IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0146635
(2010-01-28)
|
등록번호 |
US-8646282
(2014-02-11)
|
국제출원번호 |
PCT/US2010/022459
(2010-01-28)
|
§371/§102 date |
20120208
(20120208)
|
국제공개번호 |
WO2010/088433
(2010-08-05)
|
발명자
/ 주소 |
- Ilercil, Alp
- Ilercil, Tayfun
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
1 |
초록
▼
The invention is directed to an energy efficient thermoelectric heat pump assembly. The thermoelectric heat pump assembly preferably comprises two to nine thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and p
The invention is directed to an energy efficient thermoelectric heat pump assembly. The thermoelectric heat pump assembly preferably comprises two to nine thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present invention further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. Preferably the transport or storage devices are configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.
대표청구항
▼
1. A thermoelectric heat pump assembly having a top end and a bottom end, the thermoelectric heat pump assembly comprising: (a) two to nine thermoelectric unit layers capable of active use of the Peltier effect, each thermoelectric unit layer having a cold side and a hot side;(b) at least one capaci
1. A thermoelectric heat pump assembly having a top end and a bottom end, the thermoelectric heat pump assembly comprising: (a) two to nine thermoelectric unit layers capable of active use of the Peltier effect, each thermoelectric unit layer having a cold side and a hot side;(b) at least one capacitance spacer block that stores heat and provides a buffer to delay transfer of heat from one thermoelectric unit layer to another, the capacitance spacer block having a top portion and a bottom portion and being between a first thermoelectric unit layer and a second thermoelectric layer, wherein the top portion of the capacitance spacer block is thermally connected to the hot side of the first thermoelectric unit layer and the bottom portion is thermally connected to the cold side of the second thermoelectric unit layer, thereby forming a sandwich layer that pumps heat from the first thermoelectric unit layer to the second thermoelectric layer;(c) at least one energy source operably connected to each thermoelectric unit layer, wherein the energy source is suitable to provide a current, the thermoelectric heat pump assembly being configured so that each individual thermoelectric unit layer has a ratio of input current to maximum available current (I/Imax) of 0.09 or less at a steady-state when a change in temperature (ΔT) of the heat pump assembly at the top end compared to the bottom end of the heat pump assembly is about 20° C. and heat removal (Q) is about 0 Watts; and(d) a heat sink associated with a fax assembly, wherein the heat sink is thermally connected at the bottom end of the heat pump assembly. 2. A thermoelectric heat pump assembly having a top end and a bottom end, the thermoelectric heat pump assembly comprising: (a) two to nine thermoelectric unit layers capable of active use of the Peltier effect, each thermoelectric unit layer having a cold side and a hot side;(b) at least one capacitance spacer block that stores heat and provides a buffer to delay transfer of heat from one thermoelectric unit layer to another, the capacitance spacer block having a top portion and a bottom portion and being between a first thermoelectric unit layer and a second thermoelectric layer, wherein the top portion of the capacitance spacer block is thermally connected to the hot side of the first thermoelectric unit layer and the bottom portion is thermally connected to the cold side of the second thermoelectric unit layer, thereby forming a sandwich layer that pumps heat from the first thermoelectric unit layer to the second thermoelectric layer;(c) at least one energy source operably connected to each thermoelectric unit layer, wherein the energy source is suitable to provide a current; and(d) a heat sink associated with a fan assembly, wherein the heat sink is thermally connected at the bottom end of the heat pump assembly, the heat pump assembly being configured to minimize a temperature rise or drop on the heat sink at a steady-state so that the temperature rise or drop on the heat sink does not exceed 3° Celsius as compared to ambient. 3. A thermoelectric heat pump assembly having a top end and a bottom end, the thermoelectric heat pump assembly comprising: (a) two to nine thermoelectric unit layers capable of active use of the Peltier effect, each thermoelectric unit layer having a cold side and a hot side;(b) at least one capacitance spacer block that stores heat and provides a buffer to delay transfer of heat from one thermoelectric unit leer to another, the capacitance spacer block having a top portion and a bottom portion and being between a first thermoelectric unit layer and a second thermoelectric layer, wherein the top portion of the capacitance spacer block is thermally connected to the hot side of the first thermoelectric unit layer and the bottom portion is thermally connected to the cold side of the second thermoelectric unit layer, thereby forming a sandwich layer that pumps heat from the first thermoelectric unit layer to the second thermoelectric layer;(c) at least one energy source operably connected to each thermoelectric unit layer, wherein the energy source is suitable to provide a current;(d) a heat sink associated with a fan assembly, wherein the heat sink is thermally connected at the bottom end of the heat pump assembly; and(e) a microcontroller operatively associated with the energy source and at least one relay, wherein the microcontroller activates the relay which directs current from the energy source to at least one of the thermoelectric unit layers and reconnects the thermoelectric unit layer in series or parallel with another thermoelectric unit layer. 