초록 ▼

An apparatus is provided for cooling an electronic system, which includes one or more electronic components across which air passing through the system flows. A cooling unit provides, via a coolant loop, system coolant to cool the electronic component(s), and to an air-to-liquid heat exchanger is co

An apparatus is provided for cooling an electronic system, which includes one or more electronic components across which air passing through the system flows. A cooling unit provides, via a coolant loop, system coolant to cool the electronic component(s), and to an air-to-liquid heat exchanger is coupled to the coolant loop downstream of the electronic component(s) to cool, in primary, liquid-cooling mode, air passing through the system. In primary, liquid-cooling mode, the cooling unit provides cooled system coolant to cool the electronic component(s), and provides system coolant to the air-to-liquid heat exchanger to cool at least a portion of air passing through the electronic system, and in a secondary, air-cooling mode, system coolant flows from cooling the electronic component(s) to the air-to-liquid heat exchanger for rejecting, via the system coolant, heat from the electronic component(s) to air passing across the air-to-liquid heat exchanger.

대표청구항 ▼

1. A cooling apparatus for facilitating cooling of an electronic system comprising at least one electronic component, the cooling apparatus comprising: at least one cooling unit providing, via a coolant loop, system coolant to cool the at least one electronic component, wherein each cooling unit of

1. A cooling apparatus for facilitating cooling of an electronic system comprising at least one electronic component, the cooling apparatus comprising: at least one cooling unit providing, via a coolant loop, system coolant to cool the at least one electronic component, wherein each cooling unit of the at least one cooling unit comprises a liquid-to-liquid heat exchanger, a first coolant path and a second coolant path, the first coolant path of each cooling unit of the at least one cooling unit receiving, in a primary, liquid-cooling mode, facility coolant from a source and passing at least a portion thereof through the liquid-to-liquid heat exchanger, and the second coolant path being coupled in fluid communication with the coolant loop, and providing system coolant to cool the at least one electronic component, and in primary, liquid-cooling mode, expelling heat in the liquid-to-liquid heat exchanger from system coolant in the second coolant path to facility coolant in the first coolant path;at least one air-to-liquid heat exchanger cooling, in primary, liquid-cooling mode, air exhausting from the electronic system, the at least one air-to-liquid heat exchanger being coupled to the coolant loop to receive system coolant therefrom and exhaust system coolant thereto, wherein the at least one air-to-liquid heat exchanger is coupled to the coolant loop downstream of cooling the at least one electronic component, and in a secondary, air-cooling mode, the at least one air-to-liquid heat exchanger facilitates cooling the at least one electronic component;a controller to transition the cooling apparatus between the primary, liquid-cooling mode and the secondary, air-cooling mode, wherein in primary, liquid-cooling mode, the at least one cooling unit provides cooled system coolant to cool the at least one electronic component, and provides system coolant to the at least one air-to-liquid heat exchanger to cool the air exhausting from the electronic system, and in secondary, air-cooling mode, system coolant flows from cooling the at least one electronic component to the at least one air-to-liquid heat exchanger for rejecting, via the system coolant, heat from the at least one electronic component to air passing across the at least one air-to-liquid heat exchanger; andwherein the electronic systern comprises an air inlet side and an air outlet side for respectively enabling ingress and egress of external air through the electronic system, the at least one air-to-liquid heat exchanger being disposed adjacent to the air outlet side of the electronic system and cooling, in the primary, liquid cooling mode, the air exhausting from the electronic system at the air outlet side. 2. The cooling apparatus of claim 1, wherein the electronic system comprises at least one air-moving device facilitating passage of air through the electronic system from the air inlet side to the air outlet side thereof, and wherein the controller is coupled to the at least one air-moving device for automatically adjusting operation of the at least one air-moving device relative to mode of operation of the cooling apparatus, wherein in the secondary, air-cooling mode, the controller operates the at least one air-moving device at a higher operational speed than in the primary, liquid-cooling mode. 3. The cooling apparatus of claim 2, wherein the controller periodically determines whether adequate facility coolant cooling is available, and responsive to adequate facility coolant cooling being available, operates the cooling apparatus in the primary, liquid-cooling mode, with the at least one air-moving device at a slower operational speed than in the secondary, air-cooling mode, and responsive to inadequate facility coolant cooling being available, determines whether temperature of air flowing to the at least one air-to-liquid heat exchanger is less than temperature of system coolant in the coolant loop returning to the at least one cooling unit, and responsive to temperature of air to the at least one air-to-liquid heat exchanger being less than temperature of system coolant in the coolant loop returning to the at least one cooling unit, automatically operates the at least one air-moving device at the higher operational speed. 4. The cooling apparatus of claim 3, further comprising determining temperature of the at least one electronic component, and setting speed of a clock to the at least one electronic component based on determined temperature thereof. 5. The cooling apparatus of claim 1, wherein the electronic system comprises multiple electronic components and wherein the cooling apparatus is configured to provide, via the coolant loop, system coolant to cool in parallel the multiple electronic components. 