Low-noise cooling apparatus
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0492496
(2012-06-08)
|
등록번호 |
US-8554294
(2013-10-08)
|
우선권정보 |
KR-10-2009-0132781 (2009-12-29) |
발명자
/ 주소 |
- Kim, Ki-woong
- Kang, Chan Seok
- Hwang, Seong-min
- Lee, Seong-Joo
- Lee, Yong-Ho
|
출원인 / 주소 |
- Korea Research Institute of Standards and Science
|
대리인 / 주소 |
Jenkins, Wilson, Taylor & Hunt, P.A.
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
2 |
초록
▼
A low-noise cooling apparatus is provided. The cooling apparatus includes an outer container and an inner container. A thermal insulation layer in a vacuum state is disposed between the outer container and the inner container. The inner container includes a Dewar containing a liquid refrigerant, a p
A low-noise cooling apparatus is provided. The cooling apparatus includes an outer container and an inner container. A thermal insulation layer in a vacuum state is disposed between the outer container and the inner container. The inner container includes a Dewar containing a liquid refrigerant, a prepolarization coil arranged inside the inner container and immersed in the liquid refrigerant, a pick-up coil immersed in the liquid refrigerant, and a superconducting quantum interference device (SQUID) electrically connected to the pick-up coil and immersed in the liquid refrigerant. The prepolarization coil is made of a superconductor.
대표청구항
▼
1. A low-noise cooling apparatus comprising: a Dewar including an outer container and an inner container containing a liquid refrigerant;a prepolarization coil disposed inside the inner container and immersed in the liquid refrigerant;a pick-up coil immersed in the liquid refrigerant; anda supercond
1. A low-noise cooling apparatus comprising: a Dewar including an outer container and an inner container containing a liquid refrigerant;a prepolarization coil disposed inside the inner container and immersed in the liquid refrigerant;a pick-up coil immersed in the liquid refrigerant; anda superconducting quantum interference device (SQUID) electrically connected to the pick-up coil and immersed in the liquid refrigerant,wherein the prepolarization coil is made of a superconductor,wherein a gap between the outer container and the inner container is functioned as a thermal insulation layer in vacuum,wherein a sample is magnetized by the prepolarization coil and becomes a measurement target of the pick-up coil, andwherein the Dewar has a concave shape with a recessed space in which the sample is disposed. 2. The low-noise cooling apparatus of claim 1, wherein the outer container includes: an outer body part; andan outer concave part surrounding the sample such that the sample is disposed in the center of a region in which the prepolarization coil is disposed, andwherein the inner container includes:an inner neck part combined with the outer container;an inner body part connected to the inner neck part; andan inner concave part connected to the inner body part to cover the outer concave part and disposed around the outer concave part. 3. The low-noise cooling apparatus of claim 2, further comprising: at least one conductive thermal shield layer combined with the inner neck part to cover the inner body part. 4. The low-noise cooling apparatus of claim 3, wherein the conductive thermal shield layer includes: a plate-type part combined with the inner neck part to cover the inner body part; anda strip part continuously connected to the plate-type part cover the lower part of the inner body part. 5. The low-noise cooling apparatus of claim 3, further comprising: at least one super thermal insulation layer disposed between the inner concave part and the outer concave part and covering the outer concave part. 6. The low-noise cooling apparatus of claim 5, wherein the super thermal insulation layer includes: a filament fiber; andan anisotropic electrically conductive material deposited on the filament fiber and having an electrically conductive region intermittently formed according to waviness of the filament fibers. 7. The low-noise cooling apparatus of claim 3, further comprising: at least one electrically non-conductive auxiliary thermal shield layer combined with the thermal shield layer and disposed between the inner concave part and the outer concave part. 8. The low-noise cooling apparatus of claim 7, wherein the electrically non-conductive auxiliary thermal shield layer includes at least one of alumina, aluminum nitride, and boron nitride. 9. The low-noise cooling apparatus of claim 2, wherein the prepolarization coil is disposed to cover the inner concave part, and a portion or the entirety of the pick-up coil is disposed between the prepolarization coil and the inner concave part. 10. The low-noise cooling apparatus of claim 2, wherein the prepolarization coil includes one or more coils connected in series or parallel, and a prepolarization magnetic field generated by the prepolarization coil is in a direction perpendicular to the central axis of the inner concave part. 11. The low-noise cooling apparatus of claim 2, wherein the prepolarization coil includes one or more coils connected in series or parallel, and a prepolarization magnetic field generated by the prepolarization coil is paraxial to the inner concave part. 12. The low-noise cooling apparatus of claim 1, wherein the prepolarization coil includes: an alloy-material matrix of high resistance; anda plurality of fine superconductor filaments embedded in the matrix. 13. The low-noise cooling apparatus of claim 12, wherein each of the superconductor filaments includes at least one of NbTi, Nb3Sn, and MgB2. 14. The low-noise cooling apparatus of claim 1, further comprising: a connector electrically connecting the prepolarization coil and a power supply to each other,wherein the connector includes:a first wiring made of a superconductor partially immersed in the liquid refrigerant and electrically connected to the prepolarization coil; anda second wiring electrically connected to one end of the first wiring exposed from the liquid refrigerant and exposed from the refrigerant, andwherein the second wiring being a solid-wire, stranded-wire or Litz-wire resistive conductor. 15. A low-noise cooling apparatus comprising: an outer container;an inner container disposed inside the outer container and including an inner neck part and an inner body part;at least one conductive thermal shield layer connected to the inner neck part and disposed to cover at least a side of the inner body part;an electrically non-conductive auxiliary thermal shield layer disposed in contact with the conductive thermal shield layer in a region adjacent to a sample disposed below the outer container;a prepolarization coil disposed inside the inner container and immersed in a liquid refrigerant;a pick-up coil disposed paraxial to the prepolarization coil and immersed in the liquid refrigerant; anda superconducting quantum interference device (SQUID) electrically connected to the pick-up coil and immersed in the liquid refrigerant,wherein a gap between the outer container and the inner container is functioned as a thermal insulation layer in vacuum. 16. The low-noise cooling apparatus of claim 15, wherein the outer container further includes an outer protrusive part, and the inner container further includes an inner protrusive part, wherein the inner protrusive part is disposed inside the outer protrusive part, andwherein the auxiliary thermal shield layer is disposed between a lower surface of the inner protrusive part and a lower surface of the outer protrusive part. 17. The low-noise cooling apparatus of claim 15, wherein the outer container further includes an outer concave part, and the inner container further includes an inner concave part, wherein the outer concave part is disposed inside the inner concave part, andwherein the auxiliary thermal shield layer is disposed between the outer concave part and the inner concave part.
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