Embodiments of the present invention generally provide an improved conditioning module and conditioning disks for improved pressure distribution during the process of conditioning a polishing pad of a chemical mechanical polishing (CMP) system. In one embodiment, a conditioning module comprising mul
Embodiments of the present invention generally provide an improved conditioning module and conditioning disks for improved pressure distribution during the process of conditioning a polishing pad of a chemical mechanical polishing (CMP) system. In one embodiment, a conditioning module comprising multiple, small conditioning disks is provided. In one embodiment, a conditioning disk having a compliant backing member is provided. In one embodiment, the compliant backing member comprises a semi-rigid backing member cut into a spiral shape to provide compliancy. In another embodiment, the compliant backing member comprises a fluid-pressurized, flexible membrane. Each embodiment of the present invention provides an improved pressure distribution across the face of each conditioning disk, resulting in increased disk life as well as increased conditioning rate and uniformity.
대표청구항▼
1. A module for conditioning a polishing pad in a chemical mechanical polishing system, comprising: a vertical support post rotatable on a central axis and having a support arm extending laterally therefrom;a plurality of conditioning heads attached to the support arm and extending downwardly theref
1. A module for conditioning a polishing pad in a chemical mechanical polishing system, comprising: a vertical support post rotatable on a central axis and having a support arm extending laterally therefrom;a plurality of conditioning heads attached to the support arm and extending downwardly therefrom;a single bearing member attaching the plurality of conditioning heads to the support arm; anda conditioning disk extending downwardly from each conditioning head, wherein each conditioning disk comprises a compliant portion and an abrasive portion wherein the compliant portion comprises a spiral shaped disk backing member, and the spiral shaped disk backing member has a plurality of slots disposed therethrough. 2. The module of claim 1, wherein each slot extends inwardly from an outer periphery of the spiral. 3. The module of claim 2, wherein each slot is angularly offset from a radial line of the spiral shaped disk backing member. 4. The module of claim 3, wherein the angle of offset is between about 20 and about 45 degrees. 5. A disk for conditioning a polishing pad in a chemical mechanical polishing system, comprising; a compliant support member;an abrasive sheet member adjacent the compliant support member; anda backing member disposed between the compliant support member and the abrasive sheet member, wherein the backing member comprises a spiral shaped disk, the spiral shaped disk of the backing member has a plurality of slots disposed therethrough, and each slot extends inwardly from a periphery of the spiral shaped disk. 6. The disk of claim 5, wherein each slot is angularly offset from a radial line of the spiral shaped disk, and the angle of offset is from between about 20 to about 45 degrees. 7. The disk of claim 6, wherein the compliant support member comprises foam. 8. The disk of claim 6, wherein the compliant support member comprises a flexible, fluid filled membrane. 9. The disk of claim 6, wherein the fluid pressure of the flexible, fluid filled membrane is adjustable. 10. A method of conditioning a polishing pad in a chemical mechanical polishing system, comprising: applying a plurality of conditioning disks to a polishing pad, wherein the plurality of conditioning disks extend downwardly from a plurality of conditioning heads attached to a support arm and extending downwardly therefrom, a single bearing member attaches the plurality of conditioning heads to the support arm, and each of the plurality of conditioning disks comprises: a compliant support member;a spiral shaped backing member attached to the compliant support member; andan abrasive sheet member attached to the spiral shaped backing member; andmoving the plurality of conditioning disks, the polishing pad, or both, wherein the spiral shaped backing member has a plurality of slots disposed therethrough and extending inwardly from periphery of the spiral shaped backing member. 11. The method of claim 10, wherein each slot is angularly offset from a radial line of the spiral shaped backing member by an amount ranging from about 20 to about 45 degrees. 12. The method of claim 11, wherein the compliant support member comprises a fluid pressurized bladder. 13. The method of claim 11, wherein the compliant support member comprises foam. 14. The method of claim 11, wherein the abrasive sheet member is a diamond impregnated tape.
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이 특허에 인용된 특허 (14)
Taylor,Travis R.; Charatan,Robert; Anderson,Robert, Apparatus and associated method for conditioning in chemical mechanical planarization.
Osterheld, Thomas H.; Birang, Manoocher; Tolles, Robert D.; Zuniga, Steven; Garretson, Charles C., Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane.
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