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Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a

Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.

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1. A method of making an electronic assembly comprising: providing a strap from a first web of flexible material, the strap comprising: a functional component, the functional component being a radio frequency identification (RFID) flip chip;a portion of the flexible material; andfirst and second con

1. A method of making an electronic assembly comprising: providing a strap from a first web of flexible material, the strap comprising: a functional component, the functional component being a radio frequency identification (RFID) flip chip;a portion of the flexible material; andfirst and second connection pads on the flexible material;providing an antenna on a flexible substrate;detecting for a defective functional component of the strap;attaching the strap to the flexible substrate if a defect is not detected during the detecting,wherein the antenna is electrically coupled to the RFID flip chip by the first and second connection pads, andwherein the strap is smaller than the antenna. 2. The method of claim 1 furthering comprising printing the antenna on the flexible substrate. 3. The method of claim 1 wherein the attaching is by ultrasonic welding. 4. The method of claim 1 wherein the attaching is by cold swaging. 5. The method of claim 1 wherein the attaching uses a conductive adhesive. 6. The method of claim 1 wherein the flexible material is opaque. 7. The method of claim 1 wherein the flexible material is transparent. 8. The method of claim 1 wherein the flexible material is polyester terephthalate. 9. The method of claim 1 wherein the flexible material is polyether sulfone. 10. The method of claim 1 wherein the flexible material is polyimide. 11. The method of claim 1 wherein the flexible material is polyetherimide. 12. A method of making an electronic assembly comprising: providing a strap from a first web of flexible material, the strap comprising: a functional component, the functional component being a radio frequency identification (RFID) chip configured for fluidic self assembly;a portion of the flexible material; andfirst and second connection pads on the flexible material;providing an antenna on a flexible substrate;detecting for a defective functional component of the strap;attaching the strap to the flexible substrate if a defect is not detected during the detecting,wherein the antenna is electrically coupled to the RFID chip by the first and second connection pads, andwherein the strap is smaller than the antenna. 13. The method of claim 12 furthering comprising printing the antenna on the flexible substrate. 14. The method of claim 12 furthering comprising adhering the antenna to the flexible substrate with an adhesive. 15. The method of claim 12 wherein the attaching is by ultrasonic welding. 16. The method of claim 12 wherein the attaching is by cold swaging. 17. The method of claim 12 wherein the attaching uses a conductive adhesive. 18. The method of claim 12 wherein the flexible material is opaque. 19. The method of claim 12 wherein the flexible material is transparent. 20. The method of claim 12 wherein the flexible material is polyester terephthalate. 21. The method of claim 12 wherein the flexible material is polyether sulfone. 22. The method of claim 12 wherein the flexible material is polyimide. 23. The method of claim 12 wherein the flexible material is polyetherimide.