초록 ▼

The implantable medical device including a hermetic enclosure including at least one feedthrough having at least one electrically conductive path through the feedthrough. The at least one feedthrough includes an insulator having an entry face and an exit face, and at least one non-linear conductor i

The implantable medical device including a hermetic enclosure including at least one feedthrough having at least one electrically conductive path through the feedthrough. The at least one feedthrough includes an insulator having an entry face and an exit face, and at least one non-linear conductor is configured to extend, within the insulator, from the entry face to the exit face to provide the conductive path, wherein the entry and exit faces are not substantially parallel opposite faces of the insulator.

대표청구항 ▼

1. An implantable medical device comprising: a hermetic enclosure including at least one feedthrough having at least one electrically conductive path through the feedthrough, the at least one feedthrough comprising: an insulator having an entry face and an exit face; andat least one non-linear condu

1. An implantable medical device comprising: a hermetic enclosure including at least one feedthrough having at least one electrically conductive path through the feedthrough, the at least one feedthrough comprising: an insulator having an entry face and an exit face; andat least one non-linear conductor configured to extend, within the insulator, from the entry face to the exit face to provide the conductive path, wherein the entry and exit faces are not substantially parallel opposite faces of the insulator;wherein the hermetic enclosure further includes a first metal housing member and a separate second housing member, with an outer sidewall of the enclosure extending between and connecting the first and second metal housing members to hermetically seal the hermetic enclosure, wherein the outer sidewall is defined by the insulator of the feedthrough. 2. The implantable medical device of claim 1, wherein the entry face is substantially perpendicular to the exit face. 3. The implantable medical device of claim 1, wherein the entry face and the exit face are the same face of the insulator. 4. The implantable medical device of claim 3, wherein a portion of the conductor disposed in the insulator includes a 180-degree bend. 5. The implantable medical device of claim 1, wherein the insulator is substantially cylindrical and the entry face lies in a plane tangential to the insulator at a location on the surface of the insulator at which a first portion of the conductor extends out of the insulator. 6. The implantable medical device of claim 5, wherein the exit face lies in a plane tangential to the insulator at a second location on the surface of the insulator at which a second portion of the conductor extends out of the insulator. 7. The implantable medical device of claim 1, wherein a portion of the conductor disposed in the insulator comprises one or more bends. 8. A cochlear implant system comprising: an electrode array; andan electronics module comprising a hermetic enclosure encasing one or more functional components and including at least one feedthrough having at least one electrically conductive path through the feedthrough configured to electrically connect the functional components to the electrode array, the at least one feedthrough comprising: an insulator having an entry face and an exit face; andat least one non-linear conductor configured to extend, within the insulator, from the entry face to the exit face to provide the conductive path, wherein the entry and exit faces are not substantially parallel opposite faces of the insulator;wherein the hermetic enclosure comprises a first metal housing member and a separate second housing member, with an outer sidewall extending between and connecting the first and second metal housing members to hermetically seal the hermetic enclosure, wherein the outer sidewall is defined by the insulator of the feedthrough. 9. The system of claim 8, further comprising: an external component configured to receive input signals and convert the received input signals into control signals; andan implantable component configured to receive the control signals from the external component, wherein the internal component comprises the electrode array and the electronics module. 10. The system of claim 8, wherein a portion of the conductor disposed in the insulator comprises one or more bends. 11. The system of claim 8, wherein the entry face is substantially perpendicular to the exit face. 12. The system of claim 8, wherein the entry face and the exit face are the same face of the insulator. 13. The system of claim 12, wherein a portion of the conductor disposed in the insulator includes a 180degree bend. 14. The system of claim 8, wherein the first metal housing member comprises a base, wherein the second metal housing member comprises a top, and wherein the insulator includes the outer sidewall and a projection extending inwardly from the outer sidewall, wherein the projection is configured to be mated and aligned with the top of the hermetic enclosure. 15. A method of forming a feedthrough and a hermetic enclosure for an implantable medical device, the method comprising: forming at least one non-linear conductor;encapsulating a portion of the non-linear conductor with an insulating material to form a contiguous insulator having entry and exit faces that are not substantially parallel opposite faces of the insulator, wherein that the non-linear conductor is configured to extend, within the insulator, from the entry face to the exit face;hermetically sealing the portion of the non-linear conductor encapsulated in the insulator; andforming a hermetic enclosure comprising a first metal housing member and a separate second metal housing member, with an outer sidewall extending between and connecting the first and second metal housing members to hermetically seal the hermetic enclosure, wherein the outer sidewall is defined by the insulator of the feedthrough. 16. The method of claim 15, wherein said hermetically sealing the portion of the non-linear conductor within the insulator includes sintering the insulator and the non-linear conductor. 17. The method of claim 15, wherein, after encapsulating the portion of the non-linear conductor, the insulator circumferentially surrounds the portion of the non-linear conductor. 18. The method of claim 15, wherein the entry face is substantially perpendicular to the exit face. 19. The method of claim 15, wherein the entry face and the exit face are the same face of the insulator. 20. The method of claim 19, wherein the portion of the conductor encapsulated within the insulator includes a 180 degree bend. 21. The implantable medical device of claim 3, wherein the first metal housing is connected to the insulator at the same face of the insulator where the conductive path enters and exits the insulator. 22. The implantable medical device of claim 21, wherein the first metal housing is connected to a protrusion of the insulator at the same face of the insulator where the conductive path enters and exits the insulator. 23. The implantable medical device of claim 21, wherein the first metal housing is connected to the insulator at the same face of the insulator where the conductive path enters and exits the insulator and between where the conductive path enters and exits the insulator. 24. The implantable medical device of claim 23, wherein the conductive path changes in direction by at least 180 degrees as the conductive path extends through the insulator. 25. The implantable medical device of claim 1, wherein the outer sidewall is annular such that the hermetic enclosure is substantially disc shaped. 26. The implantable medical device of claim 1, wherein the outer sidewall connects to the first and second metal housing members at braze connections. 27. The implantable medical device of claim 1, further comprising a cover extending over the exit face of the feedthrough. 28. The implantable medical device of claim 27, wherein the cover comprises a metal cover joined to the insulator of the feedthrough.