6. The cooling apparatus of claim 5, further comprising multiple air-to-liquid heat exchangers, the multiple air-to-liquid heat exchangers being coupled in parallel to the coolant loop to receive coolant therefrom and exhaust coolant thereto, and wherein the multiple air-to-liquid heat exchangers are coupled to the coolant loop downstream of cooling the multiple electronic components, and in the secondary, air-cooling mode, each air-to-liquid heat exchanger of the multiple air-to-liquid heat exchangers facilitates cooling the multiple electronic components, the cooling being independent of a service mode of another air-to-liquid heat exchanger of the multiple air-to-liquid heat exchangers. 7. The cooling apparatus of claim 6, wherein a first air-to-liquid heat exchanger of the multiple air-to-liquid heat exchangers is disposed within the electronic system, and a second air-to-liquid heat exchanger of the multiple air-to-liquid heat exchangers is disposed external to the electronic system. 8. The cooling apparatus of claim 7, wherein the electronic system is an electronics rack and wherein the second air-to-liquid heat exchanger is disposed within another electronics rack. 9. The cooling apparatus of claim 8, wherein the first air-to-liquid heat exchanger is disposed at the air outlet side of the electronics rack for cooling air egressing from the electronics rack in the primary, liquid-cooling mode, and for exhausting heat from the multiple electronic components to air egressing from the electronics rack in the secondary, air-cooling mode, and wherein the second air-to-liquid heat exchanger is disposed at an air outlet side of the another electronics rack for cooling air egressing from the another electronics rack in the primary, liquid-cooling mode, and for exhausting heat from the multiple electronic components of the electronics rack to air egressing from the another electronics rack in the secondary, air-cooling mode. 10. A cooled electronic system comprising; an electronic system comprising an air inlet side and an air outlet side respectively enabling ingress and egress of air through the electronic system, the electronic system further comprising at least one electronic component; anda cooling apparatus for facilitating cooling of the electronic system and cooling of air egressing from the electronic system, the cooling apparatus comprising: at least one cooling unit providing, via a coolant loop, system coolant to cool the at least one electronic component, wherein each cooling unit of the at least one cooling unit comprises a liquid-to-liquid heat exchanger, a first coolant path and a second coolant path, the first coolant path of each cooling unit receiving, in a primary, liquid-cooling mode, facility coolant from a source and passing at least a portion thereof through the liquid-to-liquid heat exchanger, and the second coolant path being coupled in fluid communication with the coolant loop, and providing system coolant to cool the at least one electronic component, and in primary, liquid-cooling mode, expelling heat in the liquid-to-liquid heat exchanger from system coolant in the second coolant path to facility coolant in the first coolant path;at least one air-to-liquid heat exchanger cooling, in primary, liquid-cooling mode, air exhausting from the electronic system, the at least one air-to-liquid heat exchanger being coupled to the coolant loop to receive system coolant therefrom and exhaust system coolant thereto, wherein the at least one air-to-liquid heat exchanger is coupled to the coolant loop downstream of cooling the at least one electronic component, and in a secondary, air-cooling mode, the at least one air-to-liquid heat exchanger facilitates cooling the at least one electronic component;a controller to transition the cooling apparatus between the primary, liquid-cooling mode and the secondary, air-cooling mode, wherein in primary, liquid-cooling mode, the at least one cooling unit provides cooled system coolant to cool the at least one electronic component, and provides system coolant to the at least one air-to-liquid heat exchanger for cooling at least a portion of air passing through the electronic system, and in secondary, air-cooling mode, system coolant flows from cooling the at least one electronic component to the at least one air-to-liquid heat exchanger for rejecting, via the system coolant, heat from the at least one electronic component to air passing across the at least one air-to-liquid heat exchanger; andwherein,the at least one air-to-liquid heat exchagnger is disposed adjacent to the air outlet side of the electronic system and cools in the primary liquid cooling mode, the air exhausting from the electronic system at the air outlet side thereof. 11. The cooled electronic system of claim 10, wherein the electronic system comprises at least one air-moving device for facilitating passage of air through the electronic system from the air inlet side to the air outlet side thereof, and wherein the controller is coupled to the at least one air-moving device for automatically adjusting operation of the at least one air-moving device relative to mode of operation of the cooling apparatus, wherein in the secondary, air-cooling mode, the controller operates the at least one air-moving device at a higher operational speed than in the primary, liquid-cooling mode. 12. The cooled electronic system of claim 11, wherein the controller periodically determines whether adequate facility coolant cooling is available, and responsive to adequate facility coolant cooling being available, operates the cooling apparatus in the primary, liquid-cooling mode, with the at least one air-moving device at a slower operational speed than in the secondary, air-cooling mode, and responsive to inadequate facility coolant cooling being available, determines whether temperature of air to the at least one air-to-liquid heat exchanger is less than temperature of system coolant in the coolant loop returning to the at least one cooling unit, and responsive to temperature of air to the at least one air-to-liquid heat exchanger being less than temperature of system coolant in the coolant loop returning to the at least one cooling unit, automatically operates the at least one air-moving device at the higher operational speed. 13. The cooled electronic system of claim 12, further comprising determining temperature of the at least one electronic component, and setting speed of a clock to the at least one electronic component based on determined temperature thereof. 