초록 ▼

A wet electrolytic capacitor that includes a porous anode body containing a dielectric layer, an electrolyte, and a cathode containing a metal substrate that is abrasive blasted is provided. Abrasive blasting may accomplish a variety of different purposes. For example, it may result in a surface tha

A wet electrolytic capacitor that includes a porous anode body containing a dielectric layer, an electrolyte, and a cathode containing a metal substrate that is abrasive blasted is provided. Abrasive blasting may accomplish a variety of different purposes. For example, it may result in a surface that is substantially uniform and macroscopically smooth, thereby increasing the consistency of conductive coatings formed thereon. While possessing a certain degree of smoothness, the abrasive blasted surface is nevertheless micro-roughened so that it contains a plurality of pits. The pits provide an increased surface area, thereby allowing for increased cathode capacitance for a given size and/or capacitors with a reduced size for a given capacitance. A conductive coating that contains a substituted polythiophene is disposed on the micro-roughened surface. The presence of the pits on the substrate enhances the degree of contact between the conductive coating and metal substrate, thereby resulting in improved mechanical robustness and electrical performance (e.g., reduced equivalent series resistance and leakage current).

대표청구항 ▼

1. A wet electrolytic capacitor comprising: a porous anode body that contains a dielectric layer formed by anodic oxidation;a liquid electrolyte;a metal casing within which the anode and the liquid electrolyte are positioned, wherein the metal casing defines an interior surface that contains a plura

1. A wet electrolytic capacitor comprising: a porous anode body that contains a dielectric layer formed by anodic oxidation;a liquid electrolyte;a metal casing within which the anode and the liquid electrolyte are positioned, wherein the metal casing defines an interior surface that contains a plurality of pits formed by abrasive blasting with an abrasive media, wherein the average depth of the pits ranges from about 200 to about 2500 nanometers; anda conductive coating disposed on the interior surface of the casing and within the pits thereof, wherein the conductive coating comprises poly(3,4-ethylenedioxythiophene). 2. The wet electrolytic capacitor of claim 1, wherein the coating has a thickness of from about 0.2 μm to about 50 μm. 3. The wet electrolytic capacitor of claim 1, wherein the anode body includes tantalum, niobium, or an electrically conductive oxide thereof. 4. The wet electrolytic capacitor of claim 1, wherein the metal substrate comprises titanium, tantalum, or a combination thereof. 5. The wet electrolytic capacitor of claim 1, wherein the liquid electrolyte is aqueous. 6. The wet electrolytic capacitor of claim 1, wherein the liquid electrolyte has a pH of from about 4.5 to about 7.0. 7. The wet electrolytic capacitor of claim 1, wherein the liquid electrolyte includes sulfuric acid. 8. The wet electrolytic capacitor of claim 1, wherein the casing is generally cylindrical. 9. A method for forming a wet electrolytic capacitor, the method comprising: propelling an abrasive media against an interior surface of a metal substrate to form a micro-roughened surface having a plurality of pits, wherein the pits have an average depth of from about 200 to about 2500 nanometers;forming a conductive coating on the micro-roughened surface, wherein the conductive coating comprises poly(3,4-ethylenedioxythiophene); andplacing the coated metal substrate into electrical communication with an anode and a liquid electrolyte, wherein the anode is formed from a porous anode body that contains a dielectric layer formed by anodic oxidation, wherein the coated metal substrate is a metal casing, further wherein the anode and liquid electrolyte are positioned within the metal casing. 10. The method of claim 9, wherein the pits have a peak-to-peak distance that ranges from about 30 to about 400 micrometers. 11. The method of claim 9, wherein the abrasive media includes ceramic particles. 12. The method of claim 9, wherein the abrasive media is propelled at a pressure of from about 10 to about 35 pounds per square inch. 13. The method of claim 9, wherein the abrasive media is propelled against the metal substrate for a time of from about 10 to about 30 seconds. 14. The method of claim 9, wherein the abrasive media is propelled through a nozzle. 15. The method of claim 14, wherein the nozzle rotates relative to the substrate. 16. The method of claim 9, wherein the abrasive media is removed from the surface prior to application of the conductive coating. 17. The method of claim 9, wherein the poly(3,4-ethylenedioxythiophene) is formed by in situ polymerization of a thiophene monomer. 18. The method of claim 9, wherein the conductive coating includes a dispersion of particles, the particles including the poly(3,4-ethylenedioxythiophene). 19. The method of claim 9, wherein the metal substrate comprises titanium, tantalum, or a combination thereof.