$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Conductive polymer foams, method of manufacture, and articles thereof 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-003/00
출원번호 US-0186093 (2008-08-05)
등록번호 US-8623265 (2014-01-07)
발명자 / 주소
  • Simpson, Scott
출원인 / 주소
  • World Properties, Inc.
대리인 / 주소
    Cantor Colburn LLP
인용정보 피인용 횟수 : 3  인용 특허 : 62

초록

A method of manufacturing a polymer foam composite is described, the method comprising forming an article having a first surface and an opposite second surface from a precursor composition, the precursor composition comprising a polymer foam precursor composition, and a filler composition comprising

대표청구항

1. A method of manufacturing a polymer foam composite, the method comprising: forming an article having a first surface and an opposite second surface from a precursor composition, the precursor composition comprising a polymer foam precursor composition, anda filler composition comprising a plurali

이 특허에 인용된 특허 (62)

  1. Jiang Tongbi ; Wu Zhiqiang ; Kao David ; Yang Rongsheng, Anisotropic conductive interconnect material for electronic devices, method of use and resulting product.
  2. Fulton Joe A. (Ewing NJ) Nguyen Hung N. (Bensalem PA), Anisotropic conductor techniques.
  3. Jin Sungho (Millington NJ) Mottine ; Jr. John J. (West Keansburg NJ) Seger ; Jr. Stephen G. (Summit NJ) Sherwood Richard C. (New Providence NJ) Tiefel Thomas H. (Piscataway NJ), Anisotropically conductive composite medium.
  4. Fenster Raynard M. (4500 Lowell Blvd. Denver CO 80211), Apparatus and method for dissipating and discharging electrostatic charges.
  5. Lee Yung-Cheng (Boulder CO) Segelken John M. (Morristown NJ), Article comprising a stacked array of electronic subassemblies.
  6. Mitchell John P. (Summit NJ), Component mounting apparatus.
  7. Jin Sungho (Millington NJ) Lambert William R. (Mendham NJ) Moore Robert C. (Lawrenceville NJ) Mottine ; Jr. John J. (West Keansburg NJ) Sherwood Richard C. (New Providence NJ) Tiefel Thomas H. (Pisca, Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method.
  8. Tarler, Matthew David, Composite material for a sensor for measuring shear forces.
  9. Ahn, Dongchan; Fisher, Mark David; Mojica, Andrew Anthony, Conductive curable compositions.
  10. Simpson, Scott; Kim, Ki-Soo; Hoffman, Jason, Conductive polymer foams, method of manufacture, and uses thereof.
  11. Simpson, Scott; Kim, Ki-Soo; Hoffman, Jason, Conductive polymer foams, method of manufacture, and uses thereof.
  12. Weiss, Roger E., Elastomeric interconnection device and methods for making same.
  13. Suyama Shinichi (Iruma JPX) Haruta Yuiti (Hirakata JPX), Electric inspection unit using anisotropically electroconductive sheet.
  14. Zifcak Mark S. (Putnam CT) Kosa Bruce G. (Woodstock CT), Electrical circuit board interconnect.
  15. Jin Sungho (Millington NJ) Mottine ; Jr. John J. (West Keansburg NJ) Opila ; Jr. Robert L. (Aberdeen NJ) Sherwood Richard C. (New Providence NJ) Tiefel Thomas H. (Piscataway NJ) Vesperman William C. , Electrical interconnection by a composite medium.
  16. Fujita ; Masanori ; Suzuki ; Sukenori, Electrically conductive adhesive connecting arrays of conductors.
  17. Calhoun Clyde D. (St. Paul MN) Fleming Maurice J. (St. Paul MN), Electrically conductive adhesive tape.
  18. Calhoun Clyde D. (Stillwater MN) Koskenmaki David C. (St. Paul MN), Electrically conductive adhesive web.
  19. Koskenmaki David C. (St. Paul MN) Calhoun Clyde D. (Stillwater MN), Electrically conductive structured sheets.
  20. Robert C. Benn, Jr., Electromagnetic interference shielding device.
  21. Benn, Jr., Robert C., Electromagnetic interference shielding gasket.
  22. Atterbury, Thomas J.; Stutz, David E., Electromagnetic radiation shielding composites and method of production thereof.
  23. Nguyen Hung N. (Bensalem PA), Electronic device interconnection techniques.
  24. Yamaguchi Yasuyoshi (Shizuoka JPX), Electrophotographic apparatus having a movable self-scanner.
  25. Mattsson,Magnus; Jacobsson,Mikael, Element for electromagnetic shielding and method for manufacturing thereof.
  26. Harrison Bruce (St. Louis MO), Expandable magnetic sealant.
  27. Lambert William R. (Mendham NJ) Lu Neng-Hsing (Berkeley Heights NJ) Rust Ray D. (Berkeley Heights NJ), Fabrication of CPI layers.
  28. McArdle Ciaran B.,IEX ; Burke Joseph,IEX, Films and coatings having anisotropic conductive pathways therein.
  29. Hartman, Richard B., Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer.
  30. King, Timothy W., Flexible tape having stripes of electrically conductive particles for making multiple connections.
