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특허 상세정보

Package having phase change materials and method of use in transport of temperature sensitive payload

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) F25D-025/00   
미국특허분류(USC) 062/062; 062/530
출원번호 US-0069230 (2011-03-22)
등록번호 US-8607581 (2013-12-17)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Briggs and Morgan, P.A.
인용정보 피인용 횟수 : 10  인용 특허 : 13

The present invention is directed to a transport package which efficiently maintains payload temperature within a predetermined temperature range during delivery through regions having ambient temperatures outside the desired range. The transport package is used for transporting temperature sensitive materials and thermally protecting the materials from cold and hot ambient temperatures in a manner that does not require a power source or other mechanical devices. Aspects of the invention relate to a temperature maintaining packaging system having an oute...


1. A package for transporting a temperature sensitive payload comprising: a container defining an interior volume;a plurality of insulation panels contained within the interior volume;a first hollow generally rectangular panel contained within the interior volume, said first hollow panel containing a first phase change material;a second hollow generally rectangular panel in thermal contact with the first hollow panel, said second hollow panel containing a second phase change material;preconditioning some of the plurality of phase change material into sol...

이 특허에 인용된 특허 (13)

  1. Colgan,Evan G.; Edwards,David L.; Fasano,Benjamin V.; Sikka,Kamal K.; Zitz,Jeffrey A.; Zou,Wei. Chip package having chip extension and method. USP2007077250576.
  2. Mayer,William N.. Container having passive controlled temperature interior. USP2008097422143.
  3. Mayer,William N.. Container having passive controlled temperature interior, and method of construction. USP2009037500593.
  4. Goodman,Chris B.; Robinson,Wayne Malcolm; Feingold,Barnett Dov. Cord blood and placenta collection kit. USP2006127147626.
  5. Salyer, Ival O.; Wynne, Nicholas; Swank, Michael Allen. Micropore open cell foam composite and method for manufacturing same. USP2004076765031.
  6. Miller, Drayton. Package system and method. USP2005046875486.
  7. Glover Richard John,CAX ; Bishop Michael Reginald,CAX ; Tencer Michal Stefan,CAX. Packaging system for thermally controlling the temperature of electronic equipment. USP2000086104611.
  8. Wessling, Francis C.; Blackwood, James M.; Elliott, Gabrial A.; O'Brien, Susan K.. Passive thermal control enclosure for payloads. USP2004046718776.
  9. Ted J. Malach CA. Phase change formulation. USP2002116482332.
  10. Mayer,William. Thermal insert for container having a passive controlled temperature interior. USP2007087257963.
  11. Romero,Benjamin. Thermal packaging system. USP2007117294374.
  12. Frysinger Clinton ; Graber James ; Musgrave Dwight ; Siders Linda ; Thune Gregory ; Muffett Dorothy J. ; Lehman Joseph. Thermally insulated container. USP2001066244458.
  13. Stapf,Donald; Leland,Keith J.. Warming pack with temperature uniformity and temperature stabilization. USP2006057041123.