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A cooling system and method for cooling electronic components. The cooling system employs a cooling device that includes a composite structure having first and second plates arranged substantially in parallel and bonded together to define a sealed cavity therebetween. The first plate has a surface t

A cooling system and method for cooling electronic components. The cooling system employs a cooling device that includes a composite structure having first and second plates arranged substantially in parallel and bonded together to define a sealed cavity therebetween. The first plate has a surface that defines an outer surface of the composite structure and is adapted for thermal contact with at least one electronic component. A mesh of interwoven strands is disposed within the cavity and lies in a plane substantially parallel to the first and second plates. A fluid is contained and sealed within the cavity of the composite structure, and is pumped through interstices defined by and between the strands of the mesh. Flow dividers can define interconnected channels within the cavity.

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1. A cooling device comprising: a first plate and a second plate arranged substantially in parallel and bonded together to define a sealed cavity between the first plate and the second plate, the first plate having an outer surface adapted for thermal contact with at least one electronic component;a

1. A cooling device comprising: a first plate and a second plate arranged substantially in parallel and bonded together to define a sealed cavity between the first plate and the second plate, the first plate having an outer surface adapted for thermal contact with at least one electronic component;a mesh disposed within the sealed cavity and lying in a plane substantially parallel to the first and second plates, the mesh comprising interwoven strands extending between the first plate and the second plate;a fluid contained and sealed within the sealed cavity;interstices defined by and between the interwoven strands of the mesh through which the fluid within the sealed cavity is able to flow; anda pump mounted within the sealed cavity, the pump configured to circulate the fluid within the sealed cavity in a flow direction generally parallel to the first and second plates so that the fluid flow becomes turbulent as the fluid is forced to flow through the interstices. 2. The cooling device according to claim 1, further comprising a plurality of elongate flow dividers within the sealed cavity that connect the first plate to the second plate along the length of each elongate flow divider, the flow dividers placed so as to define fluidically interconnected channels within the composite structure that direct the fluid flow in a serpentine path. 3. The cooling device according to claim 2, wherein the flow dividers are defined by embossed portions of at least one of the first and second plates. 4. The cooling device according to claim 2, wherein the fluidically interconnected channels are interconnected in fluidic series. 5. The cooling device according to claim 3, wherein the second plate is embossed sufficiently to reach across the cavity to engage the first plate so as to define the flow dividers, and the first plate is not embossed to define the flow dividers. 6. The cooling device according to claim 5, wherein peripheral edges of both the first and second plates are embossed, and the first and second plates are bonded together at their embossed peripheral edges. 7. The cooling device according to claim 6, wherein the second plate is flat between its embossed peripheral edges. 8. The cooling device according to claim 1, wherein the composite structure is configured so that heat transfer from the electronic component is through the first plate, through the sealed cavity containing the mesh and the fluid, and through the second plate, from which heat is dissipated by convection to the environment. 9. The cooling device according to claim 1, wherein interwoven strands of the mesh are bonded to the first plate and the second plate. 10. A method comprising: absorbing heat dissipated by an electronic component with a first plate arranged substantially in parallel and bonded to a second plate so as to define a sealed cavity between the first and second plates, the first plate having a surface that defines an outer surface of the sealed cavity and is adapted for thermal contact with an electronic component;pumping a fluid through a serpentine path formed by embossed dividers within the sealed cavity, the serpentine path extending parallel to the first and second plates;transferring the absorbed heat through the sealed cavity and into the second plate via the fluid and a mesh contained in the sealed cavity, the mesh lying in a plane substantially parallel to the first and second plates, the mesh comprising interwoven strands extending between the first and second plates and defining interstices through which the fluid is able to flow, the pump forcing fluid through the interstices so that the fluid flow through the interstices becomes turbulent, the mesh conducting heat from the first plate to the second plate, the turbulent fluid flow convecting heat from the first plate and/or a first portion of the mesh to the second plate at least one of the first portion of the mesh and a second portion of the mesh, the second portion of the mesh spaced from the first plate and the first portion of the mesh; anddissipating the absorbed heat to the environment with the second plate. 11. The method according to claim 10, wherein the fluidically interconnected channels are interconnected in fluidic series. 12. The method according to claim 10, wherein the composite structure is configured so that heat transfer from the electronic component is primarily through the first plate, through the sealed cavity containing the mesh and the fluid, and through the second plate, from which the heat is dissipated by convection to the environment. 13. The method according to claim 10, further comprising providing a pump mounted within the composite structure. 14. The method according to claim 10, wherein only the second plate is embossed to define the flow dividers, and the first plate is not embossed to define the flow dividers. 15. The method according to claim 14, wherein peripheral edges of both the first and second plates are embossed, and the first and second plates are bonded together at their embossed peripheral edges. 16. The method according to claim 15, wherein the second plate is flat between its embossed peripheral edges. 17. The method according to claim 10, wherein interwoven strands of the mesh are bonded to the first plate and the second plate. 18. A cooling device comprising: a first plate and a second plate arranged substantially in parallel to one another and bonded together along bonding edges so as to define a sealed cavity between the first and second plates, the first plate having a surface that defines an outer surface of the sealed cavity and is adapted for thermal contact with an electronic component;a fluid contained and sealed within the sealed cavity;means for thermally connecting the first and second plates via thermal conduction in the sealed cavity between the bonding edges, the fluid within the sealed cavity contacting and flowing across the means for thermally connecting the first and second plates via thermal conduction, the fluid absorbing heat by thermal convection from the first plate and the means for thermally connecting the first and second plates via thermal conduction, and thermally convecting the heat to the second plate; andmeans for dividing the sealed cavity into fluidically interconnected channels that direct a fluid flow in a serpentine path within the sealed cavity.