IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0021735
(2011-02-05)
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등록번호 |
US-8649179
(2014-02-11)
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발명자
/ 주소 |
- Hershberger, Jeffrey Gerard
- Hill, Richard F.
- Smythe, Robert Michael
- Sutsko, Michael G.
|
출원인 / 주소 |
|
대리인 / 주소 |
Harness, Dickey & Pierce, P.L.C.
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인용정보 |
피인용 횟수 :
6 인용 특허 :
29 |
초록
▼
A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module
A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.
대표청구항
▼
1. A circuit assembly comprising: a circuit board;a thermoelectric module; andat least one electrical pathway coupling the thermoelectric module to the circuit board for use as a heat pump in the circuit assembly;wherein the circuit board forms at least part of the thermoelectric module; andwherein
1. A circuit assembly comprising: a circuit board;a thermoelectric module; andat least one electrical pathway coupling the thermoelectric module to the circuit board for use as a heat pump in the circuit assembly;wherein the circuit board forms at least part of the thermoelectric module; andwherein the circuit board can support electrical components on the circuit board at locations spaced apart from the thermoelectric module;the circuit assembly further comprising multiple thermoelectric modules, and wherein the circuit board forms at least part of the multiple thermoelectric modules. 2. The circuit assembly of claim 1, wherein the circuit board operates as one of a hot side and a cold side of the thermoelectric module. 3. A circuit assembly comprising: a circuit board;a thermoelectric module;at least one electrical pathway coupling the thermoelectric module to the circuit board for use as a heat pump in the circuit assembly;wherein the circuit board forms at least part of the thermoelectric module;wherein the circuit board can support electrical components on the circuit board at locations spaced apart from the thermoelectric module;wherein the thermoelectric module includes: a substrate spaced apart from the circuit board; andmultiple N-type thermoelectric elements and multiple P-type thermoelectric elements electrically coupled between the substrate and the circuit board. 4. The circuit assembly of claim 3, wherein the thermoelectric module is configured to transfer heat away from at least one of the electrical components through the circuit board when said at least one of the electrical components is coupled to the circuit board. 5. The circuit assembly of claim 3, further comprising at least one electrical component coupled to the substrate of the thermoelectric module, the thermoelectric module being configured to transfer heat away from said at least one electrical component. 6. The circuit assembly of claim 3, wherein at least one of the electrical components is coupled to the circuit board and spaced apart from the thermoelectric module, the thermoelectric module being configured to transfer heat away from said at least one of the electrical components. 7. The circuit assembly of claim 1, wherein the thermoelectric module is disposed within a footprint of the circuit board, the circuit board being configured to support the electrical components within said footprint of the circuit board at locations spaced apart from the thermoelectric module. 8. The circuit assembly of claim 1, wherein the electrical components comprise at least one electrical component configured to control operation of the thermoelectric module, the at least one electrical component being disposed on the circuit board in a position spaced apart from the thermoelectric module. 9. The circuit assembly of claim 1, further comprising a heat transfer device coupled to the circuit board. 10. The circuit assembly of claim 3, further comprising multiple thermoelectric modules, and wherein the circuit board forms at least part of the multiple thermoelectric modules. 11. The circuit assembly of claim 1, wherein the at least one electrical pathway is on an exposed surface of the circuit board or is buried in the circuit board. 12. A circuit assembly comprising: a circuit board;a thermoelectric module; andat least one electrical pathway coupling the thermoelectric module to the circuit board for use as a heat pump in the circuit assembly;wherein the circuit board forms at least part of the thermoelectric module;wherein the circuit board can support electrical components on the circuit board at locations spaced apart from the thermoelectric module;wherein the at least one electrical pathway comprises multiple groups of electrical pathways on the circuit board, each group configured to couple a different thermoelectric module to the circuit board. 13. A circuit assembly comprising: a circuit board;a thermoelectric module; andat least one electrical pathway coupling the thermoelectric module to the circuit board for use as a heat pump in the circuit assembly;wherein the circuit board forms at least part of the thermoelectric module;wherein the circuit board can support electrical components on the circuit board at locations spaced apart from the thermoelectric module;wherein the at least one electrical pathway is buried in the circuit board, and wherein the circuit board includes a base support, at least part of the base support being removed to thereby define an opening through the base support exposing the at least one electrical pathway of the circuit board, the at least one electrical pathway being configured to couple the thermoelectric module to the circuit board through the opening defined in the base support of the circuit board. 