IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0951559
(2010-11-22)
|
등록번호 |
US-8659870
(2014-02-25)
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발명자
/ 주소 |
- Brendel, Richard L.
- Stevenson, Robert A.
- Marzano, Thomas
- Woods, Jason
- Kelley, Scott W.
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
21 인용 특허 :
9 |
초록
▼
A modular EMI filtered terminal assembly for an active implantable medical device (AIMD) includes a hermetic terminal subassembly having at least one conductor extending through an insulator in non-conductive relation with the AIMD housing, and a feedthrough capacitor subassembly disposed generally
A modular EMI filtered terminal assembly for an active implantable medical device (AIMD) includes a hermetic terminal subassembly having at least one conductor extending through an insulator in non-conductive relation with the AIMD housing, and a feedthrough capacitor subassembly disposed generally adjacent to the hermetic terminal assembly. The feedthrough capacitor subassembly includes a conductive modular cup conductively coupled to the AIMD housing, and a feedthrough capacitor disposed within the modular cup. A first electrode plate or set of electrode plates is conductively coupled to the conductor, and a second electrode plate or set of electrode plates is conductively coupled to the modular cup.
대표청구항
▼
1. A modular EMI filtered terminal assembly, comprising: a) a hermetic terminal subassembly comprising: i) a ferrule comprising a ferrule sidewall extending from a first ferrule end to a second ferrule end;ii) an insulator comprising an insulator body having a first insulator surface spaced from a s
1. A modular EMI filtered terminal assembly, comprising: a) a hermetic terminal subassembly comprising: i) a ferrule comprising a ferrule sidewall extending from a first ferrule end to a second ferrule end;ii) an insulator comprising an insulator body having a first insulator surface spaced from a second insulator surface by an outer insulator sidewall with at least one insulator via extending through the insulator body from the first insulator surface to the second insulator surface thereof, wherein the insulator is hermetically sealed to the ferrule with the first insulator end adjacent to the first ferrule end and the second insulator end adjacent to the second ferrule end; andiii) at least one conductor extending through the at least one insulator via in a hermetic relationship therewith; andb) a feedthrough capacitor subassembly comprising: i) a conductive modular cup comprising a cup sidewall extending from a webplate to an opposite open cup end;ii) a feedthrough capacitor comprising a dielectric body having a first dielectric surface spaced from a second dielectric surface by an outer dielectric sidewall with at least one dielectric via extending through the dielectric body from the first dielectric surface to the second dielectric surface thereof;iii) at least one first electrode plate supported by the dielectric body in spaced relation with at least one second electrode plate, the at least one first electrode plate being electrically connected to the at least one conductor by a first conductive material contacting a first metallization at the at least one dielectric via, the first electrode plate being spaced from a second metallization at the outer dielectric sidewall, and the second electrode plate being electrically connected to the cup sidewall by a second conductive material contacting the second metallization at the outer dielectric sidewall, the first electrode plate being spaced from the first metallization at the dielectric via and the at least one conductor; andiv) wherein the feedthrough capacitor is at least partially disposed within the modular cup with the first dielectric surface adjacent to the webplate and the second dielectric surface adjacent to the open cup end; andc) an electrical connection from the modular cup of the feedthrough capacitor subassembly to the ferrule of the hermetic terminal subassembly, wherein the second dielectric surface adjacent to the modular cup open end is a greater distance spaced from the first insulator end and from the first ferrule end than that of the first dielectric surface and the cup webplate spaced from the first insulator and ferrule ends. 2. The modular EMI filtered terminal assembly of claim 1, wherein the ferrule is configured to be conductively coupled to an AIMD housing. 3. The modular EMI filtered terminal assembly of claim 1 wherein the modular cup sidewall includes at least one aperture for facilitating conductive attachment between the second metallization at the outer dielectric sidewall and the modular cup. 4. The modular EMI filtered terminal assembly of claim 1 wherein the webplate extends from the cup sidewall part way to the dielectric via in the dielectric body of the feedthrough capacitor. 5. The modular EMI filtered terminal assembly of claim 1 wherein the webplate extends from the cup sidewall to the dielectric via in the dielectric body of the feedthrough capacitor. 6. The modular EMI filtered terminal assembly of claim 1 wherein facing surfaces of the webplate and the hermetic terminal subassembly define a leak detection gap. 7. The modular EMI filtered terminal assembly of claim 1 wherein the modular cup sidewall at least partially surrounds the outer dielectric sidewall of the feedthrough capacitor, and a web flange is at least partially disposed about a periphery of the modular cup sidewall. 8. The modular EMI filtered terminal assembly of claim 1, including an electrically insulative washer disposed between the feedthrough capacitor subassembly and the hermetic terminal subassembly. 