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A system for transferring heat from an electrical enclosure is provided. An electrical enclosure defines a housing area in which one or more electrical devices are housed. A heat pump extends through the electrical enclosure, the heat pump defining a channel configured to communicate fluid for trans

A system for transferring heat from an electrical enclosure is provided. An electrical enclosure defines a housing area in which one or more electrical devices are housed. A heat pump extends through the electrical enclosure, the heat pump defining a channel configured to communicate fluid for transferring heat from the one or more electrical devices. The electrical enclosure is substantially sealed from the heat pump channel and from other areas outside the electrical enclosure.

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1. A system for transferring heat from an electrical enclosure, comprising: an electrical enclosure that defines a housing area in which one or more electrical devices are housed; anda heat pump extending through the electrical enclosure, the heat pump defining a channel configured to communicate fl

1. A system for transferring heat from an electrical enclosure, comprising: an electrical enclosure that defines a housing area in which one or more electrical devices are housed; anda heat pump extending through the electrical enclosure, the heat pump defining a channel configured to communicate fluid for transferring heat from the one or more electrical devices,wherein the electrical enclosure is substantially sealed from the heat pump channel and from other areas outside the electrical enclosure,wherein the heat pump channel extends from a first end to a second end, andwherein the heat pump includes directional vent structures at one or both of the first and second ends of the heat pump channel to facilitate fluid flow through the channel. 2. The system according to claim 1, wherein the heat pump channel extends through two opposing sides of the electrical enclosure. 3. The system according to claim 1, wherein the heat pump channel extends substantially vertically through a top side and a bottom side of the electrical enclosure. 4. The system according to claim 1, wherein the heat pump channel extends substantially non-vertically through the electrical enclosure. 5. The system according to claim 1, wherein the heat pump channel extends substantially horizontally through two opposing lateral sides of the electrical enclosure. 6. The system according to claim 1, wherein: the heat pump channel extends substantially horizontally; andthe directional vent structures extend at an askew angle relative to the heat pump channel. 7. The system according to claim 1, wherein the heat pump channel is tapered. 8. The system according to claim 1, wherein the heat pump includes inter-digitated elements. 9. The system according to claim 1, wherein the heat pump is located substantially within the electrical enclosure. 10. The system according to claim 1, wherein: a first wall of the electrical enclosure defines a first wall perimeter; anda first end of the heat pump channel defines an opening in the first wall of the electrical enclosure, the heat pump channel opening located within and distinct from the first wall perimeter. 11. The system according to claim 1, wherein: the heat pump is located substantially within the electrical enclosure; andthe heat pump physically abuts a wall of the electrical enclosure extending in the direction of the heat pump. 12. The system according to claim 1, wherein at least one of the electrical devices is mounted on a wall of the heat pump or on a structure that physically abuts the wall of the heat pump. 13. The system according to claim 1, including multiple heat pumps extending through the electrical enclosure. 14. A system for transferring heat from an electrical enclosure, comprising: an electrical enclosure that defines a housing area in which one or more electrical devices are housed; anda plurality of heat pumps extending substantially vertically through the electrical enclosure, each heat pump defining a channel configured to communicate fluid for transferring heat from the one or more electrical devices;wherein each heat pump channel is tapered such that a cross-sectional area of a top end of the heat pump channel is smaller than a cross-sectional area of a bottom end of the heat pump channel; andwherein the electrical enclosure is substantially sealed from the plurality of heat pump channels and from other areas outside the electrical enclosure. 15. The system according to claim 14, wherein the heat pump includes inter-digitated elements. 16. The system according to claim 14, wherein each heat pump is located substantially within the electrical enclosure. 17. The system according to claim 14, wherein: a top surface of the electrical enclosure defines a top surface perimeter; anda top end of each heat pump channel defines an opening in the top surface of the electrical enclosure, each heat pump channel opening located within and distinct from the top surface perimeter. 18. The system according to claim 14, wherein at least one of the electrical devices is mounted on a wall of at least one of the heat pumps or on a structure that physically abuts a wall of at least one of the heat pumps. 19. A system for transferring heat from an electrical enclosure, comprising: an electrical enclosure that defines a housing area in which one or more electrical devices are housed; anda heat pump extending through the electrical enclosure, the heat pump defining a channel configured to communicate fluid for transferring heat from the one or more electrical devices,wherein the electrical enclosure is substantially sealed from the heat pump channel and from other areas outside the electrical enclosure,wherein a first end of the heat pump channel is located higher than a second end of the heat pump channel with respect to a horizontal plane, andwherein the heat pump channel is tapered such that a cross-sectional area of the first, higher end of the heat pump channel is smaller than a cross-sectional area of the second, lower end of the heat pump channel.