IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0802421
(2013-03-13)
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등록번호 |
US-8636198
(2014-01-28)
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발명자
/ 주소 |
- Linderman, Ryan
- Phu, Thomas
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출원인 / 주소 |
|
대리인 / 주소 |
Knobbe Martens Olson & Bear LLP
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인용정보 |
피인용 횟수 :
9 인용 특허 :
53 |
초록
▼
A method for connecting a plurality of solar cells and an improved interconnect is disclosed. The method includes aligning an interconnect to a plurality of solar cells having solder pads, where the interconnect has a main body and tabs extending therefrom, and where each of the tabs has a downward
A method for connecting a plurality of solar cells and an improved interconnect is disclosed. The method includes aligning an interconnect to a plurality of solar cells having solder pads, where the interconnect has a main body and tabs extending therefrom, and where each of the tabs has a downward depression, such that the tabs are positioned above the solder pads in between solar cells and pinning the interconnect against a work surface by pressing a hold down pin against the main body of the interconnect such that a lower surface of the interconnect tabs are maintained parallel to an upper surfaces of the solder pads, and such that the depression of each of the tabs flatly contacts the solder pads. The method can also include cantilevered tabs extending downwardly from the main body providing a controlled spring force between the tab lower surface and the solder pad upper surface.
대표청구항
▼
1. A method for connecting a plurality of solar cells, the method comprising: positioning a first solar cell adjacent to a second solar cell, each solar cell comprising a plurality of solder pads;aligning a first interconnect to the first and second solar cells, wherein the first interconnect has a
1. A method for connecting a plurality of solar cells, the method comprising: positioning a first solar cell adjacent to a second solar cell, each solar cell comprising a plurality of solder pads;aligning a first interconnect to the first and second solar cells, wherein the first interconnect has a main body and tabs extending therefrom, and wherein each of the tabs has a downward depression, such that lower surfaces of the tabs are positioned above the upper surface of the solder pads of both the first and second solar cells; andpinning the first interconnect against a work surface by pressing a hold down pin against the main body of the first interconnect such that the lower surfaces of the interconnect tabs are maintained substantially parallel to the upper surfaces of the solder pads, and such that the depression of each of the tabs substantially flatly contacts one of the solder pads. 2. The method of claim 1, further comprising: forming a layer of solder paste into a liquid state uniformly spread around a periphery of the depression between the interconnect tabs and solder pads, thereby forming an electrical connection between the first and second solar cells. 3. The method of claim 1, wherein the solder pads on each solar cell are formed in two rows along two opposite edges, and each row of solder pads corresponds to and is electrically coupled to the positive or negative electrode of the solar cell, and wherein positioning a first solar cell adjacent to a second solar cell comprises positioning the solder pads of a first electrode of the first solar cell proximate to the solder pads of the opposite electrode of the second solar cell. 4. The method of claim 1, wherein positioning a first solar cell adjacent to a second solar cell comprises positioning the solder pads of the first solar cell proximate and parallel to the solder pads of the second solar cell. 5. The method of claim 1, wherein positioning a first solar cell adjacent to a second solar cell comprises positioning the solder pads of the first solar cell proximate and perpendicular to the solder pads of the second solar cell. 6. The method of claim 1, wherein the height of the downward depression is in the range of 10-50 microns. 7. The method of claim 1, wherein connecting a plurality of solar cells comprises connecting a plurality of solar cells selected from the group containing back-contact solar cells, front-contact solar cells, monocrystalline silicon solar cells, polycrystalline silicon solar cells, amorphous silicon solar cells, thin film silicon solar cells, copper indium gallium selenide (CIGS) solar cells, and cadmium telluride solar cells. 8. The method of claim 1, further comprising depositing solder paste on the plurality of solder pads prior to aligning the first interconnect to the first and second solar cells. 9. The method of claim 1, further comprising pre-applying the solder paste on the lower surface of the interconnect tabs prior to aligning the first interconnect to the first and second solar cells. 