Solid electrolytic capacitor containing a cathode termination with a slot for an adhesive
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01G-004/228
H01G-009/00
H01G-009/04
H01G-009/145
H01G-009/012
H01G-009/15
출원번호
US-0045588
(2011-03-11)
등록번호
US-8514550
(2013-08-20)
발명자
/ 주소
Vyroubal, Ales
출원인 / 주소
AVX Corporation
대리인 / 주소
Dority & Manning, P.A.
인용정보
피인용 횟수 :
1인용 특허 :
40
초록▼
A capacitor containing a solid electrolytic capacitor element that includes an anode, dielectric, and a cathode that includes a solid electrolyte is provided. An anode lead extends from the anode and is electrically connected to an anode termination. Likewise, a cathode termination is electrically c
A capacitor containing a solid electrolytic capacitor element that includes an anode, dielectric, and a cathode that includes a solid electrolyte is provided. An anode lead extends from the anode and is electrically connected to an anode termination. Likewise, a cathode termination is electrically connected to the cathode. The cathode termination contains a planar portion that is oriented generally parallel to a lower surface of the capacitor element. An interior slot is defined by the planar portion within which is disposed a conductive adhesive that connects the cathode termination to the capacitor element. By disposing the adhesive within a slot of a planar portion of the cathode termination, the present inventors have discovered that the tendency of the adhesive to bleed toward the edges of the termination can be limited. Among other things, this improves the mechanical stability of the capacitor upon encapsulation and also improves electrical performance.
대표청구항▼
1. A capacitor comprising: a capacitor element that defines an upper surface, lower surface, front surface, and rear surface, wherein the capacitor element includes an anode, dielectric layer overlying the anode, and a cathode overlying the dielectric layer that includes a solid electrolyte, and whe
1. A capacitor comprising: a capacitor element that defines an upper surface, lower surface, front surface, and rear surface, wherein the capacitor element includes an anode, dielectric layer overlying the anode, and a cathode overlying the dielectric layer that includes a solid electrolyte, and wherein an anode lead is electrically connected to the anode;a cathode termination that is electrically connected to the cathode and contains a planar portion oriented generally parallel to the lower surface of the capacitor element, wherein the planar portion defines a first slot within which a conductive adhesive is disposed, the conductive adhesive connecting the planar portion of the cathode termination to the capacitor element, wherein the planar portion of the cathode termination contains a first planar section that is folded vertically and disposed above a second planar section, wherein at least a portion of the first planar section is in contact with the second planar section, and further wherein the first slot is defined by at least the first planar section;an anode termination that is electrically connected to the anode lead, wherein the anode termination contains an upstanding portion positioned generally perpendicular to the lower surface of the capacitor element and a planar portion positioned generally parallel to the lower surface of the capacitor element, wherein the anode lead is electrically connected to the upstanding portion of the anode termination, and further wherein the upstanding portion of the anode termination defines a second slot for receiving the anode lead; anda molding material that encapsulates the capacitor element and leaves exposed at least a part of the anode termination and at least a part of the cathode termination. 2. The capacitor of claim 1, wherein the first slot has a profile that is generally rectangular-shaped or triangular-shaped. 3. The capacitor of claim 1, wherein the first slot has a generally circular cross-sectional dimension. 4. The capacitor of claim 1, wherein the first slot is defined in an interior of the planar portion of the cathode termination. 5. The capacitor of claim 1, wherein the first slot is defined in an interior of at least the first planar section. 6. The capacitor of claim 1, wherein the length of the first planar section is less than the length of the second planar section. 7. The capacitor of claim 6, wherein the slot is defined between an edge of the first planar section and an edge of the second planar section. 8. The capacitor of claim 1, wherein the first planar section is encapsulated by the molding material and wherein at least a part of the second planar section remains exposed. 9. The capacitor of claim 1, wherein the ratio of the thickness of the slot to the total thickness of the planar portion of the cathode termination is from about 0.2 to about 0.8. 10. The capacitor of claim 1, wherein the planar portion of the cathode termination is positioned adjacent to the lower surface of the capacitor element. 11. The capacitor of claim 1, wherein the cathode termination further contains an upstanding portion positioned generally perpendicular to the lower surface of the capacitor element. 12. The capacitor of claim 11, wherein the upstanding portion of the cathode termination is positioned adjacent to the rear surface of the capacitor element. 13. The capacitor of clam 11, wherein the upstanding portion of the cathode termination is encapsulated by the molding material. 14. The capacitor of claim 1, wherein an insulating material is disposed between the capacitor element and the planar portion of the anode termination. 15. The capacitor of claim 1, wherein the anode includes tantalum, niobium, or an electrically conductive oxide thereof. 16. The capacitor of claim 1, wherein the solid electrolyte includes a conductive polymer. 17. The capacitor of claim 16, wherein the conductive polymer is poly(3,4-ethylenedioxythiophene). 18. A method for forming a capacitor from a capacitor element and a leadframe, wherein the leadframe contains an anode portion and a cathode portion, the cathode portion including a base, and further wherein the capacitor element includes an anode, dielectric layer overlying the anode, cathode overlying the dielectric layer that includes a solid electrolyte, the method comprising: vertically folding the base of the cathode portion to form a planar portion oriented generally parallel to a lower surface of the capacitor element, wherein the planar portion contains a first planar section that is positioned vertically above a second planar section, wherein at least a portion of the first planar section is in contact with the second planar section, wherein a slot is defined by at least the first planar section;disposing a conductive adhesive within the slot;positioning the capacitor element onto the leadframe so that the capacitor elements contacts the conductive adhesive;bending the anode portion of the leadframe to form an upstanding anode termination portion positioned generally perpendicular to the lower surface of the capacitor element and a planar portion positioned generally parallel to the lower surface of the capacitor element, wherein the anode lead is electrically connected to the upstanding anode termination portion, and further wherein the upstanding portion of the anode termination defines a second slot for receiving the anode lead; andencapsulating the capacitor element with a molding material so that at least a part of the anode portion and at least a part of the cathode portion of the leadframe remain exposed. 19. The method of claim 18, wherein the first slot is defined in an interior of at least the first section. 20. The method of claim 18, wherein the cathode portion further comprises a tab that extends from the base, the method further comprising bending the tab to form an upstanding cathode termination portion.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (40)
Bishop Ian H.,GBX ; Masheder David,GBX, Binder removal.
Maeda Takahiro,JPX ; Yanagi Shouichi,JPX ; Kuriyama Chojiro,JPX, Capacitor element for solid electrolytic capacitor, device and process for making the same.
Ishijima, Masami, Lead frame, method of manufacturing a face-down terminal solid electrolytic capacitor using the lead frame, and face-down terminal solid electrolytic capacitor manufactured by the method.
Galvagni John (Surfside Beach SC) Brown Sonja (Myrtle Beach SC) Christian Kevin (Myrtle Beach SC) Qui Yong-Jian (Myrtle Beach SC), Manufacturing method for solid state capacitor and resulting capacitor.
Sano, Mitsunori; Kono, Takashi; Watanabe, Kazunori, Method for fabricating chip type solid electrolytic capacitor and apparatus for performing the same method.
Kudoh Yasuo,JPX ; Akami Kenji,JPX ; Kojima Toshikuni,JPX ; Matsuya Yasue,JPX ; Shimada Hiroshi,JPX ; Hayashi Chiharu,JPX, Solid electrolytic capacitors comprising a conductive layer made of a polymer of pyrrole or its derivative.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.