IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0474938
(2012-05-18)
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등록번호 |
US-8663537
(2014-03-04)
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발명자
/ 주소 |
- Stensvad, Karl K.
- Rendon, Stanley
- Martinson, Paul A.
- Kidane, Samuel
- Herdtle, Thomas
|
출원인 / 주소 |
- 3M Innovative Properties Company
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
3 인용 특허 :
17 |
초록
A heatsink for use in injection molding, with at least one load-bearing path with a rearward segment, wherein at least a portion of at least one non-load-bearing, dynamic heat-transfer zone of the heatsink is laterally offset from the rearward segment of the load-bearing path.
대표청구항
▼
1. An apparatus for use in injection molding, comprising: a heatsink with a main body with a base, and with a front side and a rear side and a front-rear axis and lateral axes, and with at least one load-bearing path that extends generally parallel to the front-rear axis of the heatsink so as to int
1. An apparatus for use in injection molding, comprising: a heatsink with a main body with a base, and with a front side and a rear side and a front-rear axis and lateral axes, and with at least one load-bearing path that extends generally parallel to the front-rear axis of the heatsink so as to intersect a molding surface on the front side of the heatsink and that comprises at least a frontward segment and a rearward segment;wherein at least a portion of at least one non-load-bearing, dynamic heat-transfer zone of the rear side of the heatsink is laterally offset from the rearward segment of the load-bearing path;and wherein the dynamic heat-transfer zone comprises dynamic heat-transfer fins that extend generally rearward from the base of a main body of the heatsink and that collectively comprise a dynamic heat-transfer surface area, and wherein the main body of the heatsink comprises a total thermal volume, and wherein the ratio of the dynamic heat-transfer surface area to the total thermal volume is at least 1 cm2/cm3. 2. The apparatus of claim 1 wherein the rearward segment of the load-bearing path is laterally surrounded by portions of the at least one non-load-bearing, dynamic heat-transfer zone of the rear side of the heatsink. 3. The apparatus of claim 1 wherein the at least one load-bearing path is a plurality of load-bearing paths, and wherein each rearward segment of each load-bearing path is a discrete load-bearing path segment that is separated from neighboring discrete load-bearing path segments by portions of the dynamic heat-transfer zone of the heat sink. 4. The apparatus of claim 3 wherein each discrete rearward segment of each load-bearing path is provided by a load-bearing member that is attached to a main body of the heatsink. 5. The apparatus of claim 4 wherein the material of which each load-bearing member is made has a thermal conductivity that is lower than the thermal conductivity of the material of which the main body of the heatsink is made, by at least 30%. 6. The apparatus of claim 5 wherein at least a forwardmost portion of each load-bearing member is positioned within a rearwardly-open-ended receptacle that is at least partially defined by a non-load-bearing hollow sleeve that protrudes rearwardly from the main body of the heatsink and that is integral with the main body of the heatsink. 7. The apparatus of claim 1 wherein the ratio of the dynamic heat-transfer surface area of the heatsink to the total thermal volume of the main body of the heatsink is at least 4 cm2/cm3. 8. The apparatus of claim 7 wherein at least some of the dynamic heat-transfer fins comprise a height-to-thickness aspect ratio of at least 3:1. 9. The apparatus of claim 3 wherein the at least one dynamic heat-transfer zone comprises a first dynamic heat-transfer region that is located radially outward from the plurality of discrete load-bearing path segments, and a second dynamic heat-transfer region that is located radially inward from the plurality of discrete load-bearing path segments, and a third dynamic heat-transfer region that is radially sandwiched in between the first and second dynamic heat-transfer regions and along which the plurality of discrete load-bearing path segments are circumferentially spaced. 10. The apparatus of claim 1 wherein the molding surface of the front side of the heatsink comprises a projected area, and wherein the rearward segment of the load-bearing path comprises a projected area that is at least about 80% of the projected area of the molding surface. 11. The apparatus of claim 1 wherein the molding surface of the front side of the heatsink comprises a projected area, and wherein the rearward segment of the load-bearing path comprises a projected area that overlaps 100% of the projected area of the molding surface. 12. The apparatus of claim 1 wherein the front side of the heatsink comprises at least one static heat-transfer zone. 13. The apparatus of claim 12 wherein the at least one static heat-transfer zone comprises a plurality of discrete receptacles that are recessed rearward into a front side of a main body of the heatsink and that are each configured to exchange thermal energy with a static heating and/or cooling element that is positioned in the receptacle in intimate thermal contact with a surface of the main body of the heatsink. 14. The apparatus of claim 13 wherein the static heating and/or cooling elements are electrical-resistance heating elements. 15. The apparatus of claim 1 wherein the at least one load-bearing path is a plurality of load-bearing paths, and wherein the front side of the heatsink comprises a plurality of discrete molding surfaces each of which is intersected by a separate load-bearing path of the plurality of load-bearing paths of the heatsink. 16. The apparatus of claim 15 wherein each of the discrete molding surfaces is individually located on one of a plurality of discrete bosses that protrudes forwardly from a front side of a main body of the heatsink, each of which boss is a part of a frontward segment of a load-bearing path of the heatsink. 17. The apparatus of claim 16 wherein the front side of the heatsink comprises a static heat-transfer zone comprising a plurality of discrete receptacles that are recessed rearward into a front side of the main body of the heatsink and that are each configured to exchange thermal energy with a static heating and/or cooling element positioned in the receptacle in intimate thermal contact with a surface of the main body of the heatsink, and wherein the receptacles of the plurality of receptacles are circumferentially interspersed with the bosses of the plurality of discrete bosses. 