System and method for temperature based control of a power semiconductor circuit
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H02J-007/04
H02J-007/16
출원번호
US-0479753
(2012-05-24)
등록번호
US-8610406
(2013-12-17)
발명자
/ 주소
Ladurner, Markus
Illing, Robert
출원인 / 주소
Infineon Technologies AG
대리인 / 주소
Slater & Matsil, L.L.P.
인용정보
피인용 횟수 :
0인용 특허 :
5
초록▼
In a method for operating a power semiconductor circuit a power semiconductor chip is provided which includes a power semiconductor switch with a first load terminal and with a second load terminal. Further, a first temperature sensor which is thermally coupled to the power semiconductor switch and
In a method for operating a power semiconductor circuit a power semiconductor chip is provided which includes a power semiconductor switch with a first load terminal and with a second load terminal. Further, a first temperature sensor which is thermally coupled to the power semiconductor switch and a second temperature sensor are provided. The power semiconductor switch is switched OFF or kept switched OFF if the temperature difference between a first temperature of the first temperature sensor and a second temperature of the second temperature sensor is greater than or equal to a switching-OFF threshold temperature difference which depends, following an inconstant first function, on the voltage drop across the power semiconductor switch between the first load terminal and the second load terminal.
대표청구항▼
1. A method for operating a power semiconductor circuit arrangement, the method comprising: providing a power semiconductor chip comprising a power semiconductor switch with a first load terminal and with a second load terminal;providing a first temperature sensor that is thermally coupled to the po
1. A method for operating a power semiconductor circuit arrangement, the method comprising: providing a power semiconductor chip comprising a power semiconductor switch with a first load terminal and with a second load terminal;providing a first temperature sensor that is thermally coupled to the power semiconductor switch;providing a second temperature sensor;determining a temperature difference between a first temperature measured by the first temperature sensor and a second temperature measurement by the second temperature sensor, wherein the first temperature and the second temperature are taken at a first time;determining a switching-OFF threshold by applying an inconstant first function to a voltage drop over the power semiconductor switch between the first load terminal and the second load terminal;comparing the determined temperature difference to the switching-OFF threshold; andswitching OFF the power semiconductor switch or keeping the power semiconductor switch switched OFF if the temperature difference is greater than or equal to the switching-OFF threshold. 2. The method of claim 1, further comprising: determining a switching-ON threshold by applying second function to the voltage drop over the power semiconductor switch between the first load terminal and the second load terminal;comparing the determined temperature difference to the switching-ON threshold; andswitching ON the power semiconductor switch or keeping the power semiconductor switch switched ON if the temperature difference is less than or equal to the switching-ON threshold. 3. The method of claim 2, wherein the second function is inconstant. 4. The method of claim 3, wherein the switching-OFF threshold is greater than the switching-ON threshold at any voltage drop. 5. The method of claim 2, wherein the second function is constant. 6. The method of claim 1, wherein the temperature difference is represented by a first voltage, and wherein the switching-OFF threshold is represented by a second voltage. 7. The method of claim 6, wherein the first voltage and the second voltage are fed to a comparator that keeps the power semiconductor switch switched OFF if the first voltage is greater than or equal to the second voltage. 8. The method of claim 1, wherein the power semiconductor chip, the first temperature sensor and the second temperature sensor are integrated in a common housing. 9. The method of claim 8, wherein the first temperature sensor and the second temperature sensor are integrated in the power semiconductor chip. 10. A power semiconductor circuit arrangement comprising: a power semiconductor chip comprising a power semiconductor switch with a first load terminal and with a second load terminal;a first temperature sensor that is thermally coupled to the power semiconductor switch;a second temperature sensor; andan electrical circuit configured to determine a temperature difference between a first temperature measured by the first temperature sensor and a second temperature measurement by the second temperature sensor taken at a first time,determine a switching-OFF threshold by applying an inconstant first function to a voltage drop over the power semiconductor switch between the first load terminal and the second load terminal,compare the determined temperature difference to the switching-OFF threshold, andswitch OFF the power semiconductor switch or to keep the power semiconductor switch switched OFF if the temperature difference is greater than or equal to the switching-OFF threshold. 11. The power semiconductor circuit arrangement of claim 10, wherein the electrical circuit is configured to determining a switching-ON threshold by applying second function to the voltage drop over the power semiconductor switch between the first load terminal and the second load terminal,comparing the determined temperature difference to the switching-ON threshold, andswitch ON the power semiconductor switch or to keep the power semiconductor switch switched ON if the temperature difference is less than or equal to the switching-ON threshold. 12. The power semiconductor circuit arrangement of claim 11, wherein the second function is inconstant. 