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Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-037/00
출원번호 US-0718512 (2005-10-27)
등록번호 US-8646675 (2014-02-11)
우선권정보 DE-10 2004 053 388 (2004-11-02); DE-10 2005 028 467 (2005-06-20)
국제출원번호 PCT/DE2005/001932 (2005-10-27)
§371/§102 date 20080430 (20080430)
국제공개번호 WO2006/050691 (2006-05-18)
발명자 / 주소
  • Lang, Ulrich
출원인 / 주소
  • HID Global GmbH
대리인 / 주소
    Sheridan Ross P.C.
인용정보 피인용 횟수 : 1  인용 특허 : 59

초록

The invention relates to a laying device which is used to lay wire windings on transponder units, wherein the wire is guided in an axial manner in the laying device, a contacting device is used place the wires in contact with an automatic thermal clamping arrangement, an advancing system is used to

대표청구항

1. Feed device for taking up and guiding a tool device, in particular a laying apparatus for laying a wire on a substrate and/or a contacting device for contacting the wire with a chip, comprising: a guide carriage being movable in a first direction by means of a drive along a first guide having a f

이 특허에 인용된 특허 (59)

  1. Swiggett Brian E. (Huntington NY) Morino Ronald (Sea Cliff NY) Keogh Raymond J. (Huntington NY) Crowell Jonathan C. (Lakeville MA), Apparatus for making scribed circuit boards and circuit board modifications.
  2. Finn David,DEX ; Rietzler Manfred,DEX, Apparatus for taking up and guiding a connection device.
  3. Kobayashi Mamoru (Hadano JPX) Ishige Kanji (Kanagawa JPX) Sasaki Hideaki (Hadano JPX) Tani Mitsukiyo (Hadano JPX) Kawakami Yashuhiko (Yokohama JPX), Automatic wiring machine for printed circuit boards.
  4. Rietzler,Manfred, Binding substrate for a document for personal identification and method for its production.
  5. Hill William H. ; Gabaldon John B. ; Evans ; Jr. Daniel D., Bond head having dual axes of motion.
  6. Kreft Hans-Diedrich,DEX, Chip card capable of both contact and contactless operation including a contact block.
  7. Kreft Hans-Diedrich,DEX, Chip card with chip support element and coil support element.
  8. Finn,David; Rietzler,Manfred, Chip carrier a chip module and method of manufacturing the chip module.
  9. Finn David,DEX ; Rietzler Manfred,DEX, Chip module and manufacture of same.
  10. Boyce Joseph S. (Hanover MA) Ross James P. (Hudson NH) Jens Stephen C. (Ashland MA) Evans David A. (Chelmsford MA), Composite laminate translaminar reinforcement apparatus and method.
  11. Reeb Max E. (Helfensteinstrasse 7 D-7336 Uhingen DEX), Computer and electromagnetic energy based mass production method for the continuous flow make of planar electrical circu.
  12. Finn David,DEX ; Rietzler Manfred,DEX, Contact or contactless chip card with brace.
  13. Gustafson Ake (Route Champ Thomas 1618 Chatel-St-Denis CHX), Core chuck for coil winding.
  14. Finn David,DEX ; Rietzler Manfred,DEX, Device and method for manufacturing a coil arrangement.
  15. Finn, David; Rietzler, Manfred, Device for bonding a wire conductor.
  16. Finn David,DEX ; Rietzler Manfred,DEX, Device for producing a coil arrangement.
  17. Finn David,DEXITX DE-87459 ; Rietzler Manfred,DEXITX DE-87616, Device for the application of joint material deposit.
  18. Yamamura Takemi (Ube JPX) Ishikawa Toshihiro (Ube JPX) Shibuya Masaki (Ube JPX), Electromagnetic wave absorbing material.
  19. Matsumura, Kazuhito; Yoshida, Kenichi; Iwai, Tohru; Nakata, Hidekazu; Yoshizawa, Masato, Electromagnetic wave absorbing sheet.
  20. Schoenberg Andrew J. (Huntington NY) Friedrich Marju L. (Babylon NY), Heat activatable adhesive for wire scribed circuits.
  21. Taban, Vahid, High speed system for embedding wire antennas in an array of smart cards.
  22. Taban, Vahid, High speed system for embedding wire antennas in an array of smart cards.
  23. Finn David,DEX ; Rietzler Manfred,DEX, IC board module for producing an IC board and process for producing an IC board.
  24. Milheiser Thomas A. (Littleton CO), Identification system.
  25. Hadden Leonard D. (Minneapolis MN) Zirbes Glen L. (Silver Lake MN), Integrated circuit device including means for facilitating connection of antenna lead wires to an integrated circuit die.
  26. Amador Gonzalo (Dallas) Alfaro Rafael C. (The Colony) Davis Robert A. (Irving TX), Linear, direct-drive microelectronic bonding apparatus and method.