14. The circuit assembly of claim 1, wherein the at least one electrical pathway is disposed between two dielectric layers of the circuit board. 15. A circuit assembly comprising: a circuit board;a thermoelectric module comprising: a first substrate defined by a portion of the circuit board;a second substrate disposed within a footprint of the circuit board;N-type and P-type thermoelectric elements disposed generally between the first and second substrates;whereby the thermoelectric module is operable as a heat pump;at least one additional thermoelectric module coupled to the circuit board such that the circuit board defines part of the at least one additional thermoelectric module;wherein the circuit board can support at least one electrical component in a position spaced apart from the thermoelectric module. 16. The circuit assembly of claim 15, wherein the thermoelectric module is configured to transfer heat away from the at least one electrical component coupled to the second substrate. 17. The circuit assembly of claim 15, further comprising at least one electrical component configured to control operation of the thermoelectric module, wherein the at least one electrical component is disposed on the circuit board in a position spaced apart from the thermoelectric module. 18. The circuit assembly of claim 15, wherein the thermoelectric module is configured to transfer heat away from the at least one electrical component when said at least one electrical component is coupled to the circuit board. 19. A circuit assembly comprising: a circuit board;a thermoelectric module comprising: a first substrate defined by a portion of the circuit board;a second substrate disposed within a footprint of the circuit board;N-type and P-type thermoelectric elements disposed generally between the first and second substrates;whereby the thermoelectric module is operable as a heat pump;electrical pathways configured to couple the thermoelectric elements to the circuit board, the electrical pathways being buried in the circuit board;wherein the circuit board can support at least one electrical component in a position spaced apart from the thermoelectric module;wherein the circuit board includes a base support, at least part of the base support being removed to thereby define an opening through the base support exposing the electrical pathways, the electrical pathways being configured to couple the thermoelectric elements to the circuit board through the opening defined in the base support of the circuit board. 20. A method of making a circuit assembly having a circuit and a thermoelectric module incorporated therein, the method comprising: forming at least one electrical pathway on a circuit board as part of the circuit for electrically coupling an electrical component of the circuit to the circuit board; andcoupling multiple N-type thermoelectric elements and multiple P-type thermoelectric elements between part of the circuit board and a substrate, thereby forming a thermoelectric module on the circuit board such that the circuit board defines part of the thermoelectric module;wherein the substrate defines a footprint that is smaller than a footprint of the circuit board, and wherein the circuit board can support additional electrical components of the circuit on the circuit board in a position outside the footprint defined by the substrate. 21. The method of claim 20, further comprising coupling an electrical component of the circuit to the circuit board via the at least one electrical pathway formed on the circuit board. 22. The method of claim 20, further comprising forming at least one electrical pathway on the substrate, and coupling an electrical component to the substrate via said electrical pathway formed on the substrate. 23. The method of claim 20, further comprising coupling a heat transfer device to at least one of the circuit board and the substrate. 24. A circuit assembly comprising: a circuit board comprising electrically conductive patterns and at least one electrical pathway;a substrate comprising electrically conductive patterns; andmultiple N-type thermoelectric elements and multiple P-type thermoelectric elements disposed between the circuit board and the substrate and coupled to the electrically conductive patterns of the circuit board and the electrically conductive patterns of the substrate;wherein a portion of the circuit board comprising the electrically conductive patterns, the substrate, and the multiple N-type and P-type thermoelectric elements define a thermoelectric module on the circuit board, such that the circuit board forms an integral part of the thermoelectric module;wherein the at least one electrical pathway of the circuit board is coupled to the thermoelectric module for providing power to the thermoelectric module; andwherein the circuit board can support at least one electrical component on the circuit board at a location spaced apart from the thermoelectric module;whereby the thermoelectric module is operable as a heat pump. 25. The circuit assembly of claim 24, further comprising the at least one electrical component, wherein the at least one electrical component is coupled to the circuit board and is configured to control operation of the thermoelectric module, the at least one electrical component being disposed on the circuit board in a position spaced apart from the thermoelectric module. 26. The circuit assembly of claim 24, further comprising at least one electrical component coupled to the substrate, the thermoelectric module being configured to transfer heat away from said at least one electrical component.
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