4. The thermoelectric heat pump assembly of claim 3, wherein the microcontroller defines a setpoint temperature (Tsp) and compares the Tsp to a temperature (Tc) of a container operatively associated with the thermoelectric heat pump assembly, wherein the microcontroller controls the at least one relay to connect the at least one thermoelectric unit layer in series if Tc checks positive or equal against Tsp, and wherein the microcontroller deactivates the at least one relay if Tsp checks negative or equal against Tc. 5. The thermoelectric heat pump assembly of claim 3, wherein the microcontroller defines a setpoint temperature (Tsp) and compares the Tsp to a temperature (Tc) of a container operatively associated with the thermoelectric heat pump assembly, wherein the microcontroller activates the at least one relay to connect the at least one thermoelectric unit layer in parallel if Tc checks positive or equal against Tsp, and wherein the microcontroller deactivates the at least one relay if Tsp checks negative or equal against Tc. 6. The thermoelectric heat pump assembly according to claim 5, wherein the Tc checks positive or equal if the Tc is greater than the Tsp plus 0.1° C., and wherein the at least one thermoelectric unit layer is in series and the energy source provides a potential difference of about 2.4 volts. 7. The thermoelectric heat pump assembly of claim 3, wherein the thermoelectric heat pump assembly is configured so that each individual thermoelectric unit layer has a ratio of input current to maximum available current (I/Imax) of 0.08 or less at a steady-state when a change in temperature (ΔT) of the heat pump assembly at the top end compared to the bottom end of the heat pump assembly is about 20° C. and heat (Q) is about 0 Watts. 8. The thermoelectric heat pump assembly of claim 3, wherein the thermoelectric heat pump assembly is configured so that each individual thermoelectric unit layer has a ratio of input current to maximum available current (I/Imax) of 0.10 or less, when change in temperature (ΔT) of the heat pump assembly at the top end compared to the bottom end of the heat pump assembly is about 20° C. and heat (Q) is about 5 Watts. 9. The thermoelectric heat pump assembly of claim 3, wherein the thermoelectric heat pump assembly is configured so that each individual thermoelectric unit layer has a ratio of input current to maximum available current (I/Imax) of 0.17 or less at a steady-state when a change in temperature (AT) of the heat pump assembly at the top end compared to the bottom end of the heat pump assembly is about 40° C. and heat (Q) is about 0 Watts. 10. The thermoelectric heat pump assembly of claim 3, wherein the thermoelectric heat pump assembly is configured so that each individual thermoelectric unit layer has a ratio of input current to maximum available current (I/Imax) of 0.22 or less, when change in temperature (ΔT) of the heat pump assembly at the top end compared to the bottom end of the heat pump assembly is about 40° C. and heat (Q) is about 1 Watt. 11. The thermoelectric heat pump assembly of claim 3, wherein the heat pump assembly is configured to minimize a temperature rise or drop on the heat sink at a steady-state so that the temperature rise or drop on the heat sink does not exceed 2.5° Celsius. 12. The thermoelectric heat pump assembly of claim 3, wherein each thermoelectric unit layer comprises at least 127 coupled pairs of thermoelectric units and has a heat pumping capability of between 15 Watts and 20 Watts. 13. The thermoelectric heat pump assembly of claim 3, wherein each thermoelectric unit layer comprises thermoelectric units electrically connected in parallel or series, but thermally connected in series. 14. The thermoelectric heat pump assembly of claim 3, wherein each thermoelectric unit layer in the heat pump assembly is separated by a capacitance spacer block. 15. The thermoelectric heat pump assembly of claim 3, wherein the number of thermoelectric unit layers is three to nine. 16. The thermoelectric heat pump assembly of claim 3, wherein the thermoelectric heat pump assembly includes programmable circuitry suitable for a user-selected temperature input. 17. The thermoelectric heat pump assembly of claim 3, wherein each thermoelectric unit layer has a maximum change in temperature (ΔTmax) potential and comprises at least 127 coupled pairs of thermoelectric units, and wherein the heat pump assembly is configured so that each thermoelectric layer operates at less than 20% of the ΔTmax at steady-state when a change in temperature (AT) of the heat pump assembly at the top end compared to the bottom end of the heat pump assembly is 20° C. 18. The thermoelectric heat pump assembly of claim 3, wherein each thermoelectric unit layer has a maximum change in temperature (ΔTmax) potential and comprises at least 127 coupled pairs of thermoelectric units, and wherein the heat pump assembly is configured so that each thermoelectric layer operates at less than 40% of the ΔTmax at steady-state when a change in temperature (ΔT) of the heat pump assembly at the top end compared to the bottom end of the heat pump assembly is 40° C. 19. A method of safely transporting temperature sensitive goods at a selected temperature profile during transport, comprising the steps of: (a) placing the temperature sensitive goods in a transportation device adapted to thermally isolate the temperature sensitive goods from an outside environment, wherein the transportation device comprises at least one temperature control system adapted to actuate the selected temperature profile while the temperature sensitive goods are in the transportation device, the temperature control system comprising at least one thermoelectric heat pump of claim 4 in thermal association with the temperature sensitive goods being transported; and(b) transporting the temperature sensitive goods while the transportation device is activated according to the selected temperature profile. 20. The method of claim 19, wherein the transportation device comprises at least four thermoelectric heat pumps thermally associated with the temperature sensitive goods being transported.
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