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A method of preparing an apparatus for material processing by generating optical breakthroughs in an object. The apparatus includes a variable focus adjustment device. A contact element is mounted to the apparatus, the contact element has a curved contact surface having a previously known shape. The

A method of preparing an apparatus for material processing by generating optical breakthroughs in an object. The apparatus includes a variable focus adjustment device. A contact element is mounted to the apparatus, the contact element has a curved contact surface having a previously known shape. The position of the contact surface is determined prior to processing the object, by focusing measurement laser radiation near or on the surface by the variable focus adjustment device, and the focus position is adjusted in a measurement surface intersecting the expected position of the contact surface. Radiation from the focus of the measurement laser radiation is confocally detected. The position of points of intersection between the measurement surface and the contact surface is determined from the confocally detected radiation to determine the position of the contact surface from the position of the points of intersection and the previously known shape of the contact surface.

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1. A method of preparing an apparatus for material processing by producing optical breakthroughs in or on an object, said apparatus comprising a variable three-dimensionally acting focus adjustment device for focusing pulsed processing laser radiation on different locations in or on the object, wher

1. A method of preparing an apparatus for material processing by producing optical breakthroughs in or on an object, said apparatus comprising a variable three-dimensionally acting focus adjustment device for focusing pulsed processing laser radiation on different locations in or on the object, wherein a contact element, which is transparent for the processing laser radiation and is to be placed on the object, is mounted to the apparatus, said contact element having, on its side to be placed on the object, a contact surface and, located opposite, an entry surface for the processing laser radiation, the contact surface having a known shape;prior to processing the object, the position of the contact surface with respect to the focus adjustment device is determined by irradiation of laser radiation on the contact surface, by focusing measurement laser radiation near or on the contact surface by the variable focus adjustment device, an energy density of the focused measurement laser radiation being too low to produce an optical breakthrough, and the focus of the measurement laser radiation being adjusted in a measurement surface which intersects the expected position of the contact surface, the method comprising:a) confocally detecting radiation scattered back or reflected back from the focus of the measurement laser radiation,b) detecting a position of points of intersection between the measurement surface and the contact surface from the confocally detected radiation and the assigned setting of the variable focus adjustment device,c) repeating the confocally detecting step, if necessary, with a modified measurement surface until a determined number of points of intersection have been detected,d) determining the position of the contact surface from the position of the points of intersection and the previously known shape of the contact surface. 2. The method as claimed in claim 1, wherein the modified measurement surface is modified by shifting it from the measurement surface. 3. The method as claimed in claim 1, wherein the contact surface is non-spherical and the position is determined also with respect to a tilt of the contact surface relative to the optical axis. 4. The method as claimed in claim 1, wherein the focus position is shifted along a path curve which is located in the measurement surface. 5. The method as claimed in claim 1, wherein the measurement surface is cylinder-symmetric to the main optical axis of the processing laser beam. 6. The method as claimed in claim 1, wherein the measurement surface has the shape of a cylinder shell or of a circular disk. 7. The method as claimed in claim 1, wherein the measurement radiation is pulsed with a pulse energy EPULS<300 nJ. 8. The method as claimed in claim 7, wherein the focus position is shifted along a path curve which is located in the measurement surface, has a maximum extent 0 and a pulse frequency f for which f<20 Hz*((D/EPULS)*(1 μJ/1 mm)4)holds true. 9. The method as claimed in claim 1, wherein a path curve is used which is located in the measurement surface and has a maximum extent 0 of between 1 urn and 15 mm. 10. The method as claimed in claim 1, wherein the measurement laser radiation is provided by a pulsed laser radiation source, which also generates the processing laser radiation, by controlling the radiation source in a mode of reduced pulse energy or by activating or inserting, respectively, an energy attenuator in the beam path of the processing laser radiation. 11. The method as claimed in claim 1, wherein steps a)-d) of claim 1 are carried out after the contact element has been fixed with respect to the focus adjustment device, but before the contact element is placed on the object. 12. The method as claimed claim 1, wherein the contact surface is covered, during irradiation of the measurement laser radiation. 13. The method as claimed in claim 12, wherein the contact surface is covered in a contactless manner. 14. The method as claimed in claim 1, wherein, for a curved surface, the position of a vertex of the surface is determined and is stored as a reference point for the subsequent material processing. 15. The method as claimed in claim 14, wherein the shape of the surface is previously known to belong to a group of several different shapes, each known with respect to its exact geometry, and further comprising determining the position of a surface edge and, based on the relative position of the edge and of a vertex, determining the shape from the group of shapes which the surface has. 16. A material processing apparatus, comprising a processing laser which provides pulsed processing laser radiation;an optical device for focusing the processing laser radiation in or on an object to be processed such that optical breakthroughs form proximate the focus;a focus adjustment device for variable adjustment of the focus position in or on the object,a contact element mountable to the apparatus, that is to be placed on the object and which comprises a contact surface to be placed on the object and, opposite the contact surface, an entry surface for the processing laser radiation, the contact surface having a previously known shape;a control device for determining the position of the contact surface after mounting of the contact element and before processing of the object, the control device controlling the processing laser and the focus adjustment device;a measurement laser radiation source, likewise controlled by the control device, to emit measurement laser radiation, the measurement laser radiation from the radiation source passing through the focus adjustment device and through the optical device and causing no optical breakthroughs in the focus, wherein the control device, to determine the position of the surface, shifts the focus of the measurement laser radiation in a measurement surface intersecting the expected position of the surface;a confocal detector device which confocally detects radiation scattered back or reflected back from the focus of the measurement laser radiation and supplies measurement signals to the control device, andwherein the control device determines the position of points of intersection between the measurement surface and the surface on the basis of the measurement signals, said control device varying, the measurement surface, if necessary, in case there are no or too few points of intersection, and determining, on the basis of the position of the points of intersection and the previously known shape of the surface, the position of said surface. 17. The apparatus as claimed in claim 16, wherein varying the measurement surface comprises shifting the measurement surface. 18. The apparatus as claimed in claim 16, wherein the control device controls the apparatus for carrying out the method according to claim 1. 19. The apparatus as claimed in claim 16, further comprising a covering mechanism which covers the contact element at the contact surface for absorption of transmitted measurement laser radiation. 20. The apparatus as claimed in claim 16, wherein the measurement laser radiation is pulsed and the pulse energy is between 2 nJ and 300 nJ. 21. The apparatus as claimed in claim 16, wherein the measurement laser radiation source is provided by the processing laser radiation source being controlled in a mode of operation for emission of low-energy laser radiation pulses.