초록

Embodiments of a printhead are disclosed.

대표청구항 ▼

1. A printhead comprising: a plurality of drop generators formed only along a first edge of a substrate, wherein the first edge is straight, wherein each drop generator includes a fluid ejector, the fluid ejectors are organized as primitives, and each primitive comprises a group of fluid ejectors in

1. A printhead comprising: a plurality of drop generators formed only along a first edge of a substrate, wherein the first edge is straight, wherein each drop generator includes a fluid ejector, the fluid ejectors are organized as primitives, and each primitive comprises a group of fluid ejectors in which not more than one fluid ejector is activated at one time;N primitive select lines and M address select lines to control M×N fluid ejectors;a plurality of bond pads formed only along a second edge of said substrate, wherein the second edge is straight and parallel to and opposing the first edge, wherein the plurality of bond pads includes address bond pads connected to the M address select lines and primitive bond pads connected to the N primitive select lines; anddecoder circuitry for selectively transmitting signals from the address bond pads to the address select lines, wherein the number of address bond pads is less than the number of address select lines. 2. The printhead of claim 1 wherein said substrate is substantially rectangular and said first edge and said second edge are on opposing sides thereof. 3. The printhead of claim 1 wherein each drop generator includes a firing chamber, a feed channel establishing fluid communication between said firing chamber and said first edge, and the fluid ejector disposed in said firing chamber. 4. The printhead of claim 3 further comprising a drive transistor associated with each fluid ejector. 5. The printhead of claim 4, wherein each address select line is connected to one or more of said drive transistors. 6. The printhead of claim 1 wherein said decoder circuitry comprises: a pair of conductive leads and an inverter gate associated with each address bond pad, each address bond pad being directly connected to a first one of its pair of conductive leads and being indirectly connected to a second one of its pair of conductive leads via its inverter gate; anda plurality of NOR gates, each NOR gate having an output connected to a corresponding one of said address select lines and a plurality of inputs connected to a corresponding group of said conductive leads. 7. The printhead of claim 3 further comprising a nozzle member defining a plurality of nozzles, each nozzle being associated with a corresponding one of said firing chambers. 8. A method of fabricating a printhead comprising: applying a first conductive layer to a substrate to form transistor gate regions;applying a dopant concentration to create transistor active regions;applying a second conductive layer to create fluid ejectors organized as primitives, each primitive comprising a group of fluid ejectors in which not more than one fluid ejector is activated at one time;applying a third conductive layer to create bond pads and all interconnections for connecting said bond pads, said transistor gate regions, said transistor active regions, and said fluid ejectors, wherein all of said bond pads are formed only along a first straight edge of said substrate and all of said fluid ejectors are formed only along a second straight edge of said substrate, wherein the second straight edge is parallel to and opposing the first straight edge, wherein the interconnections include N primitive select lines and M address select lines to control M×N fluid ejectors and the bond pads include address bond pads connected to the M address select lines and primitive bond pads connected to the N primitive select lines, wherein decoder circuitry selectively transmits signals from the address bond pads to the address select lines, wherein the number of address bond pads is less than the number of address select lines. 9. The method of claim 8 further comprising applying a passivation layer over said conductive layers. 10. The method of claim 9 further comprising applying a barrier layer directly on top of said passivation layer, said barrier layer defining firing chambers and feed channels. 11. The method of claim 8 further comprising applying a dielectric layer to provide thermal isolation between said fluid ejectors and said substrate. 12. The product of the method of claim 8. 13. A printhead made by a process comprising: forming a plurality of drop generators only along a first straight edge of a substrate, wherein each drop generator includes a fluid ejector, the fluid ejectors are organized as primitives, and each primitive comprises a group of fluid ejectors in which not more than one fluid ejector is activated at one time;forming N primitive select lines and M address select lines to control M×N fluid ejectors;forming a plurality of bond pads only along a second straight edge of said substrate, wherein the second straight edge is parallel to and opposing the first straight edge, wherein the plurality of bond pads includes address bond pads connected to the M address select lines and primitive bond pads connected to the N primitive select lines; andforming decoder circuitry for selectively transmitting signals from the address bond pads to the address select lines, wherein the number of address bond pads is less than the number of address select lines.