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A hermetic feedthrough for an implantable medical device includes an insulator, a conduit integrated with the insulator, and a pad coupled to an exterior surface of the insulator. The insulator includes a first material and the conduit includes a second material that is electrically conductive. The

A hermetic feedthrough for an implantable medical device includes an insulator, a conduit integrated with the insulator, and a pad coupled to an exterior surface of the insulator. The insulator includes a first material and the conduit includes a second material that is electrically conductive. The pad is configured to receive a lead coupled thereto. Further, the pad is electrically conductive and coupled to the conduit. The pad includes a first layer and a second layer overlaying at least a portion of the first layer.

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1. A hermetic feedthrough for an implantable medical device, comprising: an insulator comprising a first material and a through-hole;a conduit integrated with the insulator and comprising a sintered conductor filling the through-hole, wherein the conduit extends through the insulator and is configur

1. A hermetic feedthrough for an implantable medical device, comprising: an insulator comprising a first material and a through-hole;a conduit integrated with the insulator and comprising a sintered conductor filling the through-hole, wherein the conduit extends through the insulator and is configured to conduct electricity through the insulator, and wherein the sintered conductor of the conduit comprises a second material that is electrically conductive; anda pad coupled to an exterior surface of the insulator and configured to receive a lead coupled thereto, wherein the pad is electrically conductive and coupled to the conduit;wherein the insulator, the conduit, and the pad comprise a co-fired bond therebetween, the co-fired bond hermetically seals the conduit with the insulator, and the hermetic seal is biostable such that immersion durability is maintained after attachment of the lead to the pad;wherein the pad comprises a first layer and a second layer overlaying at least a portion of the first layer, and the pad has a thickness of at least 50 μm; andwherein the hermetic feedthrough is configured to be coupled to a wall of the implantable medical device such that the lead may be coupled to the pad external to the medical device. 2. The feedthrough of claim 1, wherein the pad had a thickness of less than approximately 200 μm. 3. The feedthrough of claim 1, wherein the pad has a top surface area of more than 20 mil by 20 mil. 4. The feedthrough of claim 3, wherein a center 50% of the top surface area of the pad has a root mean square value of less than about 10 μm for flatness. 5. The feedthrough of claim 1, wherein the first layer of the pad separates the second layer of the pad from the first material of the insulator such that the second layer of the pad is not in direct contact with the first material of the insulator. 6. The feedthrough of claim 1, wherein the pad is a first pad, and the feedthrough further comprises a second pad coupled to the conduit on a side of the insulator opposite to the first pad, and wherein the first pad is larger than the second pad. 7. The feedthrough of claim 1, wherein the first material comprises alumina. 8. The feedthrough of claim 7, wherein the second material comprises platinum and an alumina additive. 9. The feedthrough of claim 8, wherein the second layer of the pad comprises a third material that is different from the first and second materials. 10. The feedthrough of claim 9, wherein the third material comprises platinum. 11. The feedthrough of claim 1, further comprising a lead coupled to the pad, wherein the lead comprises a biostable, biocompatible electrical conductor, and is attached to an exterior surface of the pad. 12. The feedthrough of claim 11, wherein the lead comprises at least one material selected from the group consisting of niobium, platinum, titanium, tantalum, zirconium, palladium, gold, refractory metals, and oxides and alloys of any of the foregoing materials. 13. The hermetic feedthrough of claim 1, wherein the conduit extends through the insulator and is configured to conduct electricity through the insulator; wherein the pad is mounted to the insulator;wherein the first layer of the pad comprises the second material and the second layer is separated from the first material of the insulator by the first layer; andwherein the insulator, the conduit, and the pad have a co-fired bond therebetween, wherein the co-fired bond hermetically seals the pad and the conduit with the insulator, and wherein the hermetic seal is biostable such that immersion durability is maintained after attachment of the lead to the pad. 14. The hermetic feedthrough of claim 13, wherein the second layer of the pad comprises a third material. 15. The hermetic feedthrough of claim 14, wherein the first material comprises alumina, wherein the second material comprises platinum and an alumina additive. 16. The hermetic feedthrough of claim 15, wherein the third material comprises platinum. 17. The hermetic feedthrough of claim 16, wherein the second material consists essentially of platinum and alumina, and the third material consists essentially of platinum. 18. The hermetic feedthrough of claim 1, wherein the first layer and the second layer of the pad have a co-fired bond therebetween. 19. The hermetic feedthrough of claim 18, wherein the insulator, the conduit, the first layer of the pad, and the second layer of the pad have a co-fired bond therebetween. 20. The hermetic feedthrough of claim 1, wherein the pad comprises a third layer on the second layer, and a fourth layer on the third layer, wherein the third and fourth layers comprise a third material that is different from the first and second materials. 21. A method of manufacturing a feedthrough, comprising: providing an insulator comprising a first material and a through hole, the insulator having a conduit comprising a sintered conductor filling the through-hole, wherein the conduit extends through the insulator and is configured to conduct electricity through the insulator, the sintered conductor of the conduit comprises a second material, and wherein the first material is an electrical insulator and the second material is electrically conductive;printing a first layer of a pad on the insulator, wherein the first layer overlays the conduit and is electrically coupled thereto, and wherein the first layer comprises the second material;printing a second layer of the pad on the first layer; andco-firing the insulator, the conduit, and the pad such that a bond therebetween fastens and hermetically seals the pad and the conduit with the insulator, wherein a hermetic seal therebetween is biostable such that immersion durability of the feedthrough is maintained after attachment of a lead to the pad;wherein the pad has a thickness of at least 50 μm, and the feedthrough is configured to be coupled to a wall of an implantable medical device such that the lead may be coupled to the pad external to the medical device. 22. The method of claim 21, wherein the conduit does not include glass, SiO2, MgO, or CaO prior to the co-firing. 23. The method of claim 22, wherein the conduit receives a diffusion of at least one of glass, SiO2, MgO, and CaO during the co-firing from the first material. 24. The method of claim 21, wherein the thickness of the pad is less than approximately 200 μm. 25. The method of claim 21, further comprising attaching a lead to the pad by at least one of laser welding, parallel gap welding, brazing, ultrasonic bonding, thermo-sonic bonding, soldering, and diffusion bonding. 26. The method of claim 21, wherein the first material comprises alumina and the second material comprises platinum and an alumina additive, and wherein the second layer of the pad comprises a third material comprising platinum. 27. The method of claim 26, further comprising printing a third layer on the second layer of the pad, and printing a fourth layer on the third layer, wherein the third and fourth layers comprise the third material, and wherein the fourth layer has a top surface area of more than 20 mil by 20 mil.