9. The modular EMI filtered terminal assembly of claim 8, wherein the insulative washer is disposed between the hermetic terminal subassembly and the modular cup. 10. The modular EMI filtered terminal assembly of claim 8 or 9, wherein the insulative washer is disposed between the feedthrough capacitor and the modular cup. 11. The modular EMI filtered terminal assembly of claim 1 or 2, wherein the feedthrough capacitor is internally grounded to the modular cup. 12. The modular EMI filtered terminal assembly of claim 1 wherein the modular cup includes a conductive ground pin extending into the feedthrough capacitor and conductively coupled to the at least one second electrode plate. 13. The modular EMI filtered terminal assembly of claim 1 including a peripheral gap between the outer dielectric sidewall of the feedthrough capacitor and the modular cup. 14. The modular EMI filtered terminal assembly of claim 1 wherein the modular cup includes mounting tabs for conductive attachment to the ferrule. 15. The modular EMI filtered terminal assembly of claim 14, including pins received in openings in the mounting tabs for attaching the modular cup to the ferrule. 16. The modular EMI filtered terminal assembly of claim 1 wherein the modular cup includes, a ferrule mounting flange. 17. The modular EMI filtered terminal assembly of claim 16, wherein the ferrule mounting flange of the modular cup includes at least one aperture for facilitating conductive material attachment between the modular cup and the ferrule. 18. The modular EMI filtered terminal assembly of claim 16 wherein the ferrule mounting flange of the modular cup is connected to the ferrule by at least one of the group consisting of a thermal setting conductive adhesive, a solder, a braze, a weld, and combinations thereof. 19. A process for manufacturing an EMI filtered terminal assembly for an active implantable medical device (AIMD), comprising the steps of: a) providing a hermetic terminal subassembly comprising: i) a ferrule comprising a ferrule sidewall extending from a first ferrule end to a second ferrule end;ii) an insulator comprising an insulator body having a first insulator surface spaced from a second insulator surface by an outer insulator sidewall with at least one insulator via extending through the insulator body from the first insulator surface to the second insulator surface thereof, wherein the insulator is hermetically sealed to the ferrule with the first insulator end adjacent to the first ferrule end and the second insulator end adjacent to the second ferrule end; andiii) at least one conductor extending through the at least one insulator via in a hermetic relationship therewith;b) providing a feedthrough capacitor subassembly comprising: i) a conductive modular cup comprising a cup sidewall extending from a webplate to an opposite open cup end;ii) a feedthrough capacitor comprising a dielectric body having a first dielectric surface spaced from a second dielectric surface by an outer dielectric sidewall with at least one dielectric via extending from the first dielectric surface to the second dielectric surface thereof;iii) at least one active electrode plate supported by the dielectric body in spaced relation with at least one ground electrode plate, the at least one active electrode plate being electrically connected to the at least one conductor by a first conductive material contacting a first metallization at the at least one dielectric via, the active electrode plate being spaced from a second metallization at the outer dielectric sidewall, and the ground electrode plate being electrically connected to the cup sidewall by a second conductive material contacting the second metallization at the outer dielectric sidewall, the active electrode plate being spaced from the first metallization at the dielectric via and the at least one conductor; andiv) wherein the feedthrough capacitor is at least partially disposed within the modular cup with the first dielectric surface adjacent to the webplate and the second dielectric surface adjacent to the open cup end; andc) assembling the feedthrough capacitor subassembly to the hermetic terminal, subassembly with the at least one conductor extending through the dielectric via; andd) electrically connecting the at least one conductor to the at least one active electrode plate by a second metallization at the dielectric via, wherein the second dielectric surface adjacent to the modular cup open end is a greater distance spaced from the first insulator end and from the first ferrule end than that of the first dielectric surface and the cup webplate spaced from the first insulator and ferrule ends. 20. The process of claim 19 including the step of subjecting the feedthrough capacitor subassembly to thermal cycles or shocks prior to its assembly to the hermetic terminal subassembly. 21. The process of claim 20, including the step of testing the mechanical characteristics of the feedthrough capacitor subassembly prior to its assembly to the hermetic terminal, subassembly. 22. The process of claim 20, including the step of testing the electrical characteristics of the feedthrough capacitor subassembly prior to its assembly to the hermetic terminal subassembly. 23. The process of claim 19 wherein the modular cup sidewall includes at least one aperture for facilitating conductive attachment between the first metallization at the outer dielectric sidewall and the modular cup. 24. The process of claim 19 wherein the webplate extends from the cup sidewall at least part way to the dielectric via in the dielectric body of the feedthrough capacitor. 25. The process of claim 19 including the step of providing a leak detection gap between facing surfaces of the webplate and the hermetic terminal subassembly. 