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Method and apparatus for holding microelectronic devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23Q-003/10
출원번호 US-0932659 (2013-07-01)
등록번호 US-8550443 (2013-10-08)
발명자 / 주소
  • Di Stefano, Thomas H.
출원인 / 주소
  • Centipede Systems, Inc.
대리인 / 주소
    Einschlag, Michael B.
인용정보 피인용 횟수 : 3  인용 특허 : 39

초록

One embodiment is a carrier for releasably holding devices that includes a body having at least one site having a first portion adapted to hold a device, a second portion, and first and second resilient prongs wherein: (a) the first and second resilient prongs each has a distal end extending into th

대표청구항

1. A carrier for releasably holding devices comprises: a body having one or more sites having a first portion adapted to hold a device and a second portion; andat least one of the one or more sites having a first resilient prong and a second resilient prong;wherein:the first resilient prong has: (a)

이 특허에 인용된 특허 (39)

  1. Bodenweber,Paul; Long,David C.; Miller,Jason S.; Westerfield, Jr.,Robert P.; Yu,Yuet Ying, Apparatus for implementing a self-centering land grid array socket.
  2. Ching T. Chang, Carrier assembly for semiconductor IC (integrated circuit) packages.
  3. Kato Hiroshi,JPX ; Kato Tomoyasu,JPX ; Takao Yasuyuki,JPX, Carrier tape and die apparatus for forming same.
  4. Thomas James R. ; Haggard Clifton C., Component carrier tray for high-temperature applications.
  5. Haas, Hermann; Lupke, Jens, Component holder for testing devices and component holder system microlithography.
  6. Masami Fukunaga (Kawaguchi JPX), Contact pin device for IC sockets.
  7. Yap Liop-Jin,SGX, Device probe socket forming part of a test head, interfacing between test head and a probe handler, used for device strip testing.
  8. Ma,Hao Yun; Hsu,Hsiu Yuan; Hsiao,Shih Wei, Electrical connector.
  9. He, Wen; Peng, Fujin; Lin, Nick, Electrical connector with reliable resilient beams.
  10. McHugh, Robert G.; Liao, Fang-Jwu, Electrical connector with retention protrusions.
  11. DeFord, Brian L., Electronic assembly having a socket with features that ensure alignment in X- and Y-directions of a component held thereby.
  12. Ban, Naoto; Namba, Masaaki; Hasebe, Akio; Wada, Yuji; Kohno, Ryuji; Seito, Akira; Motoyama, Yasuhiro, Fabrication method of semiconductor integrated circuit device and its testing apparatus.
  13. Carlos Ramos ; Richard Wong ; Sidney Peng ; David Collins ; David Baker, Floating interface for integrated circuit test head.
  14. Laub Michael F. (Etters PA) Rothenberger Richard E. (Harrisburg PA), Hinged cover for an electrical socket.
  15. Matsuoka Noriyuki (Tokyo JPX) Kubo Masaaki (Tokyo JPX), IC carrier.
  16. Matsuoka Noriyuki (Yokohama JPX), IC carrier.
  17. Bakermans Johannes C. W. (Harrisburg PA), Integrated circuit connector.
  18. Laub Michael Frederick, Integrated circuit socket for ball grid array and land grid array lead styles.
  19. Slocum Alexander H. ; Ziegenhagen ; II R. Scott ; Slocum ; III Richard W. ; Muller Luis A., Integrated circuit tray with flexural bearings.
  20. Xie, Hong; Viswanath, Ram; Patel, PR, Laminated socket contacts.
  21. McHugh Robert G. ; Lin Nick,TWX, Land grid array socket.
  22. Ohno Hirofumi (Tama JPX) Hayashi Shigeru (Tama JPX), Low profile socket connector.
  23. Goodwin Jonathan Wayne, Method and apparatus for aligning an integrated circuit chip.
  24. Farnworth Warren (Nampa ID) Wood Alan (Boise ID), Method and apparatus for manufacturing known good semiconductor die.
  25. Love David G. (Pleasanton CA), Method and apparatus for testing an unpopulated chip carrier using a module test card.
  26. Ondricek, Douglas S.; Pedersen, David V., Method for mounting an electronic component.
  27. D\Amico Richard J. (Cranston RI), Modular pad array interface.
  28. Farnworth Warren M. ; Akram Salman, Multi chip module including semiconductor wafer or dice, interconnect substrate, and alignment member.
  29. Palaniappa, Ilavarasan; Fedde, Mickiel; Cramer, Jason Allen, Packaged device adapter assembly with alignment structure and methods regarding same.
  30. Kohno, Ryuji; Shimizu, Hiroya; Kanamaru, Masatoshi; Hosogane, Atsushi; Miyatake, Toshio; Miura, Hideo; Nagata, Tatsuya; Endo, Yoshishige; Namba, Masaaki; Wada, Yuji, Packaging device for holding a plurality of semiconductor devices to be inspected.
  31. Akinwande, Akintunde Ibitayo; Gassend, Blaise Laurent Patrick; Velasquez-Garcia, Luis Fernando, Precise hand-assembly of microfabricated components.
  32. Gleason James ; Nemat Hassan, Reflow pallet with lever arm.
  33. King Jerrold L. (Boise ID) Brooks Jerry M. (Boise ID) Farnworth Warren M. (Nampa ID) McGill George P. (Boise ID), Semiconductor assembly utilizing elastomeric single axis conductive interconnect.
  34. Choy, Conrad, Socket for electrical parts having horizontal guide portion.
  35. Gras Ranulf W. (Lincoln MA), Substrate carrier.
  36. Hübner, Michael; Krause, Gunnar; Kuhn, Justus; Müller, Jochen; Pöchmüller, Peter; Weidenhöfer, Jürgen, Test configuration and test method for testing a plurality of integrated circuits in parallel.
  37. Pakeriasamy Saragarvani, Tray to ship ceramic substrates and ceramic BGA packages.
  38. Ilani Avner,ILX, Universal fixtureless test equipment.
  39. Mignardi Michael A. (Dallas TX), Use of a saw frame with tape as a substrate carrier for wafer level backend processing.

이 특허를 인용한 특허 (3)

  1. Wiens, Gloria Jean; Rao, Koustubh Jayaprakash; Rippere, Troy Benjamin, Active fixturing for micro/mesoscale, machine tool systems.
  2. Afable, Gerard Anthony C.; Toc, Howell John Chua; Venkatesappa, Prakash; Teo, Kok Peng; Yang, Annabelle Q., Clamping mechanism for processing of a substrate within a substrate carrier.
  3. Anderson, James C.; Hart, Alan D.; Karklin, Kenneth D., Methods, apparatus and articles of manufacture for testing a plurality of singulated die.
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