초록 ▼

A method for forming a fritted cover sheet includes providing a substrate and depositing an initial frit bead on the substrate. Thereafter, at least one additional frit bead is deposited on the substrate such that a base of the at least one additional frit bead contacts a base of an adjacent frit be

A method for forming a fritted cover sheet includes providing a substrate and depositing an initial frit bead on the substrate. Thereafter, at least one additional frit bead is deposited on the substrate such that a base of the at least one additional frit bead contacts a base of an adjacent frit bead thereby forming a frit seal on the substrate.

대표청구항 ▼

1. A method for forming a fritted cover sheet comprising: providing a glass substrate;depositing an initial frit bead on the substrate to form a contiguous circuit defining a perimeter around a sealing area on the substrate; anddepositing at least one additional frit bead on the substrate along the

1. A method for forming a fritted cover sheet comprising: providing a glass substrate;depositing an initial frit bead on the substrate to form a contiguous circuit defining a perimeter around a sealing area on the substrate; anddepositing at least one additional frit bead on the substrate along the contiguous circuit and adjacent to a previously deposited frit bead such that a base of the at least one additional frit bead overlaps a base of the respective adjacent frit bead thereby forming a frit seal on the substrate;wherein the initial frit bead and the at least one additional frit bead have sidewalls which taper from the base towards a top surface of the respective frit bead. 2. The method of claim 1 wherein a width of the initial frit bead is less than about 1 mm and a width of the at least one additional frit bead is less than about 1 mm. 3. The method of claim 1 wherein a width of the frit seal is at least 1 mm. 4. The method of claim 1 wherein a top surface of the frit seal has variance in height of about +/−5.0 microns across the width of the frit seal. 5. The method of claim 1 wherein the base of the at least one additional frit bead overlaps the base of an adjacent frit bead by at least about 0.05 mm. 6. The method of claim 1 wherein the frit seal comprises at least three primary frit peaks and a spacing between adjacent primary frit peaks is less than about 1 mm. 7. The method of claim 1 wherein the frit seal is formed in a pattern which comprises a curved portion. 8. The method of claim 7 further comprising: selecting an inner radius of curvature of the frit seal in the curved portion of the pattern;selecting a frit bead width;selecting an overlap amount;calculating centerline radii for the initial frit bead and the at least one additional frit bead in the curved portion of the pattern based on the inner radius, the frit bead width and the overlap amount; andforming the curved portion of the pattern by depositing the initial frit bead and at least one additional frit bead with the selected frit bead width and calculated centerline radii. 9. The method of claim 7 further comprising: selecting a frit seal width;selecting a number of frit bead deposition passes, wherein the number of frit bead deposition passes is at least 2;selecting an inner radius of curvature of the frit seal in the curved portion of the pattern;selecting an overlap amount; calculating a frit bead width for the initial frit bead and the at least one additional frit bead in the curved portion of the pattern based on the inner radius of curvature, the overall width of the frit seal, the number of frit bead deposition passes and the overlap amount;calculating centerline radii for the initial frit bead and the at least one additional frit bead based on the calculated frit bead width and the selected inner radius of curvature; andforming tile curved portion of the pattern by depositing the initial flit bead and the at least one additional frit bead with the calculated centerline radii. 10. A method for forming a glass package comprising: providing a first glass substrate and a glass second substrate;depositing an initial frit bead on the first substrate to form a contiguous circuit defining a perimeter around a sealing area on the first substrate;depositing a second frit bead on the first substrate along the contiguous circuit and adjacent to the initial frit bead such that a base of the second frit bead overlaps a base of the initial frit bead to form a frame-like frit seal on the first substrate;wherein the initial frit bead and the second frit bead have sidewalls which taper from the base towards a top surface of the respective frit bead;positioning the first substrate on the second substrate such that the frit seal is disposed between the first substrate and the second substrate; and heating the frit seal to form a seal between the first substrate and the second substrate. 11. The method of claim 10 wherein an overlap between the second frit bead and the initial frit bead is at least 0.05 ram. 12. The method of claim 10 wherein the frit seal has a width greater than about 1 mm. 13. The method of claim 10 wherein the heating the frit seal comprises directing radiant energy onto the frit seal through the first substrate, wherein the first substrate is substantially transparent to at least one wavelength of radiant energy directed onto the frit seal. 14. The method of claim 10 wherein the second substrate comprises at least one electroluminescent device and, when the first substrate is positioned on the second substrate, the electroluminescent device is positioned within an area defined by the frame-like frit seal.