  31. Mammino Joseph ; Law Kock-Yee ; Fletcher Gerald M. ; Abkowitz Martin A. ; Tarnawskyj Ihor W. ; McGrane Kathleen M., Fluorinated carbon filled foam biasable components.
  32. Akkapeddi Kaushik S. (Hanover Township ; Morris County NJ) Bonanni Rocco (Wayne Township ; Passaic County NJ) Gashler Robert J. (Olathe KS) German Michael G. (Secaucus NJ) Lambert William R. (Mendham, High density connector for stacked circuit boards.
  33. Holliday Albert (Langhorne PA) Schmidt Maureen B. (Fairless Hills PA) Verdi Fred W. (Lawrenceville NJ), Interconnection method and apparatus.
  34. Brindle, Steven R.; Bumb, Jr., Frank E.; Burg, John S.; Chu, Kwang-Ho; Mathews, Alexander R.; Revell, Ronald K., Low contact force, dual fraction particulate interconnect.
  35. Maurice Hiles, Magnetically active flexible polymers.
  36. Hechtman Charles D. (Hopewell NJ) Velasco Victor J. (Madrid ESX), Method and apparatus for fabricating anisotropically conductive material.
  37. Tanzawa Shinji,JPX ; Sasagawa Katsutoshi,JPX ; Horikawa Mitsumasa,JPX ; Tamura Yasuo,JPX ; Kimura Koichi,JPX, Method for forming aggregation body by thermocompression.
  38. Jin Sungho (Millington NJ) McCormack Mark T. (Summit NJ), Method for interconnecting an electronic device using a removable solder carrying medium.
  39. Konno, Hideaki, Method for manufacturing a holder.
  40. Mike Newton ; Joseph P. Dougherty ; Else Breval ; Maria Klimkiewicz ; Yi Ton Shi ; Dean Arakaki, Method for producing anisotropic dielectric layer and devices including same.
  41. Lu Neng-Hsing (Hsinchu TWX), Method of electrically interconnecting conductors.
  42. Koskenmaki David C. (St. Paul MN) Calhoun Clyde D. (Stillwater MN), Method of forming electrically conductive structured sheets.
  43. Meteer Charles L. ; Philipps Thomas E., Method of making syntactic foam core material.
  44. Martin, James E.; Anderson, Robert A.; Williamson, Rodney L., Method of using triaxial magnetic fields for making particle structures.
  45. Chang David D. C. (Lawrenceville NJ) Smith ; Jr. Edward L. (Lawrenceville NJ), Methods for testing integrated circuit devices.
  46. Lambert William R. (Chester NJ) Weld John D. (Succasunna NJ), Multi-component electronic devices and methods for making them.
  47. Kaplo,Joseph J., Multiplanar EMI shielding gasket and method of making.
  48. Cranston Benjamin H. (Princeton NJ) Shepherd Lloyd (Madison NJ), Polymer interconnect structure.
  49. Starkebaum Warren L., Positive fixation percutaneous epidural neurostimulation lead.
  50. Divigalpitiya, Ranjith; Livingstone, David E.; Moshrefzadeh, Robert S.; Cross, Elisa M., Pressure activated switch and touch panel.
  51. Jin Sungho (Millington NJ) Mottine ; Jr. John J. (West Keansburg NJ) Sherwood Richard C. (New Providence NJ) Tiefel Thomas H. (Piscataway NJ), Pressure-responsive position sensor.
  52. Tetu Bertrand (St-Agapit CAX), Process for manufacturing a composite building panel for use in a building structure cladding system.
  53. Kashiro Yoshikazu (Otsu JPX) Matsugasako Kenji (Otsu JPX) Kataoka Shunro (Otsu JPX), Process for producing an anisotropically electroconductive sheet.
  54. Suyama Shinichi (Iruma JPX) Haruta Yuiti (Hirakata JPX), Process for producing the anisotropically electroconductive sheet.
  55. Lambert William R., RF flex circuit transmission line and interconnection method.
  56. Jin Sungho (Millington NJ) McCormack Mark T. (Summit NJ), Solder medium for circuit interconnection.
  57. Jin Sungho (Millington NJ) McCormack Mark T. (Summit NJ), Solder medium for circuit interconnection.
  58. Chen Li-Han (Summit NJ) Jin Sungho (Millington NJ), Tactile shear sensor using anisotropically conductive material.
  59. Dentini Mark S. (Holland PA) Fulton Joe A. (Ewing NJ) Jin Sungho (Millington NJ) Mottine ; Jr. John J. (West Keansburg NJ) Shepherd Lloyd (Madison NJ) Sherwood Richard C. (New Providence NJ), Thermal conductor assembly.
  60. Dentini Mark S. (Holland PA) Fulton Joe A. (Ewing NJ) Jin Sungho (Millington NJ) Mottine ; Jr. John J. (West Keansburg NJ) Shepherd Lloyd (Madison NJ) Sherwood Richard C. (New Providence NJ), Thermal conductor assembly method.
  61. Harrison Edward S. ; Bridges Donald J. ; Melquist James L., Thermosetting syntactic foams and their preparation.
  62. Weiss, Roger E., Very high bandwidth electrical interconnect.

이 특허를 인용한 특허 (3)

  1. Fukuda, Takeshi; Tsuzuki, Takuya, Deformation detection sensor and production of the same.
  2. Skinner, Michael P.; Ossiander, Teodora; Albers, Sven; Seidemann, Georg, Magnetic contacts.
  3. Skinner, Michael P.; Ossiander, Teodora; Albers, Sven; Seidemann, Georg, Magnetic contacts.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로