26. The process of claim 19, including the step of providing an electrically insulative washer between the feedthrough capacitor and the hermetic terminal subassembly, wherein the insulative washer is disposed between the hermetic terminal subassembly and the modular cup, or between the feedthrough capacitor and the modular cup, or both. 27. The process of claim 19, including the step of internally grounding the feedthrough capacitor to the modular cup. 28. The process of claim 27, wherein the modular cup includes a conductive ground pin extending into the feedthrough capacitor and conductively coupled to the at least one ground electrode plate. 29. The process of claim 27, including the step of providing a peripheral gap between the outer dielectric sidewall of the feedthrough capacitor and the modular cup. 30. The process of claim 19 wherein the modular cup includes mounting tabs for conductive attachment to the ferrule, and including the step of attaching the modular cup to the ferrule utilizing conductive pins received in openings in the mounting tabs. 31. The process of claim 19 wherein the modular cup includes mounting tabs for conductive attachment to the ferrule and a ferrule mounting flange having at least one mounting tab aperture therethrough, and the process including the step of utilizing the mounting tab aperture for adhesively attaching the modular cup to the ferrule. 32. The process of claim 19 wherein the modular cup comprises a web flange at least partially disposed about a periphery of the modular cup sidewall. 33. The process of claim 19, including the steps of utilizing a high-temperature solder when installing the feedthrough capacitor into the modular cup, and subsequently assembling the feedthrough capacitor subassembly to the hermetic terminal subassembly utilizing a relatively lower temperature assembly procedure. 34. A feedthrough capacitor, comprising: a) a modular cup comprising a cup sidewall extending from a webplate to an opposite open cup end, wherein there is at least one aperture in the modular cup sidewall;b) a feedthrough capacitor comprising a dielectric body having a first dielectric surface spaced from a second dielectric surface by an outer dielectric sidewall with at least one dielectric via extending through the dielectric body from the first dielectric surface to the second dielectric surface thereof, andc) at least one first electrode plate supported by the dielectric body in spaced relation with at least one second electrode plate, the at least one first electrode plate being electrically connected to the at least one conductor by a first conductive material contacting a first metallization at the at least one dielectric via, the first electrode plate being spaced from a second metallization at the outer dielectric sidewall, andd) the at least one second electrode plate being electrically connected to the cup sidewall by a second conductive material at the at least one aperture in the modular cup sidewall and contacting the second metallization at the outer dielectric sidewall, the first electrode plate being spaced from the first metallization at the dielectric via and the conductor. 35. The feedthrough capacitor of claim 34 wherein the at least one aperture in the modular cup sidewall facilitates conductive attachment between the second metallization at the outer dielectric sidewall and the modular cup. 36. The feedthrough capacitor of claim 34 wherein the modular cup is of copper. 37. A modular EMI filtered terminal assembly, comprising: a) a hermetic terminal subassembly comprising: i) a ferrule comprising a ferrule sidewall extending from a first ferrule end to a second ferrule end;ii) an insulator comprising an insulator body having a first insulator surface spaced from a second insulator surface by an outer insulator sidewall with at least one insulator is extending through the insulator body from the first insulator surface to the second insulator surface thereof, wherein the insulator is hermetically sealed to the ferrule with the first insulator end adjacent to the first ferrule end and the second insulator end adjacent to the second ferrule end; andiii) at least one conductor extending through the at least one insulator via in a hermetic relationship therewith; andb) a feedthrough capacitor subassembly comprising: i) a conductive modular cup comprising a cup sidewall extending from a webplate to an opposite open cup end;ii) a feedthrough capacitor comprising a dielectric body having a first dielectric surface spaced from a second dielectric surface by an outer dielectric sidewall with at least a first and a second dielectric vias extending through the dielectric body from the first dielectric surface to the second dielectric surface thereof;iii) at least one active electrode plate supported by the dielectric body in spaced relation with at least one ground electrode plate, the at least one active electrode plate being electrically connected to the at least one conductor by a first conductive material contacting a first metallization at the at least one first dielectric via, but spaced from a second metallization at the second dielectric via, and the ground electrode plate being electrically connected to a ground pin connected to the webplate and extending through the second dielectric via by a second metallization, but spaced from the first metallization at the first dielectric via such that the at least one active electrode plate is conductively coupled to the at least one conductor, and the at least one ground electrode plate is conductively coupled to the modular cup by the ground pin,iv) wherein the feedthrough capacitor is at least partially disposed within the modular cup with the first dielectric surface adjacent to the webplate and the second dielectric surface adjacent to the open cup end; andc) an electrical connection from the modular cup of the feedthrough capacitor subassembly to the ferrule of the hermetic terminal subassembly, wherein the second dielectric surface adjacent to the modular cup open end is a greater distance spaced from the first insulator end and from the first ferrule end than that of the first dielectric surface and the cup webplate spaced from the first insulator an ferrule ends. 38. The modular EMI filtered terminal assembly of claim 37 including a conductive adhesive electrically connecting the modular cup of the feedthrough capacitor subassembly to the ferrule of the hermetic terminal subassembly. 