Defected ground structure with shielding effect
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0902155
(2010-10-12)
|
등록번호 |
US-8570114
(2013-10-29)
|
우선권정보 |
TW-99130391 A (2010-09-08) |
발명자
/ 주소 |
- Wu, Tzong-Lin
- Hsu, Yu-Hao
- Tsai, Chung-Hao
|
출원인 / 주소 |
- National Taiwan University
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
3 |
초록
▼
A defected ground structure with shielding effect is provided. The structure includes a dielectric layer, a defected metal layer, a grounded metal layer and at least a conductive mushroom-like structure. The defected metal layer has a line-shaped opening and is disposed in the dielectric layer. The
A defected ground structure with shielding effect is provided. The structure includes a dielectric layer, a defected metal layer, a grounded metal layer and at least a conductive mushroom-like structure. The defected metal layer has a line-shaped opening and is disposed in the dielectric layer. The conductive mushroom-like structure is disposed between the defected metal layer and the grounded metal layer and is arranged along an extending direction of the line-shaped opening periodically. The conductive mushroom-like structure includes a laterally extending member and a vertically extending member. The laterally extending member is parallel to the defected metal layer and a distance is maintained away from the defected metal layer. The projection area of the laterally extending member on the defected metal layer covers a length of the line-shaped opening corresponding to the laterally extending member. The vertically extending member connects the laterally extending member and the grounded metal layer.
대표청구항
▼
1. A defected ground structure with a shielding effect, comprising: a dielectric layer, having a first surface and a second surface opposite to the first surface;a defected metal layer, disposed in the dielectric layer and located between the first surface and the second surface, and having a line-s
1. A defected ground structure with a shielding effect, comprising: a dielectric layer, having a first surface and a second surface opposite to the first surface;a defected metal layer, disposed in the dielectric layer and located between the first surface and the second surface, and having a line-shaped opening, wherein the defected metal layer does not connect the grounded metal layer;a grounded metal layer, disposed on the second surface; andat least one conductive mushroom-like structure, disposed between the defected metal layer and the grounded metal layer, arranged along an extending direction of the line-shaped opening periodically, and the conductive mushroom-like structure comprising: a laterally extending member, parallel to the defected metal layer, and a distance being maintained between the laterally extending member and the defected metal layer, wherein a projection area of the laterally extending member on the defected metal layer covers a portion of the line-shaped opening corresponding to the projection area of the laterally extending member; anda vertically extending member, connecting the laterally extending member and the grounded metal layer. 2. The defected ground structure with the shielding effect as claimed in claim 1, wherein the defected metal layer has another line-shaped opening, and the projection area of the laterally extending member on the defected metal layer covers a portion of the other line-shaped opening corresponding to the projection area of the laterally extending member. 3. The defected ground structure with the shielding effect as claimed in claim 1, wherein the vertically extending member comprises a conductive through via. 4. The defected ground structure with the shielding effect as claimed in claim 1, wherein the vertically extending member comprises a plurality of turning sections. 5. The defected ground structure with the shielding effect as claimed in claim 1, wherein the defected metal layer further comprises: a first rectangular opening; anda second rectangular opening, the first rectangular opening and the second rectangular opening being respectively connected to two ends of the line-shaped opening, and a length of a contact side of the first rectangular opening or the second rectangular opening and the line-shaped opening being greater than a width of the line-shaped opening. 6. The defected ground structure with the shielding effect as claimed in claim 1, wherein the conductive mushroom-like structure is arranged along the extending direction of the line-shaped opening periodically, and a predetermined space is maintained between two adjacent conductive mushroom-like structures. 7. The defected ground structure with the shielding effect as claimed in claim 1, wherein the distance between the laterally extending member and the defected metal layer is smaller than a distance between the laterally extending member and the grounded metal layer. 8. The defected ground structure with the shielding effect as claimed in claim 1, wherein the laterally extending member is a metal layer. 9. The defected ground structure with the shielding effect as claimed in claim 8, wherein a shape of the metal layer comprises a rectangle, an ellipse or an irregular geometric figure. 10. The defected ground structure with the shielding effect as claimed in claim 8, wherein the vertically extending member penetrates through the metal layer. 11. The defected ground structure with the shielding effect as claimed in claim 1, further comprising: a first microstrip line, disposed on the first surface. 12. The defected ground structure with the shielding effect as claimed in claim 11, further comprising: a second microstrip line, disposed on the first surface, and parallel to the first microstrip line.
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