Encapsulation of organic devices
원문보기
IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0434323
(2012-03-29)
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등록번호 |
US-8552644
(2013-10-08)
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발명자
/ 주소 |
- Hunze, Arvid
- Henseler, Debora
- Heuser, Karsten
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출원인 / 주소 |
- OSRAM Opto Semiconductors GmbH
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
0 인용 특허 :
10 |
초록
▼
Presented an organic light-emitting device (OLED) that includes at least one active region, at least one organic layer, a first glass plate on which the at least one active region is applied, and a second glass plate. The active region is disposed between the first and the second glass plates. The f
Presented an organic light-emitting device (OLED) that includes at least one active region, at least one organic layer, a first glass plate on which the at least one active region is applied, and a second glass plate. The active region is disposed between the first and the second glass plates. The first and second glass plates are at least partially transparent in the near infrared spectral range. The OLED further includes a bonding material that includes a solder glass and is disposed between the first and second glass plates. The bonding material forms at least one frame that surrounds the active region and mechanically connects the first glass plate with the second glass plate and seals the active region. The bonding material absorbs near infrared radiation. The OLED further includes spacer particles that have a mean diameter that maintains a height between the first and second glass plates.
대표청구항
▼
1. An organic light-emitting device, comprising: at least one active region comprising at least one organic layer;a first glass plate on which the at least one active region is applied;a second glass plate, said at least one active region being disposed between said first and said second glass plate
1. An organic light-emitting device, comprising: at least one active region comprising at least one organic layer;a first glass plate on which the at least one active region is applied;a second glass plate, said at least one active region being disposed between said first and said second glass plates, said first and said second glass plates being at least partially transparent in the near infrared spectral range;a bonding material comprising a solder glass and disposed between said first and said second glass plates, said bonding material forming at least one frame that surrounds said at least one active region and mechanically connecting said first glass plate with said second glass plate and sealing said at least one active region, said bonding material absorbing near infrared radiation; andspacer particles having a mean diameter that maintains a height between said first and said second glass plates,wherein said second glass plate comprises a coating on a side facing said first glass plate, said spacer particles being embedded in said coating,wherein a thickness of said coating excluding said spacer particles is smaller than the mean diameter of said spacer particles, andwherein said spacer particles are covered by the at least one organic layer. 2. The device of claim 1, wherein said spacer particles comprise a non-conductive material. 3. The device of claim 1, further comprising at least one getter material, which binds harmful atmospheric gases and which is located between said first and said second glass plate and within said frame. 4. The device of claim 3, wherein said getter material comprises an alkaline earth metal. 5. The device of claim 3, wherein said getter material forms a layer, and said layer covers the active region. 6. The device of claim 3, wherein said getter material comprises Barium. 7. The device of claim 3, wherein said getter material forms a ring and is located in an area between said active region and said bonding material. 8. The device of claim 7, wherein said getter material comprises a height equal to the height between said first and said second glass plate. 9. The device of claim 7 further comprising a protective layer between said getter material and said first glass plate. 10. The device of claim 9, wherein said protective layer comprises an insulating material. 11. The device of claim 7, wherein said ring of said getter material comprises a plurality of getter patches separated by channels. 12. The device of claim 1, further comprising at least one getter material, which is included in the bonding material. 13. The device of claim 1, wherein the bonding material is an epoxy adhesive. 14. The device of claim 1, wherein the bonding material is a solder glass. 15. The device of claim 1, wherein the second glass plate has a cavity that corresponds to the at least one active region. 16. The device of claim 1, wherein the second glass plate is a plane plate. 17. The device of claim 1, further comprising an electrode and a bond pad on said electrode outside the at least one active region, wherein the bonding layer covers said electrode in a region between the bond pad and the at least one organic layer.
이 특허에 인용된 특허 (10)
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Kobayashi,Shigetaka; Yamada,Takeshi; Hanada,Masaki, Bonding method and apparatus.
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Lim, Hooi Bin; Klausmann, Hagen; Fritz, Bernd, Electrode patterning in OLED devices.
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Pichler,Karl, Encapsulation of thin-film electronic devices.
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Aitken,Bruce G.; Carberry,Joel P.; DeMartino,Steven E.; Hagy,Henry E.; Lamberson,Lisa A.; Miller, II,Richard J.; Morena,Robert; Schroeder, III,Joseph F.; Streltsov,Alexander; Widjaja,Sujanto, Glass package that is hermetically sealed with a frit and method of fabrication.
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Grimm Robert A., Joining method.
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Low, Hong Yee; Chua, Soo Jin; Guenther, Ewald Karl Michael, Oled packaging.
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Guenther, Ewald; Bin, Lim Hooi; Vin, Soh Ed; Siong, Tan Hou; Klausmann, Hagen, Patterning of electrodes in oled devices.
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Auch, Mark; Guenther, Ewald; Jin, Chua Soo, Procedure for encapsulation of electronic devices.
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Langer, Alfred; Messner, Ekkehard, Process for encapsulating a component made of organic semiconductors.
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Guenther, Ewald; Lim, Hooi Bin; Soh, Ed Vin; Tan, Hou Siong; Klausmann, Hagen, Robust electrode patterning in OLED devices.
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