39. The modular EMI filtered terminal assembly of claim 37 wherein the modular cup includes mounting tabs with openings and including pins received in the openings in the mounting tabs for attaching the modular cup to the ferrule. 40. The modular EMI filtered terminal assembly of claim 37 wherein facing surfaces of the webplate and the hermetic terminal subassembly define a leak detection gap. 41. The modular EMI filtered terminal assembly of claim 37 including an electrically insulative washer disposed between the feedthrough capacitor subassembly and the hermetic terminal subassembly. 42. The modular EMI filtered terminal assembly of claim 41 wherein the insulative washer is disposed between the hermetic terminal subassembly and the modular cup. 43. The modular EMI filtered terminal assembly of claim 41 wherein the insulative washer is disposed between the feedthrough capacitor and the modular cup. 44. An active implantable medical device (AIMD), comprising: a) a hermetic terminal subassembly comprising: i) an insulator comprising an insulator body having a first insulator surface spaced from a second insulator surface by an outer insulator sidewall with at least one insulator via extending through the insulator body from the first insulator surface to the second insulator surface thereof, wherein the insulator is hermetically sealed in an opening in a housing for the AIMD; andii) at least one conductor extending through the at least one insulator via in a hermetic relationship therewith; andb) a feedthrough capacitor subassembly comprising: i) a conductive modular cup comprising a cup sidewall extending from a webplate to an opposite open cup end;ii) a feedthrough capacitor comprising a dielectric body having a first dielectric surface spaced from a second dielectric surface by an outer dielectric sidewall, with at least one dielectric via extending through the dielectric body from the first dielectric surface to the second dielectric surface thereof;iii) at least one first electrode plate supported by the dielectric body in spaced relation with at least one second electrode plate, the at least one first electrode plate being electrically connected to the at least one conductor by a first conductive material contacting a first metallization at the at least one dielectric via, the first electrode plate being spaced from a second metallization at the outer dielectric sidewall, and the second electrode plate being electrically connected to the cup sidewall by a second conductive material contacting the second metallization at the outer dielectric sidewall, the first electrode plate being spaced from the first metallization at the dielectric via and the at least one conductor; andiv) wherein the feedthrough capacitor is at least partially disposed within the modular cup with the first dielectric surface adjacent to the webplate and the second dielectric surface adjacent to the open cup end; andc) an electrical connection from the modular cup of the feedthrough capacitor subassembly to the housing for the AIMD, wherein the second dielectric surface adjacent to the modular cup open end is a greater distance spaced from the first insulator end than that of the first dielectric surface and the cup webplate spaced from the first insulator end. 45. The active implantable medical device of claim 44 wherein the modular cup sidewall includes at least one aperture for facilitating conductive attachment between the second metallization at the outer dielectric sidewall and the modular cup. 46. The active implantable medical device of claim 44 wherein the webplate extends from the cup sidewall either to or part way to the dielectric via in the dielectric body of the feedthrough capacitor. 47. The active implantable medical device of claim 44 wherein facing surfaces of the webplate and the hermetic terminal subassembly define a leak detection gap. 48. The active implantable medical device of claim 44 including an electrically insulative washer disposed between the feedthrough capacitor subassembly and the hermetic terminal subassembly. 49. The active implantable medical device of claim 48 wherein the insulative washer is disposed between the hermetic terminal subassembly and the modular cup. 50. The active implantable medical device of claim 48 or 49 wherein the insulative washer is disposed between the feedthrough capacitor and the modular cup. 51. The active implantable medical device of claim 44 wherein, the feedthrough capacitor is internally grounded to the modular cup. 52. The active implantable medical device of claim 44 wherein the modular cup includes a conductive ground pin extending into the feedthrough capacitor and conductively coupled to the at least one second electrode plate. 53. The active implantable medical device of claim 44 including a peripheral gap between the outer dielectric sidewall of the feedthrough capacitor and the modular cup.
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