13. The power semiconductor circuit arrangement of claim 12, wherein the switching-OFF threshold is greater than the switching-ON threshold at any voltage drop. 14. The power semiconductor circuit arrangement of claim 11, wherein the second function is constant. 15. The power semiconductor circuit arrangement of claim 10, wherein the temperature difference between the first temperature and the second temperature is represented by a first voltage, and wherein an actual switching-OFF threshold is represented by a second voltage. 16. The power semiconductor circuit arrangement of claim 15, comprising a comparator with a first input and with a second input, wherein the first voltage is supplied to the first input, the second voltage is supplied to the second input, and wherein the comparator is designed to switch OFF the power semiconductor switch or to keep the power semiconductor switch switched OFF, if the first voltage is greater than or equal to the second voltage. 17. The power semiconductor circuit arrangement of claim 10, wherein the power semiconductor chip, the first temperature sensor and the second temperature sensor are integrated in a common housing. 18. The power semiconductor circuit arrangement of claim 17, wherein the first temperature sensor and the second temperature sensor are integrated in the power semiconductor chip. 19. The power semiconductor circuit arrangement of claim 10, comprising an incandescent lamp that is electrically connected to the first load terminal or to the second load terminal. 20. The power semiconductor circuit arrangement of claim 19, wherein the incandescent lamp is a lamp of a vehicle. 21. The power semiconductor circuit arrangement of claim 10, wherein the power semiconductor switch is a DMOS transistor. 22. A power semiconductor circuit arrangement comprising: a power semiconductor switch with a first load terminal, a second load terminal and a control input;a first temperature sensor thermally coupled to the power semiconductor switch;a second temperature sensor;a temperature difference evaluation unit which is designed to provide a first voltage at a first output, the first voltage representing a temperature difference between a temperature of the first temperature sensor and a temperature of the second temperature sensor;a threshold providing unit to provide a second voltage at a second output, the second voltage representing a switching-OFF threshold temperature difference from an inconstant first function applied to a voltage difference measured between the first load terminal and the second load terminal, wherein the first function is a switching-OFF threshold temperature difference depending on a voltage drop;a comparator unit comprising a first comparator input, a second comparator input, and a comparator output, wherein the first output is electrically connected to the first comparator input, wherein the second output is electrically connected to the second comparator input, and wherein the comparator output is electrically connected to the control input of the power semiconductor switch; andwherein the comparator unit is designed to provide a signal causing the power semiconductor switch to remain or to be switched in an OFF-state, if the voltage difference between the first voltage and the second voltage implies that a temperature difference determined by the temperature difference evaluation unit is greater than or equal to a switching-OFF threshold temperature difference determined by the threshold providing unit. 23. The power semiconductor circuit arrangement of claim 22, further comprising a gate driving unit with an input and with an output, wherein the comparator output is electrically connected to the input of the gate driving unit, and wherein the output of the gate driving unit is electrically connected to the control input of the power semiconductor switch. 24. The power semiconductor circuit arrangement of claim 22, wherein the threshold providing unit is designed as an analog circuit. 25. The power semiconductor circuit arrangement of claim 22, wherein a predefined switching-OFF threshold temperature difference is monotonic decreasing with the voltage difference measured between the first load terminal and the second load terminal. 26. The power semiconductor circuit arrangement of claim 22, further comprising: a further threshold providing unit to provide a third voltage at a third output, the third voltage representing a switching-ON threshold temperature difference from a second function applied to a voltage difference measured between the first load terminal and the second load terminal, wherein the second function is a switching-ON threshold temperature difference depending on a voltage drop;a further comparator unit comprising a third comparator input, a fourth comparator input, and a further comparator output, wherein the first output is electrically connected to the third comparator input, wherein the third output is electrically connected to the fourth comparator input, and wherein the comparator output is electrically connected to a further control input of the power semiconductor switch; andwherein the further comparator unit is designed to provide a signal causing the power semiconductor switch to remain or to be switched in an ON-state, if the voltage difference between the first voltage and the second voltage implies that a temperature difference determined by the temperature difference evaluation unit is less than or equal to a switching-ON threshold temperature difference determined by the further threshold providing unit.
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이 특허에 인용된 특허 (5)
Biltonen Rodney L. (Charlottesville VA) Mountcastle Donald B. (Charlottesville VA) Suurkuust Jaak (Lund SEX), Differential calorimeter based on the heat leak principle.
Sullivan, James D., Switching incandescent lamps and other variable resistance loads with a solid state, smart, high side driver having overcurrent and temperature sensing protection circuits.
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