초록 ▼

A noise dampening energy efficient circuit board includes a carbon material layer for dampening electromagnetic interference between surface mount components and trace patterns of the circuit board. One or more ground plane layers are arranged relative to the carbon material layer to cooperatively d

A noise dampening energy efficient circuit board includes a carbon material layer for dampening electromagnetic interference between surface mount components and trace patterns of the circuit board. One or more ground plane layers are arranged relative to the carbon material layer to cooperatively dampen and repel noise of varying frequencies. The positioning of the carbon material layer with respect to the ground plane layer enhances the ground plane operation. Glass fiber material layers and other insulating dielectric layers are disposed at particular locations within the noise dampening energy efficient circuit board. The carbon material layer and the ground plane layer dampen electromagnetic noise, thereby permitting energy saving design considerations, increasing energy efficiencies and reducing power consumption. Mounting posts of the surface mount components include insulating sleeves to selectively insulate different layers of the circuit board from surface mount components. Methods for constructing and using the circuit board are also disclosed.

대표청구항 ▼

1. A noise dampening energy efficient circuit board, comprising: a first insulating dielectric layer;a carbon material layer disposed on the first dielectric layer, the carbon material layer extending contiguously between the edges of the circuit board;a second insulating dielectric layer having a p

1. A noise dampening energy efficient circuit board, comprising: a first insulating dielectric layer;a carbon material layer disposed on the first dielectric layer, the carbon material layer extending contiguously between the edges of the circuit board;a second insulating dielectric layer having a particular thickness, the second insulating dielectric layer disposed on the carbon material layer; anda conductive layer formed into a conductive pattern, the conductive layer disposed on the second insulating dielectric layer,wherein the carbon material layer includes resin-impregnated carbon fiber fabric;the carbon material layer being encapsulated between the insulating dielectric layers so as to float in electrical isolation from the conductive layer, and having resin-impregnated carbon fibers extending contiguously between the edges of the circuit board substantially parallel to the dielectric and conductive layers and being resistively conductive to electromagnetic radiation to dampen electromagnetic noise relative to the conductive layer, wherein, the resin-impregnated carbon fiber fabric has a specific resistance no greater than 100 Ω/cm2. 2. The noise dampening energy efficient circuit board of claim 1, wherein: each insulating dielectric layer includes glass fiber material. 3. The noise dampening energy efficient circuit board of claim 1, further comprising: one or more through-holes extending through the conductive layer, the carbon material layer and the insulating dielectric layers including through the conductive pattern formed in the conductive layer;a surface mount component disposed on an upper surface of a portion of the pattern, the surface mount component including one or more mounting posts; andone or more insulating sleeves disposed around the one or more mounting posts of the surface mount component,wherein:the surface mount component having the one or more insulated mounting posts is inserted in the one or more through-holes so that the sleeves selectively insulate the one or more mounting posts from at least one layer of the circuit board; andthe one or more insulative sleeves are configured to selectively insulate the one or more mounting posts from the carbon material layer. 4. The noise dampening energy efficient circuit board of claim 3, wherein the one or more sleeves are configured to selectively insulate the one or more mounting posts from all of the insulating dielectric layers, and the carbon material layer. 5. The noise dampening circuit energy efficient board of claim 3, wherein the carbon material layer is structured of woven or nonwoven carbon fiber fabric including carbon fiber strands oriented in a direction similar to a trace pattern in the conductive pattern to reduce phase shift and dampen electromagnetic noise transmitted between surface mount components. 6. The noise dampening energy efficient circuit board of claim 1, including a second conductive layer formed on a side of the first dielectric layer opposite the carbon material layer and the carbon material layer is electrically isolated from the second conductive layer. 7. The noise dampening energy efficient circuit board of claim 6, including a mounting post extending through the board to electrically couple the conductive layers, the mounting post insulatively encapsulated within the carbon material layer. 8. A noise dampening energy efficient circuit board having a length and a width defined by edges, comprising: a carbon material layer extending contiguously between the edges of the circuit board;a glass fiber material layer having a particular thickness, the glass fiber material layer disposed on the carbon material layer; anda conductive layer configured into a conductive pattern, the conductive layer disposed on the glass fiber material layer,wherein the carbon material layer is comprised of resin-impregnated carbon fiber fabric floating in electrical isolation from the conductive layer, and including carbon fiber strands or threads that are resistively conductive of electromagnetic radiation and extend substantially the length or width of the circuit board to dampen electromagnetic noise relative to the conductive layer, wherein, the resin-impregnated carbon fiber fabric has a specific resistance no greater than 100 Ω/cm2. 9. The noise dampening energy efficient circuit board of claim 8, further comprising an insulating dielectric layer, wherein the carbon material layer is disposed on the dielectric layer so as to be encapsulated between the glass fiber material layer and the insulating dielectric layer. 10. The noise dampening energy efficient circuit board of claim 8, further comprising: a surface mount component disposed on an upper surface of the conductive layer, the surface mount component including one or more mounting posts having one or more electrically insulating sleeves,wherein the carbon material layer is electrically isolated from the one or more mounting posts, any other electrical circuit, and earth ground. 11. The noise dampening energy efficient circuit board of claim 10, wherein the one or more sleeves are disposed around the one or more mounting posts and extend at least from an upper surface of the glass fiber material layer to a lower surface of the carbon material layer. 12. The noise dampening energy efficient circuit board of claim 10, further comprising an insulating dielectric layer, wherein the one or more sleeves are disposed around the one or more mounting posts and extend at least from an upper surface of the carbon material layer to a lower surface of the insulating dielectric layer, wherein the carbon material layer is disposed on the dielectric layer. 13. The noise dampening energy efficient circuit board of claim 10, wherein the one or more sleeves are disposed around the one or more mounting posts and extend at least from the upper surface of the carbon material layer to a lower surface of the carbon material layer.