to said second microprocessor, the second receiver adapted to receive data from said first transmitter of said electronic component. 2. The telemetric orthopaedic implant system of claim 1, wherein said orthopaedic implant is an intramedullary nail. 3. The telemetric orthopaedic implant system of claim 1, wherein said at least one sensor is selected from the group consisting of a foil strain gauge, a semi-conductor strain gauge, a vibrating beam sensor, a force sensor, a piezoelectric element, a fibre Bragg grating, and a giant magneto-impedance (GMI) sensor. 4. The telemetric orthopaedic implant system of claim 1, wherein said control unit further comprises a graphical user interface. 5. The telemetric orthopaedic implant system of claim 1, wherein said orthopaedic implant further comprises a cap insert. 6. The telemetric orthopaedic implant system of claim 1, wherein said first transmitter and said first receiver are combined into a single first transceiver, and second transmitter and second receiver are combined into a single second transceiver. 7. The telemetric orthopaedic implant system of claim 1, further comprising a handheld device. 8. The telemetric orthopaedic implant system of claim 1, further comprising a reader. 9. The telemetric orthopaedic implant system of claim 1, further comprising a computing device. 10. The telemetric orthopaedic implant system of claim 1, further comprising a gait analysis tool. 11. The telemetric orthopaedic implant system of claim 1, wherein said function is delivery of a stored deliverable. 12. The telemetric orthopaedic implant system of claim 1, wherein said condition is based upon data acquired by said at least one sensor. 13. The telemetric orthopaedic implant system of claim 1, wherein said condition is based upon a command provided by said control unit. 14. The telemetric orthopaedic implant system of claim 1, wherein said at least one sensor is selected from the group consisting of a strain gauge, a pH sensor, a temperature sensor, a pressure sensor, a flow sensor, an accelerometer, a gyroscope, an acoustic sensor, a voltage sensor, a pulse meter, an image capturing device, a biomarker indicator, chemical detector, and a biologic indicator. 15. The telemetric orthopaedic implant system of claim 14, wherein said a biomarker indicator is a specific protein indicator. 16. The telemetric orthopaedic implant system of claim 14, wherein said chemical detector is selected from the group consisting of an oxygen detector, an oxygen potential detector, and a carbon dioxide detector. 17. The telemetric orthopaedic implant system of claim 1, wherein said power source is selected from the group consisting of a battery, an energy scavenging device, and an inductive power source. 18. The telemetric orthopaedic implant system of claim 17, wherein said energy scavenging device is selected from the group consisting of a motion powered piezoelectric device and an electromagnetic generator. 19. The telemetric orthopaedic implant system of claim 17, further comprising a charge storage device electrically connected to said energy scavenging device. 20. The telemetric orthopaedic implant system of claim 18, further comprising a charge storage device electrically connected to said energy scavenging device.