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Some embodiments of the present invention provide a system that cools an integrated circuit (IC) chip within a computer system. During operation, the system converts heat generated by a heat-generating device within the computer system during operation of the computer system into thermoelectric powe

Some embodiments of the present invention provide a system that cools an integrated circuit (IC) chip within a computer system. During operation, the system converts heat generated by a heat-generating device within the computer system during operation of the computer system into thermoelectric power. Next, the system supplies the thermoelectric power to drive a fluid pump. Finally, the system uses the fluid pump to conduct heat away from the IC chip.

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1. A method for cooling an integrated circuit (IC) chip within a computer system, comprising: converting heat generated by one or more heat-generating devices within the computer system during operation of the computer system into thermoelectric power from each of the heat-generating devices;combini

1. A method for cooling an integrated circuit (IC) chip within a computer system, comprising: converting heat generated by one or more heat-generating devices within the computer system during operation of the computer system into thermoelectric power from each of the heat-generating devices;combining the thermoelectric power from each of the heat-generating devices into an aggregate thermoelectric power;supplying the aggregate thermoelectric power to drive a fluid pump;using the fluid pump to conduct heat away from the IC chip;monitoring the operating temperature of the IC chip using a continuous system telemetry harness (CSTH); andcontrolling the flow rate of the fluid pump based on the monitored operating temperature by varying the number of heat-generating devices used to generate the aggregate thermoelectric power that drives the fluid pump. 2. The method of claim 1, wherein converting the heat generated by the one or more heat-generating devices into thermoelectric power involves: tapping into a temperature difference around each heat-generating device; andconverting the temperature difference into electricity using the Seebeck effect. 3. The method of claim 2, wherein tapping into the temperature difference around each heat-generating device involves: tapping into a first temperature reference on the heat-generating device; andtapping into a second temperature reference from a corresponding heat sink, which has a lower temperature than the heat-generating device. 4. The method of claim 3, wherein tapping into the temperature difference further involves: using heat pipes to reduce the temperature of the second temperature reference; andincreasing the temperature difference using the reduced temperature of the second temperature reference. 5. The method of claim 3, wherein tapping into the first temperature reference involves coupling a first thermal interface of a thermoelectric module to the corresponding heat-generating device;wherein tapping into the second temperature reference involves coupling a second thermal interface of the thermoelectric module to the corresponding heat sink; andwherein the temperature difference between the first thermal interface and the second thermal interface creates a voltage difference between the first and second thermal interfaces. 6. The method of claim 1, wherein the fluid pump comprises a magnetohydrodynamic (MHD) pump. 7. The method of claim 6, wherein conducting heat away from the IC chip involves: using the fluid pump to pump conductive fluid containing heat from the IC chip to a heat dissipater; anddissipating the heat using the heat dissipater. 8. The method of claim 7, wherein the heat dissipater is at least one of a heat exchanger, a heat sink, a heat spreader, and a radiator. 9. A system for cooling an integrated circuit (IC) chip within a computer system, comprising: an energy-conversion mechanism configured to convert heat generated by one or more heat-generating devices within the computer system during operation of the computer system into thermoelectric power from each of the heat-generating devices; and;a combining mechanism configured to combine the thermoelectric power from each of the heat-generating devices into an aggregate thermoelectric power;a fluid pump configured to conduct heat away from the IC chip using the aggregate thermoelectric power;a monitoring mechanism configured to monitor the operating temperature of the IC chip using a CSTH; anda controlling mechanism configured to vary a flow rate of the fluid pump based on the monitored operating temperature by varying the number of heat-generating devices used to generate the aggregate thermoelectric power that is used to power the fluid pump. 10. The system of claim 9, wherein the energy-conversion mechanism is further configured to: tap into a temperature difference around each heat-generating device; andconvert the temperature difference into electricity using the Seebeck effect. 11. The system of claim 10, further comprising: corresponding heat sink in thermal contact with each heat-generating device,wherein, while tapping into the temperature difference around each heat-generating device, the energy-conversion mechanism is further configured to: tap into a first temperature reference on each heat-generating device; andtap into a second temperature reference from the corresponding heat sink, which has a lower temperature than the heat-generating device. 12. The system of claim 11, further comprising: a set of heat pipes configured to reduce the temperature of the second temperature reference,wherein the energy-conversion mechanism is further configured to increase the temperature difference using the reduced temperature of the second temperature reference. 13. The system of claim 11, wherein tapping into the first temperature reference involves coupling a first thermal interface of a thermoelectric module to a corresponding heat-generating device;wherein tapping into the second temperature reference involves coupling a second thermal interface of the thermoelectric module to a corresponding heat sink; andwherein the temperature difference between the first thermal interface and the second thermal interface creates a voltage difference between the first and second thermal interfaces. 14. The system of claim 9, wherein the fluid pump comprises a magnetohydrodynamic (MHD) pump. 15. The system of claim 14, wherein the fluid pump conducts heat away from the IC chip by: pumping conductive fluid containing heat from the IC chip inside a heat transfer pipe to a heat dissipater; anddissipating the heat using the heat dissipater. 16. The system of claim 15, wherein the heat dissipater is at least one of a heat exchanger, a heat sink, a heat spreader, and a radiator.