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Circuit assemblies including thermoelectric modules

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0021735 (2011-02-05)
등록번호 US-8649179 (2014-02-11)
발명자 / 주소
  • Hershberger, Jeffrey Gerard
  • Hill, Richard F.
  • Smythe, Robert Michael
  • Sutsko, Michael G.
출원인 / 주소
  • Laird Technologies, Inc.
대리인 / 주소
    Harness, Dickey & Pierce, P.L.C.
인용정보 피인용 횟수 : 6  인용 특허 : 29

초록

A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module

대표청구항

1. A circuit assembly comprising: a circuit board;a thermoelectric module; andat least one electrical pathway coupling the thermoelectric module to the circuit board for use as a heat pump in the circuit assembly;wherein the circuit board forms at least part of the thermoelectric module; andwherein

이 특허에 인용된 특허 (29)

  1. Law, Jonathan Michael; Harley, Nigel Henry, Active thermal management of semiconductor devices.
  2. Hazen William A. (Hopkinton MA), Apparatus for cooling circuits.
  3. Newman Robert ; Lee Chu-Chung, Ball grid array package having thermoelectric cooler.
  4. Bell, Lon E., Efficiency thermoelectrics utilizing thermal isolation.
  5. Goenka Lakhi Nandlal, Electrical circuit board and method for making the same.
  6. Alley, Randall G.; Deane, Philip A.; Koester, David A.; Schneider, Thomas Peter; von Windheim, Jesko, Electronic assemblies providing active side heat pumping.
  7. Hershberger, Jeffrey Gerard; Hill, Richard F.; Roser, Richard I., Flexible assemblies with integrated thermoelectric modules suitable for use in extracting power from or dissipating heat from fluid conduits.
  8. Bell, Lon E., Flexible thermoelectric circuit.
  9. Grant Edward F. (7347 Panache Way Boca Raton FL 33433), Heating and cooling pad.
  10. Bell, Lon E., High power density thermoelectric systems.
  11. Herbst ; II Gerhardt G. (1161 N. Woodsmill Rd. ; Apt C Chesterfield MO 63017), Integrated circuit cooling apparatus.
  12. Schmidt William L. (Acton MA) Olson Richard E. (Rindge NH) Solley Dennis J. (Windham NH), Localized cooling apparatus for cooling integrated circuit devices.
  13. Wall Charles B. ; Peeples Johnston W. ; Craps Terry ; DiGiacomo Robert, Method and apparatus for cooling an integrated circuit device.
  14. Bhatia Rakesh ; Padilla Robert D. ; Hermerding ; II James G., Method and apparatus for cooling integrated circuits using a thermoelectric module.
  15. Maegawa Nobuteru,JPX ; Okada Hiroaki,JPX ; Tsuzaki Michimasa,JPX ; Sakai Yuri,JPX ; Shimoda Katsuyoshi,JPX ; Komatsu Teruaki,JPX ; Murase Shinya,JPX ; Inoue Hiroyuki,JPX ; Sagawa Masayuki,JPX, Method of fabricating a thermoelectric module.
  16. Bhatia Rakesh, Package with integrated thermoelectric module for cooling of integrated circuits.
  17. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  18. Burward-Hoy Trevor (Cupertino CA), Sub-ambient temperature electronic package.
  19. Imanishi Yuichiro,JPX ; Miyoshi Makoto,JPX ; Watanabe Tetsuo,JPX ; Kushibiki Keiko,JPX ; Shinohara Kazuhiko,JPX ; Kobayashi Masakazu,JPX ; Furuya Kenji,JPX, Thermoelectric conversion module and method of manufacturing the same.
  20. Bierschenk James L. (4805 Highgate La. Rowlett TX 75088) Howarth Richard A. (915 Spring Brook Allen TX 75002) Socolowski Norbert J. (215 Fox Hill Rd. Denville NJ 07834-2507), Thermoelectric cooler.
  21. Watanabe Hideo (Kawasaki JPX) Sakai Motohiro (Yokohama JPX) Hisano Fumio (Noboribetsu JPX) Osawa Atsushi (Yokohama JPX) Tezuka Hirofusa (Noboribetsu JPX), Thermoelectric cooling device for thermoelectric refrigerator, process for the fabrication of semiconductor suitable for.
  22. Yamada Kazukiyo,JPX ; Morino Isao,JPX, Thermoelectric element and thermoelectric cooling or heating device provided with the same.
  23. Koyanagi Tadamasa (Yasatomachi JPX) Oohira Tsunehiro (Tsukuba JPX), Thermoelectric element sheet in which thermoelectric semiconductors are mounted between films.
  24. Cauchy,Matt J., Thermoelectric heat pump with direct cold sink support.
  25. Chu, Rencai; Kadotani, Kanichi; Tanimura, Toshinobu, Thermoelectric module.
  26. Leija,Javier; Lucero,Christopher D., Thermoelectric module.
  27. Yoshioka Hirokazu,JPX ; Kamada Kazuo,JPX ; Urano Yoji,JPX ; Kobayashi Kentaro,JPX, Thermoelectric module with improved heat-transfer efficiency and method of manufacturing the same.
  28. Akira Yamamura JP; Robert Otey, Thermoelectric module with integrated heat exchanger and method of use.
  29. Robert W. Otey, Thermoelectric module with thin film substrates.

이 특허를 인용한 특허 (6)

  1. Hershberger, Jeffrey Gerard; Hill, Richard F.; Smythe, Robert Michael; Sutsko, Michael G., Circuit assemblies including thermoelectric modules.
  2. Baquiano, Carmelo Engracia; Cayaban, Carmelo Delovino; Montalbo, Paul Francis Brosas; Celocia, Joseph Estorgio, Circuit board heatsink and heatframe structures with heater element for circuit board operation at below zero temperature.
  3. Kim, Kwang Soo; Kwak, Young Hoon; Hong, Chang Seob; Chae, Joon Seok; Um, Kee Ju, Power module package including heat spreader and inductance coil.
  4. Zacharko, Jonathan Peter; Ozeri, Ronny Ariel, Printed circuit board assemblies and a wellbore system.
  5. Kim, Jae Choon; Kim, Jichul; Bae, Jin-Kwon; Cho, Eunseok, Thermoelectric cooling packages and thermal management methods thereof.
  6. Kim, Jae Choon; Kim, Jichul; Bae, Jin-Kwon; Cho, Eunseok, Thermoelectric cooling packages and thermal management methods thereof.
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