  27. Juan Gilberto Rodriguez MX, Method and apparatus for conservation of switching exchange resources.
  28. Brown Jerald L. (Huntington NY) Berzins Vaironis (Hicksville NY), Method and apparatus for cutting wire.
  29. Amadeo, Paul, Method and apparatus for rapid staking of antennae in smart card manufacture.
  30. Wilm Robert,DEX ; Houdeau Detlef,DEX ; Reiner Robert,DEX ; Rettig Rainer,DEX, Method and connection arrangement for producing a smart card.
  31. Finn David,DEX ; Rietzler Manfred,DEX, Method and device for bonding a wire conductor.
  32. Morton Greene ; G. William Hurley, Method for forming a radio frequency responsive target and apparatus for verifying the authenticity of same.
  33. Brady, Michael John; Saraf, Ravi; Rubino, Judy, Method for forming an antenna and a radio frequency transponder.
  34. Rietzler,Manfred, Method for producing a contactless chip card and chip card produced according to said method.
  35. Mundigl Josef,DEX ; Houdeau Detlef,DEX, Method for producing a smart card module for contactless smart cards.
  36. Haji Hiroshi (Kasuga JPX) Arita Kiyoshi (Fukuoka JPX), Method of forming inner lead bonding on a microchip.
  37. DiStefano, Thomas H.; Karavakis, Konstantine; Mitchell, Craig; Smith, John W., Method of making a compliant integrated circuit package.
  38. Swiggett Brian E. (Huntington NY) Morino Ronald (Sea Cliff NY) Keogh Raymond J. (Huntington NY) Crowell Jonathan C. (Lakeville MA) Czenczy George (Northport NY) Schoenberg Andrew J. (Huntington NY) F, Method of making wires scribed circuit boards.
  39. Bertin Robert (San Jose CA) Miller Michael B. (DeSota TX) Moon Burl M. (Richardson TX) Post Robert C. (Dallas TX), Method of preparing silicon carbide capillaries.
  40. Houdeau Detlef,DEX ; Wilm Robert,DEX, Method of producing a smart card module, a smart card module produced by the method, and a combination smart card containing the smart card module.
  41. Gustafson Ake (Route Champ Thomas 1618 Chtel-St-Denis CHX), Method of winding a coil on a chuck having guide pins.
  42. Gustafson Ake (Chatel St-Denis CHX), Miniaturized printed circuit and coil assembly.
  43. Keogh Raymond J. (Huntington NY) Morino Ronald (Shelter Island Heights NY) Burr R. Page (Matinicus ME), Multilevel circuit board precision positioning.
  44. Cunningham John ; Garcia Ephrahim ; Newton David V., Piezoelectric motor.
  45. Finn David,DEX ; Rietzler Manfred,DEX, Procedure for producing a chip mounting board and chip-mounting board thus produced.
  46. Finn David,DEX ; Rietzler Manfred,DEX, Process and a device for the production of a transponder unit and a transponder unit.
  47. Gustafson Ake (Chatel St-Denis CHX), Process for assembling a coil on a printed circuit.
  48. Burr, Robert P., Process for the manufacture of circuit boards.
  49. Kondo, Yasuo; Matsuzaki, Toru; Suematsu, Yutaka; Okamoto, Masaru; Yamamoto, Tomohisa, Radio wave absorber and production method thereof.
  50. Ohki Shinji (Osaka JPX), Read/write method by a non-contact system and between a storage substrate and read/write unit.
  51. La Fiandra Carlo (New Canaan CT) Shen Gon-Yen (Brookfield CT), Replaceable actuator assembly for optical mirror with kinematic mount.
  52. Ahn Tae O. (Seoul KRX) Park Kyoung N. (Seoul KRX) Kim Beom S. (Kyungki KRX), Resin composition for absorbing electromagnetic waves.
  53. Yamaguchi, Shigeo; Arahori, Masaaki; Yamamoto, Toshio; Nishiwaki, Toshimitsu, System for forming conductor wire on a substrate board.
  54. Taban, Vahid, Thermoelectrically controlled blower.
  55. Morino Ronald (Seacliff NY) Conti Joseph A. (Whitestone NY), Ultrasonic stylus position stabilizer.
  56. Finn David,DEX, Winding head.
  57. Chiba Hidekazu,JPX, Wire bonder.
  58. Mizoguchi Kiyoshi (Tokyo JPX) Sato Ryoetsu (Tokyo JPX) Gotoh Morikazu (Tokyo JPX), Wire bonder system.
  59. Ryuichi Kyomasu JP; Fumio Miyano JP; Toshihiko Toyama JP, Wire bonding apparatus and method.

이 특허를 인용한 특허 (1)

  1. Stroemberg, Christoffer; Berchtold, Heinrich; Galea, Charles, Device for dispensing and distributing flux-free solder on a substrate.
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