IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0997212
(2009-06-01)
|
등록번호 |
US-8507587
(2013-08-13)
|
국제출원번호 |
PCT/US2009/045778
(2009-06-01)
|
§371/§102 date |
20101209
(20101209)
|
국제공개번호 |
WO2009/151988
(2009-12-17)
|
발명자
/ 주소 |
- Gozum, John E.
- Mallo, Richard A.
|
출원인 / 주소 |
- 3M Innovative Properties Company
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
6 인용 특허 :
10 |
초록
▼
Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In
Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more organic ether smoothing agents.
대표청구항
▼
1. A wall repair compound, comprising, from about 20 percent to about 80 percent by weight aqueous latex binder emulsion;from about 20 percent to about 70 percent by weight of an inorganic filler system, wherein the inorganic filler system is comprised of essentially 100 percent by weight synthetic
1. A wall repair compound, comprising, from about 20 percent to about 80 percent by weight aqueous latex binder emulsion;from about 20 percent to about 70 percent by weight of an inorganic filler system, wherein the inorganic filler system is comprised of essentially 100 percent by weight synthetic inorganic filler that comprises substantially spherical synthetic particles and wherein the particles comprise a set of relatively large diameter glass bubbles and a set of relatively small ceramic microspheres, with the ratio of the median particle size of the glass bubbles to the median particle size of the ceramic microspheres being in the range of about 5:1 to about 40:1;from about 0.025 percent to about 2.5 percent by weight of at least one organic ether smoothing agent that comprises at least one ether linkage and that comprises no more than one hydroxyl group; and,less than about 0.1 percent by weight of organic polymeric thickener. 2. The compound of claim 1 wherein the ratio of the median particle size of the glass bubbles to the median particle size of the ceramic microspheres is in the range of from about 10:1 to about 30:1. 3. The compound of claim 1 wherein the median particle size of the glass bubbles is in the range of from about 30 microns to about 65 microns, and the median particle size of the ceramic microspheres is in the range of from about 2 microns to about 10 microns. 4. The compound of claim 1 wherein the weight ratio of the glass bubbles to the ceramic microspheres is from about 1:1 to about 3:1. 5. The compound of claim 1 wherein the synthetic inorganic filler comprises less than about 0.5 percent by weight crystalline material. 6. The compound of claim 1 wherein the inorganic filler system comprises from about 30 percent to about 60 percent by weight of the compound. 7. The compound of claim 6 wherein the inorganic filler system comprises from about 40 percent to about 50 percent by weight of the compound. 8. The compound of claim 1 wherein the organic ether smoothing agent is present at from about 0.05 percent to about 1.5 percent by weight of the compound. 9. The compound of claim 8 wherein the organic ether smoothing agent is present at from about 0.15 percent to about 0.5 percent by weight of the compound. 10. The compound of claim 1 wherein the at least one organic ether smoothing agent comprises exactly one hydroxyl group and exactly one ether linkage, and is selected from the group consisting of propylene glycol butyl ether, propylene glycol methyl ether, propylene glycol propyl ether, propylene glycol phenyl ether, ethylene glycol butyl ether, ethylene glycol propyl ether, ethylene glycol hexyl ether, and ethylene glycol phenyl ether, and mixtures thereof. 11. The compound of claim 1 wherein the at least one organic ether smoothing agent comprises exactly one hydroxyl group and exactly two ether linkages, and is selected from the group consisting of dipropylene glycol butyl ether, dipropylene glycol methyl ether, dipropylene glycol propyl ether, diethylene glycol butyl ether, diethylene glycol methyl ether, diethylene glycol hexyl ether, and diethylene glycol ethyl ether, and mixtures thereof, and mixtures thereof with organic ethers that comprise exactly one ether linkage. 12. The compound of claim 1 wherein the at least one organic ether smoothing agent comprises exactly one hydroxyl group and exactly three ether groups, and is selected from the group consisting of tripropylene glycol methyl ether, triethylene glycol butyl ether, triethylene glycol ethyl ether, triethylene glycol methyl ether, mixtures thereof, and mixtures thereof with organic ethers that comprises one or two ether linkages. 13. The compound of claim 1 wherein the at least one organic ether smoothing agent comprises no hydroxyl groups and at least one ether linkage, and is selected from the group consisting of dipropylene glycol dimethyl ether, propylene glycol methyl ether acetate, dipropylene glycol methyl ether acetate, ethylene glycol butyl ether acetate, diethylene glycol butyl ether acetate, mixtures thereof, and mixtures thereof with organic ethers that contain exactly one hydroxyl group. 14. The compound of claim 1 wherein the compound comprises less than about 0.05 percent by weight of organic polymeric thickener. 15. The compound of claim 14 wherein the compound comprises less than about 0.02 percent by weight of organic polymeric thickener. 