Condenser fin structures facilitating vapor condensation cooling of coolant
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F28F-007/00
F28D-015/00
H01L-023/34
H05K-007/20
출원번호
US-0491286
(2009-06-25)
등록번호
US-8490679
(2013-07-23)
발명자
/ 주소
Campbell, Levi A.
Chu, Richard C.
Ellsworth, Jr., Michael J.
Iyengar, Madhusudan K.
Simons, Robert E.
출원인 / 주소
International Business Machines Corporation
대리인 / 주소
Jung, Esq., Dennis
인용정보
피인용 횟수 :
6인용 특허 :
82
초록▼
Vapor condensers and cooling apparatuses to facilitate vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vap
Vapor condensers and cooling apparatuses to facilitate vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel.
대표청구항▼
1. A cooling apparatus comprising: a vapor condenser, the vapor condenser comprising: a thermally conductive base structure having an operational orientation when the vapor condenser is facilitating vapor condensate formation; andat least one thermally conductive condenser fin extending from the the
1. A cooling apparatus comprising: a vapor condenser, the vapor condenser comprising: a thermally conductive base structure having an operational orientation when the vapor condenser is facilitating vapor condensate formation; andat least one thermally conductive condenser fin extending from the thermally conductive base structure a length L, the at least one thermally conductive condenser fin having a varying transverse cross-sectional perimeter along at least a portion of its length L, wherein the transverse cross-sectional perimeter of the at least one thermally conductive condenser fin is configured to increase in a direction of condensate travel along the at least a portion of the at least one thermally conductive condenser fin when the thermally conductive base structure is in the operational orientation and the vapor condenser is facilitating vapor condensate formation. 2. The cooling apparatus of claim 1, wherein the at least one thermally conductive condenser fin has a uniformly changing transverse cross-sectional perimeter along its length L from a proximal end adjacent to the thermally conductive base structure to a remote end remote from the thermally conductive base structure, and wherein the direction of condensate travel is away from the proximal end and towards the remote end of the at least one thermally conductive condenser fin. 3. The cooling apparatus of claim 2, wherein the operational orientation of the thermally conductive base structure is horizontal, and the at least one thermally conductive condenser fin depends downward vertically from the thermally conductive base structure. 4. The cooling apparatus of claim 2, wherein the operational orientation of the thermally conductive base structure is vertical, and the at least one thermally conductive condenser fin extends partially downward from the vertically-oriented, thermally conductive base structure, and wherein the at least one thermally conductive condenser fin has a uniformly increasing transverse cross-sectional perimeter from a proximal end of the at least one thermally conductive condenser fin adjacent to the thermally conductive base structure to a remote end remote from the thermally conductive base structure. 5. The cooling apparatus of claim 1, wherein the operational orientation of the thermally conductive base structure is vertical, and the at least one thermally conductive condenser fin has a uniformly decreasing transverse cross-sectional perimeter from a proximal end of the at least one thermally conductive condenser fin adjacent to the thermally conductive base structure to a remote end remote from the thermally conductive base structure, and wherein the at least one thermally conductive condenser fin extends partially upwards from the vertically-oriented, thermally conductive base structure. 6. The cooling apparatus of claim 1, wherein the transverse cross-sectional perimeter of the at least one thermally conductive condenser fin is one of rectangular-shaped, square-shaped or circular-shaped along at least a portion of its length L. 7. The cooling apparatus of claim 1, wherein the varying transverse cross-sectional perimeter along the at least a portion of the at least one thermally conductive condenser fin's length L is configured to increase a heat transfer coefficient of the at least one thermally conductive condenser fin at the at least a portion thereof by reducing a thickness of a liquid condensate film on a surface of the at least one thermally conductive condenser fin when vapor condensate is forming on the vapor condenser. 8. The cooling apparatus of claim 1, further comprising a plurality of thermally conductive condenser pin-fins extending from the thermally conductive base structure, each thermally conductive condenser pin-fin of the plurality of thermally conductive condenser pin-fins having a uniformly varying transverse cross-sectional perimeter along the at least a portion its length L, wherein the uniformly varying transverse cross-sectional perimeters of the plurality of thermally conductive condenser pin-fins increase in the direction of condensate travel when the thermally conductive base structure is in the operational orientation and the vapor condenser is facilitating vapor condensate formation. 