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Stacked assembly including plurality of stacked microelectronic elements

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/482
출원번호 US-0274815 (2011-10-17)
등록번호 US-8513794 (2013-08-20)
발명자 / 주소
  • Haba, Belgacem
  • Mohammed, Ilyas
출원인 / 주소
  • Tessera, Inc.
대리인 / 주소
    Lerner, David, Littenberg, Krumholz & Mentlik, LLP
인용정보 피인용 횟수 : 0  인용 특허 : 139

초록

A method is provided for fabricating a stacked microelectronic assembly by steps including stacking and joining first and second like microelectronic substrates, each including a plurality of like microelectronic elements attached together at dicing lanes. Each microelectronic element has boundaries

대표청구항

1. A stacked assembly including first and second stacked microelectronic elements, each of said first and second microelectronic elements having a first face, edges extending away from said first face and a plurality of traces extending along said first face towards said edges, wherein said first an

이 특허에 인용된 특허 (139)

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