Process for producing a 3-dimensional component by selective laser melting (SLM)
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B23K-026/14
B22D-027/02
출원번호
US-0009941
(2011-01-20)
등록번호
US-8610027
(2013-12-17)
발명자
/ 주소
Hövel, Simone
Stankowski, Alexander
Rickenbacher, Lukas
출원인 / 주소
Alstom Technology Ltd
대리인 / 주소
Buchanan Ingersoll & Rooney PC
인용정보
피인용 횟수 :
2인용 특허 :
4
초록▼
A process produces a 3-dimensional component (16) by selective laser melting (SLM), in which the component (16) is formed on a foundation with a surface, e.g., a platform (10) or a support, which in particular is a component of the same type which has already been produced previously, by successivel
A process produces a 3-dimensional component (16) by selective laser melting (SLM), in which the component (16) is formed on a foundation with a surface, e.g., a platform (10) or a support, which in particular is a component of the same type which has already been produced previously, by successively melting layers of a first metal powder to form a sequence of stacked layers. The process is substantially simplified and made more flexible by virtue of the fact that the separation of the finished component (16) from the surface of the platform (10) or the support thereof is simplified by providing a separating layer (11) between the component (16) and the platform (10) or the support, this separating layer making it possible to separate the finished component (16) from the platform (10) or the support without damaging the finished component (16).
대표청구항▼
1. A process for producing a 3-dimensional component, the process comprising: providing a separating layer on a surface;forming the component on the surface by successively melting layers of a first metal powder by selective laser melting (SLM) to form a sequence of stacked layers;wherein separation
1. A process for producing a 3-dimensional component, the process comprising: providing a separating layer on a surface;forming the component on the surface by successively melting layers of a first metal powder by selective laser melting (SLM) to form a sequence of stacked layers;wherein separation of the component from the surface is simplified by the separating layer between the component and the surface, the separating layer being configured and arranged to permit separation of the component from the surface without damaging the component; andwherein providing the separating layer comprises providing a layer formed of a meltable material having a melting point which is lower than a melting point of the first metal powder used to form the component. 2. The process as claimed in claim 1, wherein providing the separating layer comprises forming a layer from a second metal powder and said forming comprises melting the second metal powder in layers. 3. The process as claimed in claim 2, wherein melting the second metal powder comprises melting with laser radiation. 4. The process as claimed in claim 2, wherein providing the separating layer comprises providing a homogeneous layer. 5. The process as claimed in claim 2, wherein providing the separating layer comprises providing a multilayer arrangement. 6. The process as claimed in claim 1, wherein providing the separating layer comprises providing a layer formed from a solder. 7. The process as claimed in claim 6, wherein said solder comprises a solder alloy based on a metal selected from the group consisting of Al, Ag, Cu, Sn, Cd, Zn, Pb, In, Ga, Bi, and Sb. 8. The process as claimed in claim 1, wherein the separating layer meltable material has a melting temperature of above 100° C. 9. The process as claimed in claim 1, wherein the separating layer meltable material has a melting temperature of above 300° C. 10. The process as claimed in claim 1, wherein the melting point of the first metal powder is above 700° C. 11. The process as claimed in claim 1, wherein the melting point of the first metal powder is between 700° C. and 1700° C. 12. The process as claimed in claim 1, wherein the first metal powder is a powder selected from the group consisting of a nickel-based alloy, a cobalt-based alloy, a titanium-based alloy, and an iron-based alloy. 13. The process as claimed in claim 1, further comprising: separating the component from the surface after said forming, including melting the separating layer without machining. 14. The process as claimed in claim 13, wherein melting comprises melting the separating layer by local heating in the region of the separating layer. 15. The process as claimed in claim 14, wherein local heating comprises inductive heating. 16. The process as claimed in claim 14, wherein local heating comprises irradiating. 17. The process as claimed in claim 14, wherein local heating comprises heating in a heated bath. 18. The process as claimed in claim 1, wherein providing a separating layer comprises providing a layer having a thickness between 30 μm and 300 μm. 19. The process as claimed in claim 1, wherein providing a separating layer comprises providing a layer having a thickness between 50 μm and 150 μm. 20. The process as claimed in claim 1, wherein providing a separating layer comprises providing a layer having a thickness between 60 μm and 100 μm. 21. The process as claimed in claim 13, wherein forming the component comprises forming an overdimensioned portion of the component adjacent to the separating layer, the overdimensioned portion comprising an interdiffusion zone having a thickness selected based on the characteristics of the separating layer meltable material, and further comprising: removing the overdimensioned portion after said separating. 22. The process as claimed in claim 21, wherein forming an overdimensioned portion comprises forming an interdiffusion zone with a thickness not more than 500 μm. 23. The process as claimed in claim 21, wherein forming an overdimensioned portion comprises forming an interdiffusion zone with a thickness less than 200 μm. 24. The process as claimed in claim 1, wherein providing a separating layer comprises providing a metal foil. 25. The process as claimed in claim 24, wherein providing the metal foil comprises fixing in place the metal foil by laser radiation. 26. The process as claimed in claim 24, wherein: the metal foil comprises an addition to reduce the melting point; andsaid addition does not diffuse into the component. 27. The process as claimed in claim 26, wherein said addition does not diffuse into the component during heating of the separating layer. 28. The process as claimed in claim 2, wherein providing the separating layer comprises delimiting an edge side of the separating layer with a molding tool. 29. The process as claimed in claim 1, further comprising: repeating said providing and said forming, to produce a plurality of components in succession and one above another in a stack, wherein said surface for a new component is a part of a previously formed component, and wherein providing a separating layer comprises providing a layer between adjacent components in said stack. 30. The process as claimed in claim 29, wherein: the plurality of components are identical to one another; andadjacent components relative to a single separating layer are each arranged in mirror-image form with respect to one another, such that they abut against the same separating layer with identical surfaces.
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이 특허에 인용된 특허 (4)
Whitlow Graham A. (Murrysville PA) Bruck Gerald J. (Library PA) Smith James E. (Delmont Boro PA), Energy beam casting of metal articles.
Bourell David L. (Austin TX) Marcus Harris L. (Austin TX) Barlow Joel W. (Austin TX) Beaman Joseph L. (Austin TX) Deckard Carl R. (Austin TX), Multiple material systems for selective beam sintering.
Burhop, Mark R.; Madeley, David; Musuvathy, Suraj; Arisoy, Erhan; Slavin, Edward; Bank, Hasan, Support structures for additive manufacturing of solid models.
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