14. The cooled electronic system of claim 10, wherein the electronic system comprises multiple electronic components and wherein the cooling apparatus is configured to provide, via the coolant loop, system coolant to cool in parallel the multiple electronic components. 15. The cooled electronic system of claim 14, further comprising multiple air-to-liquid heat exchangers, the multiple air-to-liquid heat exchangers being coupled in parallel to the coolant loop to receive coolant therefrom and exhaust coolant thereto, and wherein the multiple air-to-liquid heat exchangers are coupled to the coolant loop downstream of cooling the multiple electronic components, and in the secondary, air-cooling mode, each air-to-liquid heat exchanger of the multiple air-to-liquid heat exchangers facilitates cooling the multiple electronic components, the cooling being independent of a service mode of another air-to-liquid heat exchanger of the multiple air-to-liquid heat exchangers. 16. The cooled electronic system of claim 15, wherein the electronic system is an electronics rack, and the cooled electronic system further comprises another electronics rack, and wherein a first air-to-liquid heat exchanger of the multiple air-to-liquid heat exchangers is disposed within the electronics rack, and a second air-to-liquid heat exchanger of the multiple air-to-liquid heat exchangers is disposed within the another electronics rack. 17. The cooled electronic system of claim 16, wherein the first air-to-liquid heat exchanger is disposed at the air outlet side of the electronics rack for cooling air egressing from the electronics rack in the primary, liquid-cooling mode, and for exhausting heat from the multiple electronic components to air egressing from the electronics rack in the secondary, air-cooling mode, and wherein the second air-to-liquid heat exchanger is disposed at an air outlet side of the another electronics rack for cooling air egressing from the another electronics rack in the primary, liquid-cooling mode, and for exhausting heat from the multiple electronic components of the electronics rack to air egressing from the another electronics rack in the secondary, air-cooling mode. 18. A method of facilitating cooling of an electronic system, the method comprising: employing at least one cooling unit to provide, via a coolant loop, system coolant to cool at least one electronic component of the electronic system, wherein each cooling unit of the at least one cooling unit comprises a liquid-to-liquid heat exchanger, a first coolant path and a second coolant path, the first coolant path of each cooling unit of the at least one cooling unit receiving, in a primary, liquid-cooling mode, facility coolant from a source and passing at least a portion thereof through the liquid-to-liquid heat exchanger, and the second coolant path being coupled in fluid communication with the coolant loop, and providing system coolant to cool the at least one electronic component, and in primary, liquid-cooling mode, expelling heat in the liquid-to-liquid heat exchanger from system coolant in the second coolant path to facility coolant in the first coolant path;utilizing at least one air-to-liquid heat exchanger for cooling, in primary, liquid-cooling mode, air exhausting from the electronic system, the at least one air-to-liquid heat exchanger being coupled to the coolant loop to receive system coolant therefrom and exhaust system coolant thereto, wherein the at least one air-to-liquid heat exchanger is coupled to the coolant loop downstream of cooling the at least one electronic component, and in a secondary, air-cooling mode, the at least one air-to-liquid heat exchanger facilitates cooling the at least one electronic component;transitioning between the primary, liquid-cooling mode and the secondary, air-cooling mode, wherein in primary, liquid-cooling mode, the at least one cooling unit provides cooled system coolant to cool the at least one electronic component, and provides system coolant to the at least one air-to-liquid heat exchanger to cool the air exhausting from the electronic system, and in secondary, air-cooling mode, system coolant flows from cooling the at least one electronic component to the at least one air-to-liquid heat exchanger for rejecting, via the system coolant, heat from the at least one electronic component to air passing across the at least one air-to-liquid heat exchanger; andwherein the electronic system comprises an air inlet side and an air outlet side for respectively enabling ingress and egress of external air through the electronic system the at least one air-to-liquid heat exchanger being disposed adjacent to the air outlet side of the electronic system and cooling in the primary, liquid cooling mode, the air exhausting from the electronic system at the air outlet side. 19. The method of claim 18, wherein the electronic system comprises at least one air-moving device facilitating passage of air through the electronic system from the air inlet side to the air outlet side thereof, wherein the method further comprises automatically adjusting operation of the at least one air-moving device relative to a cooling mode of operation, wherein in the secondary, air-cooling mode, the at least one air-moving device is operated at a higher operational speed than in the primary, liquid-cooling mode. 20. The method of claim 19, further comprising periodically determining whether adequate facility coolant cooling is available, and responsive to adequate facility coolant cooling being available, operating in the primary, liquid-cooling mode, with the at least one air-moving device at a slower operational speed than in the secondary, air-cooling mode, and responsive to inadequate facility coolant cooling being available, ascertaining whether temperature of air to the at least one air-to-liquid heat exchanger is less than temperature of system coolant in the coolant loop returning to the at least one cooling unit, and responsive to temperature of air to the at least one air-to-liquid heat exchanger being less than temperature of system coolant in the cooling loop returning to the at least one cooling unit, operating in the secondary, air-cooling mode, and automatically operating the at least one air-moving device at the higher operational speed.