초록 ▼

A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an e

A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an exterior side wall of the package. A recess may be defined in the exterior side wall to receive a bent portion of an electrical lead. A body structure cavity may be bounded by a floor, and side wall portions and end wall portions that are separated by transition wall portions including a curved or segmented upper edge, with different wall portions being disposed at different angles of inclination.

대표청구항 ▼

1. A light emission package adapted for use with at least one solid state emitter, the package comprising: a leadframe defining at least one electrical lead;a body structure encasing at least a portion of the leadframe, the body structure defining a cavity and at least one exterior side wall; andat

1. A light emission package adapted for use with at least one solid state emitter, the package comprising: a leadframe defining at least one electrical lead;a body structure encasing at least a portion of the leadframe, the body structure defining a cavity and at least one exterior side wall; andat least one solid state emitter disposed within the cavity;wherein a first electrical lead of the at least one electrical lead includes a plurality of first electrical lead segments extending through the at least one exterior side wall, wherein each first electrical lead segment is separated from each other first electrical lead segment along the at least one exterior side wall by at least one first aperture, and at least a portion of the at least one first aperture is disposed outside the at least one exterior wall. 2. The light emission package of claim 1, wherein the at least one first aperture comprises a plurality of first apertures. 3. The light emission package of claim 1, wherein the at least a portion of the at least one first aperture is filled with body material within the body structure. 4. The light emission package of claim 1, wherein the at least one electrical lead comprises a second electrical lead, and the second electrical lead includes a plurality of second electrical lead segments extending through the at least one exterior side wall, wherein each second electrical lead segment is separated from each other second electrical lead segment along the exterior side wall by at least one second aperture, and at least a portion of the at least one second aperture is disposed outside the at least one exterior wall. 5. The light emission package of claim 4, wherein the first electrical lead extends through a first exterior side wall of the at least one exterior side wall, and the second electrical lead extends through a second exterior side wall of the at least one exterior side wall. 6. The light emission package of claim 1, wherein the at least one electrical lead comprises a bent portion. 7. The light emission package of claim 6, wherein the at least one exterior side wall defines at least one recess arranged to receive the bent portion of the at least one electrical lead. 8. The light emission package of claim 7, wherein the at least one electrical lead includes a distal portion extending away from the at least one exterior side wall in a direction outward from a center portion of the package. 9. The light emission package of claim 1, further comprising a heatsink element adapted to conduct heat away from at least one solid state emitter, wherein the heatsink element is retained by the body structure. 10. The light emission package of claim 9, wherein the heatsink element has an average thickness that is substantially greater than an average thickness of the leadframe. 11. The light emission package of claim 9, wherein the body structure is formed by molding to encase at least a portion of the leadframe and to contact the heatsink element. 12. The light emission package of claim 9, wherein the heatsink element is electrically isolated from the at least one electrical lead. 13. The light emission package of claim 7, wherein the recess arranged to receive the bent portion comprises a depth relative to the exterior side wall. 14. The light emission package of claim 1, comprising an electrostatic discharge protection device in electrical communication with the at least one solid state emitter. 15. The light emission package of claim 1, further comprising a submount, wherein the at least one solid state emitter is mounted to the submount. 16. A lighting apparatus comprising at least one light emission package according to claim 1. 17. A light emission package adapted for use with at least one solid state emitter, the package comprising: a leadframe defining at least one electrical lead; anda body structure encasing at least a portion of the leadframe, the body structure defining at least one exterior side wall;wherein the at least one electrical lead extends through the at least one exterior side wall; andwherein the at least one exterior side wall defines at least one recess arranged to receive a bent portion of the at least one electrical lead. 18. The light emission package of claim 17, wherein the at least one electrical lead includes a first electrical lead extending through a first exterior side wall of the at least one exterior side wall, and includes a second electrical lead extending through a second exterior side wall of the at least one exterior side wall. 19. The light emission package of claim 17, wherein the at least one recess comprises a depth relative to the at least one exterior side wall, and the depth of the at least one recess is at least as large as an average thickness of the at least one electrical lead. 20. The light emission package of claim 17, wherein the at least one electrical lead includes a distal portion extending away from the at least one exterior side wall in a direction outward from a center portion of the package. 21. The light emission package of claim 17, wherein: a first electrical lead of the at least one electrical lead includes a plurality of first electrical lead segments extending through the at least one exterior side wall, wherein each first electrical lead segment is separated from each other first electrical lead segment along the at least one exterior side wall by at least one first aperture, and at least a portion of the at least one first aperture is disposed outside the at least one exterior wall. 22. The light emission package of claim 17, further comprising a heatsink element adapted to conduct heat away from at least one solid state emitter, wherein the heatsink element is retained by the body structure. 23. The light emission package of claim 22, wherein the heatsink element has an average thickness that is substantially greater than an average thickness of the leadframe. 24. The light emission package of claim 22, wherein the body structure is formed by molding to encase at least a portion of the leadframe and contact the heatsink element. 25. The light emission package of claim 22, wherein the heatsink element is electrically isolated from the plurality of electrical leads. 26. The light emission package of claim 17, wherein the body structure defines a cavity, and the package further comprises at least one solid state emitter disposed within the cavity. 27. The light emission package of claim 26, comprising an electrostatic discharge protection device in electrical communication with the at least one solid state emitter. 28. The light emission package of claim 26, further comprising a submount, wherein the at least one solid state emitter is mounted to the submount. 29. A lighting apparatus comprising at least one light emission package according to claim 17. 30. The light emission package of claim 17, wherein the first electrical lead extends from a center portion of the body structure. 31. The light emission package of claim 30, wherein the recess is located adjacent to where the first electrical extends from the body structure, and the recess comprises a depth relative to the exterior side wall.