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Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/473
출원번호 US-0283501 (2008-09-12)
등록번호 US-8616266 (2013-12-31)
발명자 / 주소
  • Wilcoxon, Ross K.
  • Lower, Nathan P.
  • Wooldridge, James R.
  • Dlouhy, David W.
  • Strzelczyk, Anthony J.
출원인 / 주소
  • Rockwell Collins, Inc.
대리인 / 주소
    Suchy, Donna P.
인용정보 피인용 횟수 : 3  인용 특허 : 104

초록

The present invention is a thermal spreader for providing a high effective thermal conductivity between a heat source and a heat sink. The thermal spreader may include a mechanically flexible substrate. The mechanically flexible substrate may be at least partially constructed of organic materials. T

대표청구항

1. A thermal spreader, comprising: a mechanically flexible substrate, the mechanically flexible substrate forming an internal channel, the internal channel being configured for containing an electrically-conductive liquid, the internal channel being further configured to allow for closed-loop flow o

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이 특허를 인용한 특허 (3)

  1. Sporer, Bernd; Weinmann, Klaus; Schneider, Oleg, Adapter cooling apparatus and method for modular computing devices.
  2. Kim, Joo Han; Parziale, Michelle Ann; Wright, Jerry Leon; de Bock, Hendrik Pieter Jacobus; Hoden, Brian Patrick, Circuit card assembly including heat transfer assembly and method of manufacturing such.
  3. Takeda, Tsutomu, Electronic component and electronic component cooling method.
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