IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0879496
(2010-09-10)
|
등록번호 |
US-8505432
(2013-08-13)
|
발명자
/ 주소 |
- Kidd, Julie A.
- Fuller, Michael E.
|
출원인 / 주소 |
- Alliant Techsystems, Inc.
|
대리인 / 주소 |
Fitch, Even, Tabin & Flannery, LLP
|
인용정보 |
피인용 횟수 :
3 인용 특허 :
80 |
초록
▼
A multilayer backing composite for armor plate systems. One embodiment provides a ceramic layer and a bonded multilayer backing layer bonded to the ceramic layer. The backing layer can be formed from at least two layers each of alternating elastomeric interstitial layers and UHMWPE layers having an
A multilayer backing composite for armor plate systems. One embodiment provides a ceramic layer and a bonded multilayer backing layer bonded to the ceramic layer. The backing layer can be formed from at least two layers each of alternating elastomeric interstitial layers and UHMWPE layers having an areal density in the range of about 125 to 400 g/m2. The areal density of the stack can be in the range of about 4 to 15 lbs/ft2, and specifically about 6.98 lbs/ft2. In some embodiments, at least one of the at least two UHMWPE layers nearer to the ceramic layer of the stack can have a lower areal density than at least one layer further from the ceramic layer. The ceramic layer can be SiC and 0.280″ thick; each rubber layer can be about 0.01″; and each UHMWPE layer can be about 0.15″.
대표청구항
▼
1. A bonded multilayer armor stack, comprising: a ceramic layer; anda bonded multilayer backing layer bonded to the ceramic layer, wherein the backing layer is formed from at least two layers each comprised of alternating elastomeric interstitial layers and UHMWPE layers having an areal density in t
1. A bonded multilayer armor stack, comprising: a ceramic layer; anda bonded multilayer backing layer bonded to the ceramic layer, wherein the backing layer is formed from at least two layers each comprised of alternating elastomeric interstitial layers and UHMWPE layers having an areal density in the range of about 125 to 400 g/m2. 2. The armor stack of claim 1, wherein the backing layer is formed from four layers in which each of the four layers is comprised of alternating rubber interstitial layers and UHMWPE layers. 3. The armor stack of claim 1, wherein the areal density of the stack is in the range of about 4 to 15 lbs/ft2. 4. The armor stack of claim 3, wherein the areal density is about 6.98 lbs/ft2. 5. The armor stack of claim 1, wherein at least one of the at least two UHMWPE layers nearer to the ceramic layer of the stack has a lower areal density than at least one layer further from the ceramic layer. 6. The armor stack of claim 5, wherein the elastomeric interstitial layer is a silica filled nitrile butadiene rubber (SFNBR). 7. The armor stack of claim 1, wherein the ceramic layer is SiC and 0.280″ thick; each rubber layer is about 0.01″; and each UHMWPE layer is about 0.15″. 8. The armor stack of claim 1, wherein the elastomeric interstitial layer is a silica filled nitrile butadiene rubber (SFNBR). 9. The armor stack of claim 1, wherein the backing layer is bonded to the ceramic layer by an epoxy paste adhesive. 10. Armor comprising a plurality of bonded multilayer stacks according to claim 1. 11. A bonded multilayer armor stack having an exposed strike face, said armor stack comprising: a ceramic layer having a rear face and a front face, said exposed strike face formed from at least a part of said front face; anda bonded multilayer backing layer bonded to the rear face of said ceramic layer, said backing layer comprised of least two further layers, said two further layers each comprising an alternating elastomeric interstitial layer and an ultra high molecular weight polyethylene layer, and having an areal density in the range of about 125 to 400 g/m2. 12. The armor stack according to claim 11, wherein at least one of the at least two ultra high molecular weight layers nearer to the ceramic layer in the stack has a lower areal density than the at least one ultra high molecular weight polyethylene layer that further from the ceramic layer. 13. The armor stack of claim 12, wherein the elastomeric interstitial layer is a silica filled nitrile butadiene rubber (SFNBR). 14. The armor stack according to claim 11, wherein the elastomeric interstitial layer is a silica filled nitrile butadiene rubber (SFNBR). 15. The armor stack according to claim 11, wherein in the bonded multilayer armor stack an adhesive bonds the rear face of said ceramic layer to said backing layer. 16. Armor comprising a plurality of bonded multilayer stacks according to claim 11. 17. A bonded multilayer armor stack having an exposed strike face, said armor stack comprising: a ceramic layer having a rear face, a front face, and at least one peripheral edge, said exposed strike face formed from at least a part of said front face;an elastomeric coating layer having a first face layer and a second face layer, wherein said rear face and, optionally, at least one said peripheral edge, of said ceramic layer is coated with one of the two faces of said elastomeric coating layer; anda bonded multilayer backing layer bonded to the other of the two faces of said elastomeric coating layer, said backing layer comprised of least two further layers, said two further layers each comprising, in alternating sub-layers, an elastomeric interstitial layer and an ultra high molecular weight polyethylene layer, and having an areal density in the range of about 125 to 400 g/m2. 18. The armor stack according to claim 17, wherein in said multilayer backing layer said interstitial elastomeric layers comprise a rubber layer. 19. The armor stack of claim 17, wherein at least one of the at least two ultra high molecular weight layers nearer to the ceramic layer in the stack has a lower areal density than the at least one ultra high molecular weight polyethylene layer that further from the ceramic layer. 20. The armor stack of claim 19, wherein the elastomeric interstitial layer is a silica filled nitrile butadiene rubber (SFNBR).
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