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Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-026/08
  • H01L-021/324
출원번호 US-0639416 (2006-12-15)
등록번호 US-8525070 (2013-09-03)
우선권정보 JP-2005-366169 (2005-12-20)
발명자 / 주소
  • Tanaka, Koichiro
  • Yamamoto, Yoshiaki
출원인 / 주소
  • Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
    Nixon Peabody LLP
인용정보 피인용 횟수 : 0  인용 특허 : 32

초록

A laser irradiation apparatus is provided with a laser oscillator, an articulated beam propagator in which a plurality of pipes are connected to each other in an articulated portion, and a course change means of a laser beam in the articulated portion. At least one pipe of the plurality of pipes inc

대표청구항

1. A laser irradiation apparatus comprising: a laser oscillator; andan articulated beam propagator configured to propagate a laser beam produced by the laser oscillator,an optical system configured to shape a beam shape of the laser beam emitted from an end of the articulated beam propagator into a

이 특허에 인용된 특허 (32)

  1. Sasaki, Nobuo; Ohki, Koichi, Apparatus for crystallizing semiconductor with laser beams.
  2. Sasaki, Nobuo; Ohki, Koichi, Apparatus for crystallizing semiconductor with laser beams.
  3. Sasaki,Nobuo; Uzuka,Tatsuya, Apparatus for crystallizing semiconductor with laser beams.
  4. Alborante Giancarlo (Trofarello ITX), Apparatus for welding motor-vehicle bodies.
  5. Mller Gerhard (Aalen DEX) Hohberg Gerhard (Oberkochen DEX) Greve Peter (Essingen DEX), Arrangement for correcting the position of a laser beam guided by means of an articulated optical system.
  6. Clocksin William F. (Cambridge GB2) Davey Peter G. (Oxford GB2) Morgan Colin G. (Oxford GB2) Vidler Albert R. (Oxon GB2), Automatic welding with imaging of workpiece surfaces and of the junction between the surfaces.
  7. Koichiro Tanaka JP, Beam homogenizer and laser irradiation apparatus.
  8. Moriwaka, Tomoaki, Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device.
  9. Moriwaka,Tomoaki, Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device.
  10. Dunsky, Corey M.; Liu, Xinbing; Croglio, Nicholas J.; Lo, Ho W.; Gundrum, Bryan C.; Matsumoto, Hisashi, Beam shaping and projection imaging with solid state UV gaussian beam to form vias.
  11. Hongo,Mikio; Uto,Sachio; Nomoto,Mineo; Nakata,Toshihiko; Hatano,Mutsuko; Yamaguchi,Shinya; Ohkura,Makoto, Display device, process of fabricating same, and apparatus for fabricating same.
  12. Nakata Yoshinori (Yamanashi JPX), Laser beam machine using optical component to modify laser beam as desired.
  13. Kuwahara Takashi,JPX, Laser irradiation device.
  14. Ori, Yuichiro, Laser irradiation optical system.
  15. Amako, Jun; Murai, Masami; Ota, Tsutomu; Sonehara, Tomio, Laser machining method for precision machining.
  16. Donald R. Fields, Jr. ; James Foley ; Darin Morris ; Frank Godsil, Laser welding system.
  17. Sarugaku Shinichi (Funabashi JPX) Shimura Yasunori (Chiba JPX), Method and an apparatus for controlling work performed by an automatic work processing machine.
  18. Sasaki, Nobuo; Ohki, Koichi, Method and apparatus for crystallizing semiconductor with laser beams.
  19. Sasaki, Nobuo; Uzuka, Tatsuya; Ohki, Koichi, Method and apparatus for crystallizing semiconductor with laser beams.
  20. Marriott David A. (Keego Harbor MI), Method and apparatus for high speed laser cutting.
  21. Saari, Hannu; Rouvinen, Jarkko, Method and apparatus for implementation of close-up imaging capability in a mobile imaging system.
  22. Masaki, Ichiro, Method and apparatus for manipulator welding apparatus with vision correction for workpiece sensing.
  23. Lai Shui T. (Encinitas CA), Method and apparatus for ophthalmic surgery.
  24. Bonigen Christian,FRX, Method and device for welding with welding beam control.
  25. Sasaki, Nobuo; Uzuka, Tatsuya, Method for crystallizing semiconductor with laser beams.
  26. Sasaki,Nobuo; Uzuka,Tatsuya; Ohki,Koichi, Method for crystallizing semiconductor with laser beams.
  27. Shimomura, Akihisa, Method for manufacturing semiconductor device.
  28. Jyumonji Takashi,JPX, Multiple-sensor robot system for obtaining two-dimensional image and three-dimensional position information.
  29. Akeel Hadi A. (Sterling Heights MI), Robot-laser system.
  30. Tanabe, Hiroshi; Akashi, Tomoyuki; Watabe, Yoshimi, S system for the formation of a silicon thin film and a semiconductor-insulating film interface.
  31. Marshall John (Farnborough GB3) Raven Anthony L. (Royston GB3) Welford Walter T. (London GB3) Ness Karen M. M. (Royston GB3), Surface erosion using lasers.
  32. Haruta Kenyu,JPX ; Ono Koichi,JPX ; Tsuda Mutsumi,JPX ; Kawahara Takaaki,JPX ; Furukawa Taisuke,JPX, Thin film forming apparatus using laser and magnetic field.
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