18. The apparatus of claim 15 wherein each of the discrete molding surfaces is provided by a forward-facing molding surface of a cavity insert that is individually positioned on the front side of the main body of the heatsink. 19. The apparatus of claim 18 further comprising a frame that is positioned forward of the front side of the heatsink and that is attached to the heatsink so as to hold each cavity insert in position. 20. The apparatus of claim 1 wherein the at least one load-bearing path is a plurality of load-bearing paths, wherein each rearward segment of each load-bearing path is a discrete load-bearing path segment, and wherein the apparatus further comprises a heatsink support to which the heatsink is attached so that discrete, rear-facing surfaces of the rear side of the heatsink, each of which is part of a rearward, discrete load-bearing path segment of the heatsink, each contact a forward-facing surface of the heatsink support to provide a load-bearing interface therebetween. 21. The apparatus of claim 20 wherein each discrete, rear-facing surface of the rear side of the heatsink is provided by a rear-facing surface of a load-bearing member, which load-bearing member is attached to the rear side of a main body of the heatsink and is made of a material with a thermal conductivity that is lower than the thermal conductivity of the material of which the main body of the heatsink is made, by at least 30%. 22. The apparatus of claim 21 wherein the rear-facing surfaces of the plurality of load-bearing members collectively provide a load-bearing contact area with the heatsink support, and wherein the ratio of the dynamic heat-transfer surface area of the heatsink to the total load-bearing contact area of the load-bearing members is at least 20. 23. The apparatus of claim 1 wherein the molding surface comprises at least one microfeature-molding subcavity. 24. The apparatus of claim 1 wherein the molding surface comprises at least one subcavity with an aspect ratio of at least about 4:1. 25. The apparatus of claim 1 wherein the heatsink is supported by a first platen and provides a first mold component with at least one first molding surface, and wherein the apparatus further comprises a second platen that comprises a second mold component with at least one second molding surface that combines with the at least one molding surface of the first mold component to at least partially define at least one mold cavity when the first platen and the second platen are brought together. 26. The apparatus of claim 25 wherein the first platen is stationary and the second platen is movable toward the first platen into a first position in which the at least one mold cavity is defined, and away from the first platen into a second position in which a molded part can be removed from the mold cavity. 27. The apparatus of claim 26 wherein the at least one mold cavity is a plurality of discrete mold cavities and heatsink comprises at least one through-hole configured to allow a molten resin injection system to insert molten resin therethrough, and wherein the second mold component comprises runners through which the injected molten resin can be divided and distributed into the discrete molding cavities. 28. A method of injection molding, comprising: providing a first platen that comprises a first mold component comprising a heatsink with a main body with a base, and with a front side and a rear side and a front-rear axis and lateral axes, and with at least one load-bearing path that extends generally parallel to the front-rear axis of the heatsink so as to intersect an at least one first molding surface on the front side of the heatsink and that comprises at least a frontward segment and a rearward segment; wherein at least a portion of at least one non-load-bearing, dynamic heat-transfer zone of the rear side of the heatsink is laterally offset from the rearward segment of the load-bearing path;and wherein the dynamic heat-transfer zone comprises dynamic heat-transfer fins that extend generally rearward from the base of a main body of the heatsink and that collectively comprise a dynamic heat-transfer surface area, and wherein the main body of the heatsink comprises a total thermal volume, and wherein the ratio of the dynamic heat-transfer surface area to the total thermal volume is at least 1 cm2/cm3;heating the heatsink so as to cause the at least one first molding surface to be brought to a first, high temperature;bringing a second platen together with the first platen, into a first position in which the at least one molding first surface of the first mold component, and at least one second molding surface of a second mold component supported by the second platen, combine to define at least one mold cavity that intersects the at least one load-bearing path of the heatsink;injecting molten resin into the at least one mold cavity;dynamically cooling the heatsink so as to cause the at least one first molding surface to be brought to a second, low temperature that is lower than the first, high temperature by at least 10 degrees C.;allowing the resin within the at least one mold cavity to cool and solidify to form a molded part; and,moving the first and second platens away from each other into a second position in which the molded part can be removed from the mold cavity. 29. The method of claim 28 wherein the front side of the heatsink comprises at least one static heat-transfer zone and wherein the step of heating of the heatsink is performed by one or more static heaters that are in intimate thermal contact with the heatsink. 30. The method of claim 29 wherein the at least one non-load-bearing, dynamic heat-transfer zone of the rear side of the heatsink is used only for cooling the heatsink and not for heating the heatsink. 31. The method of claim 30 wherein the step of dynamically cooling the heatsink is begun during the time that the step of using the at least one static heater to heat the heatsink is still in progress. 32. The method of claim 28 wherein the at least one non-load-bearing, dynamic heat-transfer zone of the rear side of the heatsink is used for both cooling and heating the heatsink. 33. The method of claim 28 wherein the step of bringing the second platen together with the first platen into the first position to form the mold cavity is performed after the at least one first molding surface is heated to at least the first, high temperature. 34. The method of claim 28 wherein the second mold component is controlled to a nominally constant temperature that is at least 10 degrees C. lower than the second, low temperature of the at least first molding surface of first mold component.
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