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A cooling system for a hot gas path component is disclosed. The cooling system may include a component layer and a cover layer. The component layer may include a first inner surface and a second outer surface. The second outer surface may define a plurality of channels. The component layer may furth

A cooling system for a hot gas path component is disclosed. The cooling system may include a component layer and a cover layer. The component layer may include a first inner surface and a second outer surface. The second outer surface may define a plurality of channels. The component layer may further define a plurality of passages extending generally between the first inner surface and the second outer surface. Each of the plurality of channels may be fluidly connected to at least one of the plurality of passages. The cover layer may be situated adjacent the second outer surface of the component layer. The plurality of passages may be configured to flow a cooling medium to the plurality of channels and provide impingement cooling to the cover layer. The plurality of channels may be configured to flow cooling medium therethrough, cooling the cover layer.

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1. A cooling system for a hot gas path component, the cooling system comprising: a component layer, the component layer including a first inner surface and a second outer surface, the second outer surface defining a plurality of channels, the component layer further defining a plurality of first pas

1. A cooling system for a hot gas path component, the cooling system comprising: a component layer, the component layer including a first inner surface and a second outer surface, the second outer surface defining a plurality of channels, the component layer further defining a plurality of first passages extending generally between the first inner surface and the second outer surface, wherein each of the plurality of channels is directly and fluidly connected to at least one of the plurality of first passages, the component layer further defining a plurality of second passages, each of the plurality of second passages fluidly connected to one of the plurality of channels; anda cover layer, the cover layer situated adjacent the second outer surface of the component layer,wherein the plurality of first passages are configured to flow a cooling medium to the plurality of channels and provide impingement cooling to the cover layer, and wherein the plurality of channels are configured to flow cooling medium therethrough, cooling the cover layer, and wherein at least one of the plurality of second passages is configured to flow cooling medium from one of the plurality of channels and exhaust cooling medium adjacent the first the inner surface of the component layer. 2. The cooling system of claim 1, wherein the component layer comprises a component substrate. 3. The cooling system of claim 1, wherein the cover layer is one of a metal coating, a bond coating, or a thermal barrier coating. 4. The cooling system of claim 1, further comprising a thermal barrier coating disposed adjacent the cover layer. 5. The cooling system of claim 4, further comprising a bond coating disposed between the thermal barrier coating and the cover layer. 6. The cooling system of claim 1, wherein the component layer comprises a component substrate and a bond coating, and wherein the plurality of channels are defined in the bond coating. 7. The cooling system of claim 6, wherein the cover layer comprises a thermal barrier coating. 8. The cooling system of claim 1, wherein the component layer comprises a component substrate, a bond coating, and a first thermal barrier coating, and wherein the plurality of channels are defined in the first thermal barrier coating. 9. The cooling system of claim 8, wherein the cover layer comprises a second thermal barrier coating. 10. The cooling system of claim 1, further comprising at least one cooling circuit, the cooling circuit defined adjacent the first inner surface, and Wherein the plurality of passages are fluidly connected to the at least one cooling circuit. 11. The cooling system of claim 1, wherein the cover layer defines a plurality of exhaust passages, each of the plurality of exhaust passages fluidly connected to one of the plurality of channels and configured to flow cooling medium from the channel and exhaust cooling medium adjacent the cover layer. 12. The cooling system of claim 1, wherein cooling medium is exhausted directly from the plurality of channels. 13. The cooling system of claim 1, wherein each of the plurality of channels has a width and a length, and wherein the width of each of the plurality of channels is substantially constant throughout the length of the channel. 14. The cooling system of claim 1, wherein each of the plurality of channels has a width and a length, and wherein the width of each of the plurality of channels is tapered. 15. The cooling system of claim 1, wherein each of the plurality of channels has a depth and a length, and wherein the depth of each of the plurality of channels is substantially constant throughout the length of the channel. 16. The cooling system of claim 1, wherein each of the plurality of channels has a depth and a length, and wherein the depth of each of the plurality of channels is tapered. 17. The cooling system of claim 1, wherein each of the plurality of channels has a substantially smooth surface. 18. The cooling system of claim 1, wherein each of the plurality of channels has a surface that includes a plurality of surface features. 19. A cooling system for a hot gas path component, the cooling system comprising: a component substrate, the component substrate including a first inner surface and a second outer surface, the second outer surface defining a plurality of channels, the component substrate further defining a plurality of first passages extending generally between the first inner surface and the second outer surface, wherein each of the plurality of channels is directly and fluidly connected to at least one of the plurality of first passages, the component layer further defining a plurality of second passages, each of the plurality, of second passages fluidly connected to one of the plurality of channels; anda metal coating, the metal coating situated adjacent the second outer surface of the component substrate,wherein the plurality of first passages are configured to flow a cooling medium to the plurality of channels and provide impingement cooling to the metal coating, and wherein the plurality of channels are configured to flow cooling medium therethrough, further cooling the metal coating, and wherein at least one of the plurality of second passages is configured to flow cooling medium from one Of the plurality of channels and exhaust cooling medium adjacent the first inner surface of the component layer.