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Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-005/02
  • C25D-005/10
출원번호 US-0906970 (2010-10-18)
등록번호 US-8613846 (2013-12-24)
발명자 / 주소
  • Wu, Ming Ting
  • Larsen, III, Rulon Joseph
  • Kim, Young
  • Kim, Kieun
  • Cohen, Adam L.
  • Kumar, Ananda H.
  • Lockard, Michael S.
  • Smalley, Dennis R.
출원인 / 주소
  • Microfabrica Inc.
대리인 / 주소
    Smalley, Dennis R.
인용정보 피인용 횟수 : 0  인용 특허 : 114

초록

Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Oth

대표청구항

1. A fabrication process for forming a multi-layer three-dimensional structure, comprising: (a) forming a first layer comprising at least one structural material and at least one sacrificial material;(b) forming at least one additional layer from at least one structural material and at least one sac

이 특허에 인용된 특허 (114)

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