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A heat transfer arrangement (100) comprises a refrigerant circuit (102), which refrigerant circuit (102) comprises an evaporator (104) adapted to be arranged inside an electronic component housing (112), a condenser (108) adapted to be arranged outside the electronic component housing (112), a first

A heat transfer arrangement (100) comprises a refrigerant circuit (102), which refrigerant circuit (102) comprises an evaporator (104) adapted to be arranged inside an electronic component housing (112), a condenser (108) adapted to be arranged outside the electronic component housing (112), a first conduit (106) and a second conduit (110). A refrigerant is present in the refrigerant circuit (102) and in use is arranged to self-circulate by evaporating in the evaporator (104), rising as a gas through the first conduit (106), condensing in the condenser (108) and flowing through the second conduit (110) to the evaporator (104). The heat transfer arrangement (100) further comprises a reservoir (124) for liquid refrigerant connected to the refrigerant circuit (102). A control device associated with the reservoir (124) is operable such that liquid refrigerant is collected in the reservoir (124) from the refrigerant circuit (102) to reduce heat exchange from the inside of the electronic component housing (112) to the ambient environment and such that liquid refrigerant is introduced from the reservoir (124) to the refrigerant circuit to increase heat exchange from the inside of the electronic component housing (112) to ambient environment.

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1. A heat transfer arrangement for heat exchange between an inside of an electronic component housing and an ambient environment, said heat transfer arrangement comprising: a refrigerant circuit including an evaporator configured to be arranged inside said housing and to evaporate a self-circulating

1. A heat transfer arrangement for heat exchange between an inside of an electronic component housing and an ambient environment, said heat transfer arrangement comprising: a refrigerant circuit including an evaporator configured to be arranged inside said housing and to evaporate a self-circulating refrigerant, a condenser configured to be arranged outside said housing and to condense said refrigerant, a first conduit through which said refrigerant rises in gaseous form from said evaporator to said condenser, and a second conduit through which said refrigerant flows in liquid form from said condenser to said evaporator; anda reservoir that is connected to said refrigerant circuit, that is configured to be arranged inside said housing to be directly affected by the temperature therein, and that comprises a refrigerant chamber and a control chamber separated by a movable partition, wherein said refrigerant chamber is configured to hold said refrigerant in liquid form, and wherein said control chamber is configured to hold a control medium that expands in volume at higher temperatures and contracts in volume at lower temperatures to thereby adjust the size of said control chamber, adjust the respective amounts of said refrigerant in the refrigerant chamber and the refrigerant circuit, and control the temperature inside said housing. 2. The heat transfer arrangement according to claim 1, wherein said reservoir is directly, or via a connecting conduit, connected to said condenser, to said second conduit, or to said evaporator. 3. The heat transfer arrangement according to claim 1, wherein said movable partition comprises a piston or a membrane configured to adjust a size of said refrigerant chamber. 4. The heat transfer arrangement according to claim 3, wherein the moveable partition is configured to adjust said size of said refrigerant chamber responsive to the expansion or contraction of said control medium in said control chamber. 5. The heat transfer arrangement according to claim 1, wherein said control medium is a liquid. 6. The heat transfer arrangement according to claim 1, wherein said control medium is a gas. 7. The heat transfer arrangement according to claim 1, wherein said reservoir is directly, or via a dedicated connecting circuit, connected to a lower end of said condenser. 8. An electronic component housing including a heat transfer arrangement for heat exchange between an inside of the electronic component housing and an ambient environment, said heat transfer arrangement comprising: a refrigerant circuit including an evaporator configured to be arranged inside said housing and to evaporate a self-circulating refrigerant, a condenser configured to be arranged outside said housing and to condense said refrigerant, a first conduit through which said refrigerant rises in gaseous form from said evaporator to said condenser, and a second conduit through which said refrigerant flows in liquid form from said condenser to said evaporator; anda reservoir that is connected to said refrigerant circuit, that is configured to be arranged inside said housing to be directly affected by the temperature therein, and that comprises a refrigerant chamber and a control chamber separated by a movable partition, wherein said refrigerant chamber is configured to hold said refrigerant in liquid form, and wherein said control chamber is configured to hold a control medium that expands in volume at higher temperatures and contracts in volume at lower temperatures to thereby adjust the size of said control chamber, adjust the respective amounts of said refrigerant in the refrigerant chamber and the refrigerant circuit, and control the temperature inside said housing. 9. The electronic component housing according to claim 8, wherein said reservoir is directly, or via a connecting conduit, connected to said condenser, to said second conduit, or to said evaporator. 10. The electronic component housing according to claim 8, wherein said movable partition comprises a piston or a membrane configured to adjust a size of said refrigerant chamber. 11. The electronic component housing according to claim 10, wherein the moveable partition is configured to adjust said size of said refrigerant chamber responsive to the expansion or contraction of said control medium in said control chamber. 12. The electronic component housing according to claim 8, wherein said control medium is a liquid. 13. The electronic component housing according to claim 8, wherein said control medium is a gas. 14. The electronic component housing according to claim 8, wherein said reservoir is directly, or via a dedicated connecting circuit, connected to a lower end of said condenser. 15. The electronic component housing according to claim 8, wherein the electronic component housing is part of a radio base station. 16. A method of controlling the extent of heat that is exchanged between an inside of an electronic component housing and an ambient environment by self-circulation of a refrigerant through an evaporator exposed to an interior temperature of the housing and a condenser external to the housing, the method comprising: controlling the amount of refrigerant in circulation through the evaporator by collecting a variable amount of refrigerant condensed by the condenser in a refrigerant chamber exposed to a control element that reduces the volume of the refrigerant chamber with increasing interior temperature and increases the volume of the refrigerant chamber with decreasing interior temperature;wherein the collecting comprises collecting a variable amount of refrigerant condensed by the condenser in a refrigerant chamber exposed to a control element that: with increasing interior temperature, reduces the volume of the refrigerant chamber and correspondingly increases the volume of an adjacent control chamber that is separated from the refrigerant chamber by a moveable partition and that holds the control element; andwith decreasing interior temperature, increases the volume of the refrigerant chamber and correspondingly decreases the volume of the adjacent control chamber. 17. A heat transfer arrangement configured to control the extent of heat exchange between an inside of an electronic component housing and an ambient environment, said arrangement comprising: a refrigerant circuit configured to evaporate and condense a refrigerant as that refrigerant self-circulates between an evaporator inside said housing and a condenser outside said housing via first and second conduits; anda reservoir comprising a refrigerant chamber and a control chamber separated by a moveable partition, wherein the control chamber is configured to house a control medium that has a volume dependent on the temperature inside said housing and wherein the movable partition is configured to adjust the respective sizes of the refrigerant and control chambers responsive to volume changes in said control medium to thereby either collect said refrigerant in liquid form from said refrigerant circuit into said refrigerant chamber or to introduce said refrigerant in liquid form from said refrigerant chamber into said refrigerant circuit.