16. The compound of claim 1 wherein the compound comprises less than about 0.1 percent by weight of inorganic thickening filler clay. 17. The compound of claim 1 wherein the compound comprises less than about 0.1 percent by weight of low molecular weight polyhydroxy additive. 18. The compound of claim 1 wherein the aqueous latex binder emulsion comprises a binder with a glass transition temperature of between 15° C. and 35° C. 19. The compound of claim 18 wherein the aqueous latex binder emulsion comprises a binder with a glass transition temperature of between 20° C. and 30° C. 20. The compound of claim 1 wherein the aqueous latex binder emulsion comprises from about 30 percent by weight to about 70 percent by weight of the compound. 21. The compound of claim 20 wherein the aqueous latex binder emulsion comprises from about 40 percent by weight to about 60 percent by weight of the compound. 22. The compound of claim 1 wherein the aqueous latex binder emulsion comprises an acrylic binder. 23. The compound of claim 1 further comprising from about 0.1 percent to about 0.8 percent by weight of preservative. 24. The compound of claim 1 further comprising one or more dust reducing additives chosen from the group consisting of oils, waxes and mixtures thereof. 25. A wall repair compound, comprising, from about 20 percent to about 80 percent by weight aqueous latex binder emulsion;from about 20 percent to about 70 percent by weight of an inorganic filler system, wherein the inorganic filler system is comprised of essentially 100 percent by weight synthetic inorganic filler;from about 0.05 percent to about 1.5 percent by weight of at least one organic ether smoothing agent that comprises at least one ether linkage and that comprises no more than one hydroxyl group; and,less than about 0.1 percent by weight of organic polymeric thickener. 26. The compound of claim 25 wherein the inorganic filler system comprises from about 30 percent to about 60 percent by weight of the compound. 27. The compound of claim 25 wherein the at least one organic ether smoothing agent comprises exactly one hydroxyl group and exactly three ether groups, and is selected from the group consisting of tripropylene glycol methyl ether, triethylene glycol butyl ether, triethylene glycol ethyl ether, triethylene glycol methyl ether, mixtures thereof, and mixtures thereof with organic ethers that comprises one or two ether linkages. 28. The compound of claim 25 wherein the aqueous latex binder emulsion comprises an acrylic binder. 29. The compound of claim 25 further comprising one or more dust reducing additives chosen from the group consisting of oils, waxes and mixtures thereof. 30. A wall repair compound, comprising, from about 20 percent to about 80 percent by weight aqueous latex binder emulsion;from about 20 percent to about 70 percent by weight of an inorganic filler system, wherein the inorganic filler system is comprised of essentially 100 percent by weight synthetic inorganic filler;from about 0.025 percent to about 2.5 percent by weight of at least one organic ether smoothing agent that comprises exactly one hydroxyl group and exactly one ether linkage, and is selected from the group consisting of propylene glycol butyl ether, propylene glycol methyl ether, propylene glycol propyl ether, propylene glycol phenyl ether, ethylene glycol butyl ether, ethylene glycol propyl ether, ethylene glycol hexyl ether, and ethylene glycol phenyl ether, and mixtures thereof; and,less than about 0.1 percent by weight of organic polymeric thickener. 31. A wall repair compound, comprising, from about 20 percent to about 80 percent by weight aqueous latex binder emulsion;from about 20 percent to about 70 percent by weight of an inorganic filler system, wherein the inorganic filler system is comprised of essentially 100 percent by weight synthetic inorganic filler;from about 0.025 percent to about 2.5 percent by weight of at least one organic ether smoothing agent that comprises exactly one hydroxyl group and exactly two ether linkages, and is selected from the group consisting of dipropylene glycol butyl ether, dipropylene glycol methyl ether, dipropylene glycol propyl ether, diethylene glycol butyl ether, diethylene glycol methyl ether, diethylene glycol hexyl ether, and diethylene glycol ethyl ether, and mixtures thereof, and mixtures thereof with organic ethers that comprise exactly one ether linkage; and,less than about 0.1 percent by weight of organic polymeric thickener. 32. A wall repair compound, comprising, from about 20 percent to about 80 percent by weight aqueous latex binder emulsion;from about 20 percent to about 70 percent by weight of an inorganic filler system, wherein the inorganic filler system is comprised of essentially 100 percent by weight synthetic inorganic filler;from about 0.025 percent to about 2.5 percent by weight of at least one organic ether smoothing agent that comprises no hydroxyl groups and at least one ether linkage, and is selected from the group consisting of dipropylene glycol dimethyl ether, propylene glycol methyl ether acetate, dipropylene glycol methyl ether acetate, ethylene glycol butyl ether acetate, diethylene glycol butyl ether acetate, mixtures thereof, and mixtures thereof with organic ethers that contain exactly one hydroxyl group; and,less than about 0.1 percent by weight of organic polymeric thickener.
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