10. The method of claim 1, wherein the depression comprises a depression selected from the group containing circular depression, oblong depression, triangular depression, square depression, polygon depression, rectangular depression, rounded-edge rectangular depression, dimple depression, partially hollowed depression, stamped out depression and concave depression. 11. The method of claim 1, wherein the interconnect tabs comprise cantilevered tabs extending downwardly from the main body of the interconnect. 12. The method of claim 1, wherein pinning the first interconnect against a work surface allows for a contact force in the range of 0-1 Newtons between the lower surface of the tab and the upper surface of the solder pad. 13. A method for connecting a plurality of solar cells, the method comprising: positioning a first solar cell adjacent to a second solar cell, each solar cell comprising a plurality of solder pads, wherein positioning a first solar cell adjacent to a second solar cell comprises positioning the solder pads of the first solar cell proximate and perpendicular to the solder pads of the second solar cell;aligning a first interconnect to the first and second solar cells, wherein the first interconnect has a main body and cantilevered tabs extending downwardly therefrom, and wherein each of the tabs has a downward depression with a height in the range of 10-50 microns centrally located near a tab edge, such that lower surfaces of the tabs are positioned above the upper surface of the solder pads of both the first and second solar cells;pinning the first interconnect against a work surface by pressing down against the main body of the first interconnect such that the lower surfaces of the interconnect tabs maintained substantially parallel to the upper surfaces of the solder pads, and such that the depression of each of the tabs substantially flatly contacts one of the solder pads; andforming a layer of solder paste into a liquid state uniformly spread around a periphery of the depression between the interconnect tabs and solder pads thereby forming an electrical connection between the first and second solar cells. 14. The method of claim 13, wherein forming a solder paste into a liquid state comprises forming a solder paste into a liquid state using induction soldering. 15. The method of claim 13, further comprising depositing solder paste on the plurality of solder pads prior to aligning the first interconnect to the first and second solar cells. 16. The method of claim 13, wherein connecting a plurality of solar cells comprises connecting a plurality of solar cells selected from the group containing a back-contact solar cells, front-contact solar cells, monocrystalline silicon solar cells, polycrystalline silicon solar cells, amorphous silicon solar cells, thin film silicon solar cells, copper indium gallium selenide (CIGS) solar cells, and cadmium telluride solar cells. 17. A method for connecting a plurality of solar cells, the method comprising: positioning a first solar cell adjacent to a second solar cell, each solar cell comprising a plurality of solder pads, wherein positioning a first solar cell adjacent to a second solar cell comprises positioning the solder pads of the first solar cell proximate and parallel to the solder pads of the second solar cell;aligning a first interconnect to the first and second solar cells, wherein the first interconnect has a main body and cantilevered tabs extending downward thereform, and wherein each of the tabs has a downward depression with a height in the range of 10-50 microns centrally located near a tab edge, such that lower surfaces of the tabs are positioned above the upper surface of the solder pads of both the first and second solar cells;pinning the first interconnect against a work surface by pressing a hold down pin against the main body of the first interconnect such that the lower surfaces of the interconnect tabs are maintained substantially parallel to the upper surfaces of the solder pads, and such that the depression of each of the tabs substantially flatly contacts one of the solder pads; andforming a layer of solder paste into a liquid state uniformly spread around a periphery of the depression between the interconnect tabs and solder pads thereby forming an electrical connection between the first and second solar cells. 18. The method of claim 17, wherein forming a solder paste into a liquid state comprises forming a solder paste into a liquid state using hot soldering. 19. The method of claim 17, further comprising pre-applying the solder paste on the lower surface of the interconnect tabs prior to aligning the first interconnect to the first and second solar cells. 20. The method of claim 17, wherein connecting a plurality of solar cells comprises connecting a plurality of solar cells selected from the group containing a back-contact solar cells, front-contact solar cells, monocrystalline silicon solar cells, polycrystalline silicon solar cells, amorphous silicon solar cells, thin film silicon solar cells, copper indium gallium selenide (CIGS) solar cells, and cadmium telluride solar cells.
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