초록 ▼

This invention is directed to a support plate for reinforcing a portion of a circuit board. The support plate may be coupled to a portion of the circuit board that is subject to forces (e.g., portions of the circuit board having switches) to prevent flexing of the board. The support plate may be cou

This invention is directed to a support plate for reinforcing a portion of a circuit board. The support plate may be coupled to a portion of the circuit board that is subject to forces (e.g., portions of the circuit board having switches) to prevent flexing of the board. The support plate may be coupled to the circuit board. This invention is also directed to a switch constructed from a button, a label plate, and a backer plate. The label plate and the backer plate may include apertures operative to receive a protrusion extending from the button, where the protrusion is welded to the backer plate. Labels may be printed or attached to the bottom surface of the label plate to protect the labels. In some embodiments, the protrusion may be welded to the backer plate. The protrusion may be operative to engage an electrical switch of an electronic device in which the switch is placed.

대표청구항 ▼

1. A system comprising: a circuit board having at least one component; and a plate coupled to the surface of the circuit board that reinforces at least a portion of the circuit board, the plate comprising: at least a first wing that extends from the plate and that grounds the circuit board; and at l

1. A system comprising: a circuit board having at least one component; and a plate coupled to the surface of the circuit board that reinforces at least a portion of the circuit board, the plate comprising: at least a first wing that extends from the plate and that grounds the circuit board; and at least a first aperture aligned to receive the at least one component, wherein the plate further comprises a second wing; the first wing extends from a first edge of the plate; and the second wing extends from a second edge of the plate that is different than the first edge of the plate. 2. The system of claim 1, wherein the first wing comprises a prong operative to ground the circuit board. 3. The system of claim 1, wherein the first wing extends perpendicularly from the plate. 4. The system of claim 1, wherein the first wing extends from a first edge of the plate. 5. The system of claim 1, wherein the first wing extends perpendicularly from a first edge of the plate. 6. The system of claim 1, wherein the at least one component comprises a first switch extending from a first surface of the circuit board, wherein the at least a first aperture receives the at least a first switch. 7. The system of claim 6, wherein the plate is placed over the first surface of the circuit board. 8. The system of claim 1, wherein the thickness of the plate does not exceed the height of the tallest component coupled to the circuit board. 9. The system of claim 1, wherein: the plate is placed over a first surface of the circuit board; andthe thickness of the plate does not exceed the height of the tallest component coupled to the first surface of the circuit board. 10. The system of claim 1, wherein the plate is operative to be placed over unused surfaces of the circuit board. 11. The system of claim 1, wherein the plate is coupled to the circuit board using at least one of soldering, surface mount technology, adhesive, and tape. 12. The system of claim 1, wherein the plate is coupled to the circuit board using an approach that further stiffens the circuit board. 13. The system of claim 12, wherein the approach comprises an adhesive that is strong in at least one of bending and shear. 14. The system of claim 1, wherein the plate is coupled to the circuit board using at least one of a mechanical fastener and a mechanical coupling. 15. The system of claim 1, wherein the plate is coupled to the circuit board using at least one of a screw and a snap. 16. The system of claim 1, wherein the first wing rests against a first edge of the circuit board. 17. The system of claim 1, wherein the first wing provides additional stiffness to the plate. 18. The system of claim 1, further comprising an electronic device enclosure, wherein the first wing contacts a surface of the electronic device enclosure. 19. The system of claim 1, further comprising an electronic device enclosure, wherein: the first wing comprises a prong operative to ground the circuit board; andthe prong contacts a surface of the electronic device enclosure. 20. A method comprising: aligning a plate with a circuit board, wherein the plate comprises at least a first wing extending from the plate that grounds the circuit board and at least a first aperture; and coupling the plate to at least a first surface of the circuit board to reinforce at least a portion of the circuit board, wherein coupling the plate to the circuit board comprises coupling the plate to a first surface of the circuit board; and the thickness of the plate does not exceed the height of the tallest component coupled to the first surface of the circuit board. 21. The method of claim 20, further comprising placing the first wing in contact with an electronic device case to ground the circuit board. 22. The method of claim 20, wherein the first wing rests against an edge of the circuit board. 23. The method of claim 20, wherein the first wing extends perpendicularly from the plate. 24. The method of claim 20, wherein the circuit board comprises a first switch. 25. The method of claim 24, wherein the at least a first aperture is operative to receive the first switch. 26. The method of claim 20, wherein the first wing comprises a prong that grounds the circuit board. 27. The method of claim 26, further comprising placing the prong in contact with an electronic device case to ground the circuit board. 28. The method of claim 20, wherein coupling the plate to the circuit board comprises coupling the plate to the circuit board using at least one of soldering, surface mount technology, an adhesive, and tape. 29. The method of claim 20, wherein coupling the plate to the circuit board comprises coupling the plate to the circuit board using an approach that further stiffens the circuit board. 30. The method of claim 29, wherein the approach comprises an adhesive that is strong in at least one of bending and shear. 31. The method of claim 20, wherein coupling the plate to the circuit board comprises coupling the plate to the circuit board using at least one of a mechanical fastener and a mechanical coupling. 32. The method of claim 20, wherein coupling the plate to the circuit board comprises coupling the plate to the circuit board using at least one of a screw and a snap. 33. The method of claim 20, wherein the first wing rests against a first edge of the circuit board. 34. The method of claim 20, wherein aligning the plate with the circuit board comprises aligning at least a second aperture of the plate with a pin of the circuit board. 35. The method of claim 20, wherein the thickness of the plate does not exceed the height of the tallest component coupled to the circuit board. 36. An apparatus for use with a circuit board, comprising: a plate coupled to a surface of the circuit board to reinforce at least one portion of the circuit board; and a wing extending from the plate, wherein the wing is operative to ground the circuit board; and at least a first aperture aligned to receive at least one component of the circuit board; wherein: the plate comprises at least a second aperture through which a circuit board component can extend; and the plate is operative to resist displacement in response to a force applied to the circuit board component. 37. The apparatus of claim 36, wherein the wing comprises at least one prong that is operative to ground the circuit board. 38. The apparatus of claim 36, wherein the wing extends perpendicular from an edge of the plate. 39. The apparatus of claim 36, wherein the plate is substantially planar. 40. The apparatus of claim 36, wherein the plate comprises at least a second aperture through which a circuit board component can extend. 41. The apparatus of claim 36, wherein the wing is constructed from an electrically conductive material. 42. The apparatus of claim 36, wherein the wing is operative to contact the surface of an electronic device enclosure surrounding the circuit board. 43. The apparatus of claim 36, wherein the thickness of the plate is less than the height of the circuit board. 44. The apparatus of claim 36, wherein the plate is operative to resist displacement in response to a force applied to the circuit board. 45. The apparatus of claim 36, wherein the plate selectively reinforces the at least one portion of the circuit board. 46. The apparatus of claim 45, wherein the at least one selectively reinforced portion is a portion of the circuit board to which high stresses are applied. 47. The apparatus of claim 45, wherein the at least one selectively reinforced portion is a portion of the circuit board where high amounts of circuit board flexing are expected. 48. The apparatus of claim 36, wherein the thickness of the plate is less than the height of the tallest component coupled to the surface of the circuit board. 49. The apparatus of claim 36, wherein the plate is formed from a material that enhances the coupling of the plate to the circuit board. 50. The apparatus of claim 36, wherein the plate is formed from a phosphorous bronze. 51. The apparatus of claim 36, wherein the plate is formed from a phosphorous bronze with a nickel plating.