High-temperature sensor interface and network
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01D-003/036
G01D-021/02
출원번호
US-0445165
(2012-04-12)
등록번호
US-8661923
(2014-03-04)
발명자
/ 주소
Willett, Michael
Shaw, Greg
출원인 / 주소
Orbital Research Inc.
대리인 / 주소
Kolkowski, Brian M.
인용정보
피인용 횟수 :
2인용 특허 :
8
초록▼
The present invention is a sensor interface or network of interfaces that utilizes high-temperature electronics to operate at elevated temperatures for applications that include but are not limited to aircraft and automobile engines, vehicle frames, refineries, nuclear and chemical production plants
The present invention is a sensor interface or network of interfaces that utilizes high-temperature electronics to operate at elevated temperatures for applications that include but are not limited to aircraft and automobile engines, vehicle frames, refineries, nuclear and chemical production plants, and in downhole drilling for petroleum and natural gas. The interface or network provide connectors for a variety of sensors with analog and digital outputs, and can in turn provide data to an automated electronic control system or a monitor. Because the sensor interface may be placed in so-called “hot zones” nearer to the sensors being monitored than other systems that use conventional electronics, the sensor interface can increase noise immunity, increase reliability, decrease cost, reduce weight, and increase space.
대표청구항▼
1. A sensor network comprising at least two sensors having analog signals; andat least two sensor interfaces each comprisingat least one sensor connector for connecting one of the at least two sensors having analog signals;one or more electrical components capable of operating at temperatures greate
1. A sensor network comprising at least two sensors having analog signals; andat least two sensor interfaces each comprisingat least one sensor connector for connecting one of the at least two sensors having analog signals;one or more electrical components capable of operating at temperatures greater than at least 135° C. for analyzing and digitally converting the analog signal of at least one sensor;a communication device for transmitting the modified and digitally converted signal; anda common communication pathway for transmitting the modified and digitally converted signals from both of the at least two sensors. 2. The sensor network of claim 1, wherein the electrical components are capable of operating at temperatures greater than at least 200° C. 3. The sensor network of claim 1, wherein the electrical components are capable of operating at temperatures greater than at least 275° C. 4. The sensor network of claim 1, wherein the common communication pathway is a CAN bus. 5. The sensor network of claim 1, wherein the common communication pathway is optical fiber. 6. The sensor network of claim 1, wherein the common communication pathway is a wireless RF link. 7. A sensor network comprising at least two sensors having analog signals; andat least two sensor interfaces connected by a common communication pathway, each sensor interface comprisingat least one universal sensor connector for connecting one of the at least two sensors having analog signals or a set of fully integrated connectors capable of connecting to more than one type of sensor;one or more electrical components capable of reliably operating at temperatures greater than at least 200° C. and vibrations of 60 g's at a frequency of 4,000 Hz for analyzing and digitally converting the analog signal of at least one sensor; anda communication device for transmitting the modified and digitally converted signal;wherein the common communication pathway is for transmitting the modified and digitally converted signals from both of the at least two sensors, and the common communication pathway is further connected to a controller or monitor. 8. The sensor network of claim 7, wherein the electrical components are capable of reliably operating at temperatures greater than at least 260° C. and at vibrations of 150 g's at a frequency of 7,500 Hz. 9. The sensor network of claim 7, wherein the controller or monitor is a FADEC. 10. The sensor network of claim 7, wherein the universal sensor connector or set of fully integrated connectors are capable of connecting at least to an LVDT, a resolver, a thermocouple, an engine speed sensor, an airspeed sensor, and an RTD, and a strain gauge. 11. The sensor network of claim 7, wherein the universal sensor connector or set of fully integrated connectors are capable of connecting at least to a vibration sensor, an oil level sensor, and a 2-wire VDT sensor. 12. The sensor network of claim 7, wherein the universal sensor connector or set of fully integrated connectors are capable of connecting at least to a flame-out/light-off detector, an oil debris monitor, and an eddy current sensor. 13. The sensor network of claim 7, wherein at least one of the sensor interfaces is capable of being connected to at least 16 sensors.
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이 특허에 인용된 특허 (8)
Pedraza,Mark A.; Lubeski,Richard G.; O'Connell,Mark A., Apparatus, system and method for monitoring a drying procedure.
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