9. A cooling apparatus comprising: a housing configured to at least partially surround and form a sealed compartment about an electronic device to be cooled;a dielectric fluid disposed within the sealed compartment, wherein the electronic device to be cooled is at least partially immersed within the dielectric fluid; anda vapor condenser, the vapor condenser comprising a thermally conductive base structure and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure into the sealed compartment in an upper portion of the sealed compartment, the plurality of thermally conductive condenser fins facilitating cooling of dielectric fluid vapor rising to the upper portion of the sealed compartment, and wherein at least one thermally conductive condenser fin of the plurality of thermally conductive condenser fins has a varying transverse cross-sectional perimeter along at least a portion of its length, the transverse cross-sectional perimeter of the at least one thermally conductive condenser fin increasing in a direction of condensate travel along the at least a portion of the at least one thermally conductive condenser fin, the increasing transverse cross-sectional perimeter being pre-configured to reduce a thickness of dielectric fluid condensate film forming on the at least one thermally conductive condenser fin. 10. The cooling apparatus of claim 9, wherein the operational orientation of the thermally conductive base structure is horizontal, and the plurality of thermally conductive condenser fins depend downward vertically from the thermally conductive base structure. 11. The cooling apparatus of claim 10, wherein the plurality of thermally conductive condenser fins each extend from the thermally conductive base structure a length L into the sealed compartment, and wherein each thermally conductive condenser fin has a varying transverse cross-sectional perimeter along at least a portion of the thermally conductive condenser fin. 12. The cooling apparatus of claim 11, wherein each thermally conductive condenser fin of the plurality of thermally conductive condenser fins has a uniformly varying transverse cross-sectional perimeter from a proximal end adjacent to the thermally conductive base structure to a remote end remote from the thermally conductive base structure, and wherein the transverse cross-sectional perimeter of each thermally conductive condenser fin is one of rectangular-shaped, square-shaped or circular-shaped. 13. The cooling apparatus of claim 9, wherein the transverse cross-sectional perimeter of the plurality of thermally conductive condenser fins is one of rectangular-shaped or square-shaped, and at least one surface of the at least one thermally conductive condenser fin of the plurality of thermally conductive condenser fins has an increasing surface area from a proximal end of the at least one thermally conductive condenser fin adjacent to the thermally conductive base structure to a remote end remote from the thermally conductive base structure. 14. The cooling apparatus of claim 9, wherein the thermally conductive base structure forms a top wall of the housing, and wherein the top wall of the housing is coupled to a liquid-cooled cold plate or an air-cooled heat sink for cooling the plurality of thermally conductive condenser fins, and wherein the cooling apparatus further comprises at least one pump disposed within the sealed compartment for actively pumping dielectric fluid disposed within the sealed compartment towards the electronic device to be cooled to facilitate cooling of the electronic device.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (82)
Berenholz Jack (Lexington MA) Bowman John K. (Brighton MA), Air cooled heat exchanger for multi-chip assemblies.
Hamadah Talal T. (Littleton MA) Ryder Douglas N. (Amherst NH) Friedman Harvey S. (Sudbury MA), Apparatus for controlled air-impingement module cooling.
Bortolini, James R.; Farleigh, Scott E.; Grimes, Gary J.; Nyquist, Jean S.; Sherman, Charles J., Arrangement for liquid cooling an electrical assembly using assisted flow.
Dereje Agonafer ; Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof.
Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof.
Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Coolant control unit, and cooled electronics system and method employing the same.
Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Electronic module with integral refrigerant evaporator assembly and control system therefore.
Berndlmaier Erich (Wappingers Falls NY) Clark Bernard T. (Poughquag NY) Dorler Jack A. (Wappingers Falls NY), Heat transfer structure for integrated circuit package.
Campbell,Levi A.; Chu,Richard C.; Ellsworth,Michael J.; Iyengar,Madhusudan K.; Porter,Donald W.; Schmidt,Roger R.; Simons,Robert E., Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing.
Hurley James R. (East Weymouth MA) Birkner Joseph R. (West Peabody MA) Nunes Maurice (Arlington MA), Jet impingement/radiation gas-fired cooking range.
Torres, Jr., Robert; Vininski, Joseph V.; Giagnacova, Joseph; Yucelen, Belgin, Method and apparatus for the delivery of liquefied gases having constant impurity levels.
Brunet Patrice (Courbevoie FRX) Avignon Gilles (Argenteuil FRX) Heron Franck (Antony FRX), System for dissipating heat energy generated by an electronic component and sealed enclosure used in a system of this ki.
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Pump-enhanced, immersion-cooling of electronic compnent(s).
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Pump-enhanced, immersion-cooling of electronic component(s).
※ AI-Helper는 부적절한 답변을 할 수 있습니다.