초록 ▼

A method for fixing an electronic component on a printed circuit board, and contact-connecting the electronic component to the printed circuit board, the following steps are provided:—providing the printed circuit board having a plurality of contact and connection pads,—providing the electronic comp

A method for fixing an electronic component on a printed circuit board, and contact-connecting the electronic component to the printed circuit board, the following steps are provided:—providing the printed circuit board having a plurality of contact and connection pads,—providing the electronic component having a number of contact and connection locations corresponding to the plurality of contact and connection pads, with a mutual spacing reduced in comparison with the spacing of the contact and connection pads, and—arranging or forming at least one interlayer for routing the contact and connection locations of the electronic component between the contact and connection pads and the contact and connection locations of the electronic component. A method for producing an interlayer for routing and a system having a printed circuit board and an electronic component using the interlayer for routing are also provided.

대표청구항 ▼

1. A process for attaching an electronic component on a circuit board or contacting the electronic component with the circuit board, comprising the steps of: providing the circuit board with a plurality of contact or connection surfaces;providing the electronic component with a number of contact or

1. A process for attaching an electronic component on a circuit board or contacting the electronic component with the circuit board, comprising the steps of: providing the circuit board with a plurality of contact or connection surfaces;providing the electronic component with a number of contact or connection sites corresponding to the plurality of contact or connection surfaces of the circuit board, at mutual distances reduced relative to the distances of the contact or connection surfaces of the circuit board; andforming between the contact or connection surfaces of the circuit board and the contact or connection sites of the electronic component at least one intermediate layer for disentangling the contact or connection sites of the electronic component;wherein, after the structuring of the intermediate layer, an additional support layer for the attachment or contacting of the electronic component is applied on the intermediate layer for disentanglement and provided with contacts for the electronic component;wherein the additional support layer covers both the intermediate layer and portions of the circuit board;wherein the intermediate layer is merely formed in the region of the contact or connection surfaces of the circuit board as well as the contact or connection sites of the electronic component; andwherein the intermediate layer is created as a part of a substrate of the circuit board by adding a layer to the circuit board. 2. The process according to claim 1, wherein the intermediate layer is formed with conductive tracks or structures between contact zones corresponding to the contact or connection sites of the electronic component and corresponding to the contact or connection surfaces of the circuit board. 3. The process according to claim 1, wherein contacting between the contact or connection sites of the electronic component and the intermediate layer is effected via contacts of the electronic component. 4. The process according to claim 1, wherein contact or connection sites of the electronic component are directly contacted with contact zones of the intermediate layer. 5. The process according to claim 1, wherein the electronic component is attached on the circuit board with contact or connection sites oriented away from the circuit board, and is overlaid by the intermediate layer for disentanglement and connection to the contact or connection surfaces of the circuit board. 6. A process for producing an intermediate layer for disentangling contact or connection sites of an electronic component from contact or connection surfaces of a circuit board, comprising the steps of: providing the circuit board with a plurality of contact or connection surfaces;forming a base material of the intermediate layer merely in the region of the contact or connection surfaces of the circuit board;structuring the intermediate layer to form conductive tracks or structures and contact sites for contacting with contact or connection surfaces of the circuit board and with contact or connection sites of an electronic component to be attached on the circuit board;wherein, after the structuring of the intermediate layer, an additional support layer for the attachment or contacting of the electronic component is applied on the intermediate layer for disentanglement and provided with contacts for the electronic component;wherein the additional support layer covers both the intermediate layer and portions of the circuit board; andwherein the intermediate layer is created as a part of a substrate of the circuit board by adding a layer to the circuit board. 7. The process according to claim 6, wherein the structuring of the intermediate layer is performed by subtractive techniques, semi-additive techniques, additive techniques or embossing techniques or laser structuring techniques. 8. The process according to claim 6, wherein the intermediate layer is formed with a thickness reduced relative to the thickness of a circuit board layer. 9. The process according to claim 8, wherein the thickness of the intermediate layer is selected to be less than half, in particular less than a third, of the thickness of a circuit board layer. 10. The process according to claim 6, wherein the intermediate layer is provided with conductive tracks or conductive structures whose widths are selected to be less than 50 μm. 11. The process according to claim 6, wherein the intermediate layer is used as a support or enclosure for the electronic component. 12. A system including a circuit board and at least one electronic component, wherein at least one intermediate layer for the disentanglement of contact or connection sites of the electronic component from contact or connection surfaces of the circuit board is formed between the contact or connection sites of the electronic component and the contact or connection surfaces of the circuit board, and that the contact or connection sites of the electronic component comprise mutual distances reduced relative to the contact or connection sites of the circuit board; wherein an additional support layer for the attachment and contacting of the electronic component is applied on the intermediate layer for disentanglement and provided with contacts for the electronic component; wherein the intermediate layer is merely formed in the region of the contact or connection surfaces of the circuit board as well as the contact or connection sites of the electronic component; wherein the additional support layer covers both the intermediate layer and portions of the circuit board; and wherein the intermediate layer is created as part of a substrate of the circuit board by adding a layer to the circuit board. 13. The system according to claim 12, wherein the intermediate layer is formed with conductive tracks or structures between contact zones corresponding to the contact or connection sites of the electronic component and corresponding to the contact or connection surfaces of the circuit board. 14. The system according to claim 12, wherein the intermediate layer is formed with a thickness reduced relative to the thickness of a circuit board layer. 15. The system according to claim 14, wherein the thickness of the intermediate layer amounts to less than half of the thickness of a circuit board layer. 16. The system according to claim 12, wherein the intermediate layer is provided with conductive tracks or conductive structures whose widths are less than 50 μm. 17. The system according to claim 12, wherein the intermediate layer is used as a support or enclosure for the electronic component. 18. The system according to claim 12, wherein the circuit board is formed with a plurality of superimposed circuit board layers which are at least partially interconnected by conductive passages or microvias connecting individual circuit board layers. 19. The process according to claim 6, wherein the intermediate layer is provided with conductive tracks or conductive structures whose widths are selected to be less than 30 μm. 20. The system according to claim 14, wherein the thickness of the intermediate layer amounts to less than a third of the thickness of a circuit board layer. 21. The system according to claim 12, wherein the intermediate layer is provided with conductive tracks or conductive structures whose widths are less than 30 μm.